XC7Z100-1FF900I vs XC7Z100-2FFG900I Comparaison
Comparaison détaillée côte à côte de XC7Z100-1FF900I par AMD et XC7Z100-2FFG900I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
AMD
XC7Z100-2FFG900I - Zynq-7000 SoC, Kintex-7 FPGA, 444K Logic Cells | AMD
XC7Z100-2FFG900I ✓ ActifComparaison des spécifications
| Paramètre | XC7Z100-1FF900I | XC7Z100-2FFG900I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Product Type | Zynq-7000 system on chip | — |
| Processor Configuration | Dual Arm Cortex-A9 MPCore | — |
| Processor Operating Frequency | 667 MHz | — |
| FPGA Logic Cells | 444K logic cells | — |
| FPGA Architecture | Kintex-7 | — |
| Debug and Trace | CoreSight | — |
| Package Type | 900-FCBGA | — |
| Package Dimensions | 31 x 31 mm | — |
| Package Ball Count | 900 balls | — |
| Device Family | Zynq-7000 | Zynq-7000 All Programmable SoC |
| Architecture | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic | ARM Cortex-A9 dual-core MPCore + Kintex-7 FPGA |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| Maximum I/O Count | [DATA_NEEDED: maximum I/O count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Statut RoHS | RoHS | — |
| Type de montage | Surface mount | — |
| Manufacturer Qualification | [DATA_NEEDED: industrial or automotive qualification] | — |
| Logic Cells (PL) | — | 444K |
| Block RAM | — | 26.5 Mb |
| DSP Slices | — | 1540 (DSP48E1) |
| Processor Cores | — | 2x ARM Cortex-A9 MPCore with CoreSight |
| Max Processor Frequency | — | 800 MHz (up to 1 GHz with -3 speed grade) |
| Transceivers | — | 16x GTX up to 6.25 Gb/s |
| PCIe Hard Blocks | — | 4x Gen2 (Root Complex or Endpoint) |
| Memory Interfaces | — | DDR3, DDR3L, DDR2, LPDDR2 (16-bit and 32-bit; ECC on PS side) |
| Ethernet MACs | — | 2x 10/100/1000 Mbps GEM |
| USB | — | 2x USB 2.0 OTG |
| Security | — | AES, SHA-256, RSA, secure boot, JTAG disable |
| ADC | — | Dual 12-bit 1 MSPS XADC |
| Température de fonctionnement | — | -40C to +100C (Industrial) |
| Boîtier | — | 900-ball FCBGA (FFG) 31x31 mm |
| Speed Grade | — | -2 (mid-performance) |
| Temperature Grade | — | I (Industrial) |