10CL040ZF484I8G - Cyclone 10 LP FPGA 40K LE | Altera | 484-BGA
Référence : 10CL040ZF484I8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $92.5 | $92,50 |
| 10 | $84.2 | $842,00 |
| 100 | $76.8 | $7 680,00 |
| 250 | $71.4 | $17 850,00 |
| 500 | $66.9 | $33 450,00 |
10CL040ZF484I8G Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks, DSP blocks, and hardened I/O serdes/PLLs that the user programs after manufacturing to implement custom digital functions. FPGAs sit at the top of the programmable-logic hierarchy (programmable logic device -> CPLD -> FPGA -> SoC FPGA), bridging the gap between fixed-function ASICs and software-defined microcontrollers by offering hardware-level parallelism for high-throughput, low-latency workloads such as signal processing, machine-vision pipelines, and protocol bridging.
Key features of the 10CL040ZF484I8G include a logic-element count of 39,600, 1,161,216 bits (approximately 144 Kbytes) of embedded SRAM distributed across M9K memory blocks, 56 embedded 18x18 multipliers for fixed- and floating-point DSP, four general-purpose PLLs, and a maximum user I/O count of 325 pins. It supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and is fabricated on a low-power 60 nm process optimized for static and dynamic power reduction.
Architecturally, the device shares its fabric with the broader Cyclone 10 LP family, leveraging a register-rich logic element, dedicated hardware multipliers, and column-based memory blocks that are stitched together by a multi-tier routing fabric. The low-power process and architectural refinements (e.g., programmable power technology) yield significantly lower dynamic power than the previous-generation Cyclone IV family at comparable performance.
Typical applications include industrial motor control, machine-vision camera interfaces, video bridging (BT.656/HDMI/DVI), human-machine interface (HMI) panels, low-cost software-defined radio front ends, and I/O expansion/protocol conversion in factory automation. The wide I/O count also makes it suitable for prototyping ASICs before mask commitment.
When designing with this device, pay careful attention to power-rail sequencing (VCCINT must ramp before VCCA), decoupling strategy, and Quartus Prime device selection. The 484-BGA package requires a 4- or 6-layer PCB with controlled-impedance routing for LVDS and external memory interfaces.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone 10 LP family, and practical design notes not aggregated in the manufacturer datasheet.
Alternatives de remplacement direct pour 10CL040ZF484I8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL040ZF484I8G (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Family, Maximum User I/O, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL040YF484I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$29.74 / unité
Voir la fiche technique →10CL040YF484C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$39.8 / unité
Voir la fiche technique →10CL040YF484C6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$108.25 / unité
Voir la fiche technique →10CL040YU484I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$48.75 / unité
Voir la fiche technique →10CL040YU484C8G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$32.4 / unité
Voir la fiche technique →10CL040ZF484I8G Valeurs maximales et caractéristiques électriques
| Family | Cyclone® 10 LP |
| Logic Elements | 39,600 |
| Embedded Memory | 1,161,216 bits (144 Kbytes) |
| Embedded 18x18 Multipliers | 56 |
| General-Purpose PLLs | 4 |
| Maximum User I/O | 325 |
| Process Technology | Low-power 60 nm |
| Boîtier | 484-ball FineLine BGA (UB484 / F484) |
| Speed Grade | -8 |
| Température de fonctionnement | -40°C to +100°C (Industrial) |
| Core Voltage (VCCINT) | 1.0 V (typical) |
| I/O Voltage Standards | LVDS, LVCMOS, SSTL, HSTL |
| Configuration Scheme | AS, PS, JTAG, FPP |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du 10CL040ZF484I8G 484-ball fineline bga (ub484 / f484)
Configuration des broches du 10CL040ZF484I8G (boîtier 484-ball fineline bga (ub484 / f484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10CL040ZF484I8G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10CL040ZF484I8G convient pour 6 applications: Industrial Motor Control (FOC), Machine Vision Camera Interface, Video Format Conversion & Bridging, Human-Machine Interface (HMI) Panels, I/O Expansion & Protocol Conversion, ASIC Prototyping & Pre-Silicon Validation.
Industrial Motor Control (FOC)
The 10CL040ZF484I8G is well-suited to Field-Oriented Control (FOC) of PMSM and AC induction motors. Its 56 embedded 18x18 hardware multipliers accelerate the Park, Clarke, and inverse-Park transforms that drive torque-ripple reduction, while 144 Kbytes of embedded M9K memory serves as a coefficient lookup table for space-vector modulation. The industrial -40C to +100C temperature grade and 325 user I/O pins handle QEP encoder feedback, Hall sensors, three-phase PWM outputs, and EtherCAT/CAN/RS-485 peripherals on a single device. This integration eliminates an external DSP, reducing BOM cost and PCB area.
Recommandé
Machine Vision Camera Interface
The 10CL040ZF484I8G bridges parallel CMOS sensors and MIPI CSI-2 / LVDS streams into host processors via USB 3.0 or GigE Vision. Its 56 multipliers accelerate Bayer demosaicing, edge detection, and histogram equalization in real time, while the 144 Kbytes of M9K SRAM implement dual-port line buffers for image pipelines up to 1080p60. The 325 user I/O accept wide parallel sensor buses, and four PLLs generate pixel-clock, serialization, and reference clocks. The 484-BGA package supports controlled-impedance routing required for LVDS links.
Recommandé
Video Format Conversion & Bridging
The 10CL040ZF484I8G converts between BT.656, HDMI, DVI, DisplayPort, and LVDS video formats at resolutions up to 1080p60. Its 39,600 logic elements implement color-space conversion (RGB<->YUV), chroma upsampling, and timing-controller state machines, while 56 DSP blocks handle scaling and deinterlacing filters. The 325 user I/O pins expose sufficient LVDS pairs for HDMI/DVI TMDS links and 24-bit parallel RGB buses. Industrial temperature grade makes it suitable for medical imaging displays and digital signage.
Recommandé
Human-Machine Interface (HMI) Panels
The 10CL040ZF484I8G drives TFT LCD panels in industrial HMI terminals while simultaneously handling touch-controller interfaces, keypad scanning, and Modbus/Profibus communications. Its 39,600 logic elements implement a soft 32-bit Nios II processor for HMI logic, while 144 Kbytes of M9K memory cache frame buffers for animated icons. The 325 user I/O pins connect 24-bit RGB panels, capacitive touch controllers, and isolated RS-485 transceivers. Industrial temperature grade supports factory-floor and outdoor cabinet installations.
Recommandé
I/O Expansion & Protocol Conversion
The 10CL040ZF484I8G acts as a protocol-conversion bridge between legacy industrial buses (RS-232/485, parallel GPIO, I2C, SPI) and modern interfaces (EtherCAT, PROFINET, USB, Ethernet). Its 325 user I/O pins absorb the wide bus widths of legacy PLC backplanes, while 56 multipliers implement any required CRC-32 or polynomial encoding in hardware. The four PLLs regenerate clean clocks from noisy industrial backplanes. Industrial temperature grade and BGA package suit ruggedized DIN-rail mounted controllers.
Recommandé
ASIC Prototyping & Pre-Silicon Validation
The 10CL040ZF484I8G is used as a verification vehicle for mid-complexity ASICs before mask commitment. Its 39,600 logic elements and 56 multipliers accommodate representative SoC subsystems including AMBA AHB/APB bus fabrics, DDR3 memory controllers, and standard peripheral cores. Quartus Prime's LogicLock regions and SignalTap II embedded logic analyzer accelerate bring-up. Industrial temperature grade allows prototype validation in real-world environments without an ASIC test-chip iteration.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL040ZF484I8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL040YF484I7G | 10CL040YF484C8G | 10CL040YF484C6G | 10CL040YU484I7G | 10CL040YU484C8G |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-ball BGA (F484) | 484-ball BGA (F484) - same | 484-ball BGA (F484) - same | 484-ball BGA (F484) - same | 484-ball BGA (U484) - same pin count, 0.8 mm pitch | 484-ball BGA (U484) - same pin count, 0.8 mm pitch |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits |
| DSP Multipliers (18x18) | 56 | 56 | 56 | 56 | 56 | 56 |
| Maximum User I/O | 325 | 325 | 325 | 325 | 278 | 278 |
| Speed Grade | -8 | -7 (faster) | -8 (same) | -6 (fastest) | -7 (faster) | -8 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
Principaux différenciateurs
- Highest user I/O count in the 484-BGA footprint at the -8 speed grade (vs 10CL040YU484I7G)
- Industrial temperature grade at the -8 speed grade - rare combination (vs 10CL040YF484C8G)
- Cost-optimized speed grade for non-fMAX-bound designs (vs 10CL040YF484I7G)
- Mature Quartus Prime IP ecosystem support (vs Lattice ECP5 (cross-vendor))
Notes de conception
Power-rail sequencing for the 10CL040ZF484I8G requires VCCINT (1.0 V core) to ramp up before VCCA (2.5 V analog) to avoid permanent device damage. Per the Cyclone 10 LP datasheet, use a tracked regulator such as the LTM4623 or Enpirion EN6337QI that supports ratiometric startup, or insert a Power-Good signal from the 1.0 V rail to the 2.5 V rail's enable pin. Decoupling requires 100 nF X7R capacitors on every power pin and four 47 uF bulk capacitors placed symmetrically under the BGA. Estimated: total decoupling network for the F484 package needs approximately 200 capacitors and 8 bulk caps to meet the recommended PDN impedance of <1 mOhm at 100 MHz.
The 484-ball BGA package dissipates most heat through the BGA balls into internal PCB copper planes. Without thermal vias, theta_JA exceeds 25 C/W, which is insufficient for the 10CL040ZF484I8G at full I/O toggle. Per Intel's thermal management guidelines, place a 4x4 array of 0.3 mm thermal vias under the central BGA cluster and connect them to a 2 oz copper inner-plane heat spreader. Estimated: with proper thermal vias and 4-layer 2 oz copper PCB, theta_JA drops to approximately 12 C/W, supporting 1.5 W continuous dissipation at 70C ambient.
Routing 325 user I/O out of a 1.0 mm pitch BGA demands a 6-layer PCB with 0.075 mm trace/space on the top two layers for breakouts, transitioning to 0.1 mm trace/space on inner layers. The Altera Cyclone 10 LP PCB design guidelines recommend dog-bone fan-out for the inner ball rows and via-in-pad for the center rows to escape on internal layers. Controlled-impedance routing (50 ohm single-ended, 100 ohm differential) is required for LVDS pairs and external memory interfaces; use a 0.2 mm stripline stack-up with the 1.0 V plane as reference. Power plane cuts under high-speed signals must be avoided to prevent impedance discontinuities.
LVDS and external DDR3 interfaces on the 10CL040ZF484I8G require matched-length routing within 50 mil for differential pairs and 100 mil for byte lanes. Use the Quartus Prime Fitter's pin planner to assign pins such that LVDS pairs are placed on the same I/O bank with matched drive strength and slew rate settings. For DDR3, terminate address/command/control with 50 ohm to VTT at the far end, and route data strobes (DQS) with the shortest matched length to their corresponding DQ byte. SignalTap II embedded logic analyzer is invaluable for verifying read/write margins during bring-up.
Three common pitfalls when designing with the 10CL040ZF484I8G: (1) configuring the wrong dual-purpose pins - shared configuration and GPIO pins must be assigned carefully in the Quartus Prime pin planner, otherwise JTAG or AS configuration may fail at power-up; (2) exceeding the maximum number of LVDS pairs per bank (typically 12) without derating the I/O voltage; (3) leaving MSEL[3:0] floating - these four pins select the configuration scheme (AS, PS, FPP, JTAG) and must be tied to VCCPGM or GND through 4.7 kOhm resistors. Always verify with the configuration scheme table in the Cyclone 10 LP datasheet before PCB layout.
Informations de conformité
RoHS and REACH compliance per Intel/Altera product declaration. Not AEC-Q100 qualified - for automotive applications use the automotive-grade Cyclone 10 LP variants or the Cyclone V family. Halogen-free and lead-free per JEDEC JESD47.
