XC6SLX75-2FG484I vs XC6SLX75-2FGG484I Comparaison
Comparaison détaillée côte à côte de XC6SLX75-2FG484I par AMD et XC6SLX75-2FGG484I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC6SLX75-2FG484I | XC6SLX75-2FGG484I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $82,10 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX | — |
| Manufacturer | AMD / Xilinx | — |
| Logic Elements | 74,637 LE | — |
| Logic Blocks | 5,831 | — |
| Internal Frequency | 667 MHz | — |
| I/O Count | 280 I/O | — |
| Package Type | FCBGA-484 / 484-BBGA | — |
| Number of Terminals | 484 balls | — |
| Package Dimensions | 23 mm x 23 mm | — |
| Ball Pitch | 1 mm | — |
| Package Outline | MS-034 | — |
| Speed Grade | -2 | -2 (mid-range) |
| Temperature Grade | Industrial | — |
| Température de fonctionnement | 0°C to +85°C (32°F to 185°F) | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Configuration Memory | [DATA_NEEDED: configuration memory capacity] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Device Family | — | Spartan-6 LX |
| Logic Cells | — | 74,637 |
| Logic Elements / Slices | — | 11,650 slices |
| System Gates | — | 3,170,304 |
| Block RAM | — | 4,824 Kbits (180 x 18 Kbit) |
| DSP Slices (DSP48A1) | — | 132 |
| User I/Os | — | 280 |
| Maximum Internal Frequency | — | 667 MHz |
| Process Technology | — | 45 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.14 V to 1.26 V |
| Auxiliary Supply Voltage (VCCAUX) | — | 3.3 V |
| Boîtier | — | 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C (junction to +125 °C) |
| Type de montage | — | Surface Mount (BGA) |
| Niveau MSL | — | 3 (168 hours) |