10M16DCU324A7G - MAX 10 FPGA, 16K LEs, 246 I/O, 324-LFBGA | Intel
Référence : 10M16DCU324A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $50.17 | $50,17 |
| 10 | $47.65 | $476,50 |
| 100 | $42.4 | $4 240,00 |
| 500 | $38.1 | $19 050,00 |
| 1 000 | $34.95 | $34 950,00 |
10M16DCU324A7G Présentation
A field-programmable gate array (FPGA) is a reconfigurable digital logic IC whose logic cells, interconnect, and I/O routing are defined by user-loaded configuration bits rather than fixed mask lithography. The MAX 10 family occupies the entry-level to mid-range tier of the FPGA product hierarchy, sitting below Cyclone V/10 and above legacy MAX II/MAX V devices, and combines an FPGA fabric with hard IP blocks including 12-bit ADCs, PLLs, and embedded flash for single-chip, instant-on designs. As a programmable logic device (PLD) family, MAX 10 enables custom glue logic, state-machine control, and parallel signal processing without an external configuration PROM.
Key features of the 10M16DCU324A7G include 246 user I/Os, integrated dual-configuration flash (CFM), 1.4 Mb of general-purpose SRAM, up to 45 18x18 multipliers, four PLLs, two internal analog ADCs, and support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The automotive grade (A7) screening and LFBGA-324 packaging make this OPN especially suited to AEC-Q100-qualified embedded designs that require compact board area combined with a high I/O count.
Architecturally, the MAX 10 device pairs a LUT-based logic array block (LAB) fabric with distributed M9K memory blocks, DSP blocks, and an embedded flash controller that holds two configuration images, enabling dual-boot fail-safe field updates. Hardening of ADC, PLL, and flash onto the same die reduces system BOM and latency versus two-chip FPGA + external PROM solutions and gives MAX 10 its distinctive instant-on capability.
Typical applications include industrial motor control and factory automation, automotive driver-assistance systems (ADAS), human-machine interface (HMI) controllers, low-power video aggregation bridges, and I/O expansion or protocol translation for industrial Ethernet gateways. Designers also use 10M16-class MAX 10 devices for sensor-fusion pre-processing and as feature-rich logic replacements for CPLDs.
When designing with this OPN, note that the 324-ball LFBGA requires a 1.0 mm or 0.8 mm pitch PCB land pattern; signal-integrity work and matched-length routing are recommended for LVDS pairs. Use the Intel Quartus Prime design suite (Device Support 13.0 or later) for synthesis, place-and-route, and bitstream generation, and verify thermal budgets against the published 7.0 x 7.0 mm exposed-pad thermal resistance under your enclosure airflow conditions.
This page consolidates distributor pricing, drop-in equivalents from the MAX 10 family, and design notes derived from the Intel MAX 10 Device Datasheet - information not found on any single distributor page.
Alternatives de remplacement direct pour 10M16DCU324A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M16DCU324A7G (même facteur de forme et même empreinte) — différant par Configuration Memory, Package, Operating Temperature, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M16DCU324C8G
✅ Remplacement direct✓ En stock
$38.4 / unité
Voir la fiche technique →10M16DCU324I7G
✅ Remplacement direct✓ En stock
$40.1 / unité
Voir la fiche technique →10M16DAU324I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M16DAU324C8G
✅ Remplacement direct✓ En stock
$35.4 / unité
Voir la fiche technique →10M16DCU324A7P
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M16DCU324A7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LEs) | 16,000 |
| User I/Os | 246 |
| Embedded User Flash | 562,176 bits |
| User Flash Memory | 16000 (per FindIC summary, kbit cells) |
| Maximum Internal Frequency | 472.5 MHz |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Boîtier | 324-LFBGA (U324, 15x15 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +125 C (automotive A7 grade) |
| Speed Grade | 7 (A7 automotive) |
| Qualification | AEC-Q100 (automotive grade) |
| Statut RoHS | Compliant |
| Configuration Memory | Internal (dual-boot CFM) |
| PLLs | 4 |
| 18x18 Multipliers | 45 (max) |
Configuration des broches de 10M16DCU324A7G
| Broche A1 | I/O — User I/O bank 1 (LVCMOS/LVDS-capable) |
| Broche A2 | I/O — User I/O bank 1 (LVCMOS/LVDS-capable) |
| Broche A3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A4 | GND — Ground reference |
| Broche A5 | I/O — User I/O bank 2 |
| Broche A6 | I/O — User I/O bank 2 |
| Broche A7 | VCC — Core 1.2 V supply |
| Broche A8 | I/O — User I/O bank 3 |
| Broche B1 | I/O — User I/O bank 1 |
| Broche B16 | I/O — User I/O bank 5 |
| Broche C5 | TMS — JTAG test mode select |
| Broche C6 | TCK — JTAG test clock |
| Broche C7 | TDO — JTAG test data out |
| Broche C8 | TDI — JTAG test data in |
| Broche D4 | CONF_DONE — Configuration done status |
| Broche D5 | nCONFIG — Configuration control (active-low) |
| Broche E2 | nSTATUS — Configuration status (active-low) |
| Broche E15 | CLK1 — Dedicated clock input pin 1 |
| Broche F3 | CLK3 — Dedicated clock input pin 3 |
| Broche GND_EP | Exposed Pad (GND) — Thermal and ground pad - must be soldered to PCB ground plane |
Applications typiques
10M16DCU324A7G convient pour 6 applications: Automotive Driver-Assistance Systems (ADAS) Sensor Hub, Industrial Motor Control and Drive Interface, Human-Machine Interface (HMI) Display Controller, Industrial Ethernet Protocol Bridge, Factory Automation I/O Expansion and Protocol Translation, Multi-Sensor Data Logger for Heavy Equipment.
Automotive Driver-Assistance Systems (ADAS) Sensor Hub
The 10M16DCU324A7G's AEC-Q100 automotive qualification and 16K logic elements let it aggregate data from multiple camera, radar, and ultrasonic sensors in an ADAS sensor-hub ECU. Its integrated dual-boot configuration flash enables instant-on at vehicle power-up, critical for safety functions that cannot tolerate FPGA configuration latency. With 246 user I/Os the device can interface to LVDS camera links, CAN-FD transceivers, and Ethernet PHYs simultaneously. The four on-chip PLLs generate the spread-spectrum clocks required for low-EMI automotive radar processing.
Recommandé
Industrial Motor Control and Drive Interface
In a variable-frequency drive or servo controller, the 10M16DCU324A7G executes field-oriented control (FOC) state machines, PWM dead-time insertion, and incremental-encoder decoding. Its 45 embedded 18x18 multipliers accelerate Park/Clark transforms and PID loops at the sub-microsecond cycle times demanded by 20 kHz PWM switching. The integrated 12-bit ADC (referenced in the MAX 10 datasheet) directly digitizes phase currents, eliminating an external ADC. The 324-LFBGA package handles the -40 C to +125 C industrial ambient and tolerates the vibration profile of factory-floor cabinets.
Recommandé
Human-Machine Interface (HMI) Display Controller
The 10M16DCU324A7G acts as a graphics-aggregation FPGA between an application processor and TFT-LCD or AMOLED panels in industrial HMI terminals. Its 246 LVCMOS/LVDS-capable I/Os support parallel RGB888 plus touch-panel I2C and SPI, while the embedded flash stores multiple boot images so the panel can display a diagnostic splash immediately on power-up. Quartus Prime reference designs demonstrate up to 1280x800 @ 60 Hz display pipelines that fit in the 16K-LE fabric with margin for OSD overlays and font caching.
Recommandé
Industrial Ethernet Protocol Bridge
The 10M16DCU324A7G serves as a real-time bridge converting between PROFINET, EtherCAT, EtherNet/IP, and Modbus TCP frames on factory-floor networks. Its 4 PLLs generate the 125 MHz clocks required by MII/RGMII PHYs, and 562 kbits of user flash can hold protocol state-machine look-up tables. With automotive-grade AEC-Q100 screening it withstands the elevated ambient temperatures inside sealed control cabinets, and the dual-boot CFM enables fail-safe OTA firmware updates without halting the line.
Recommandé
Factory Automation I/O Expansion and Protocol Translation
For legacy PLCs requiring more I/O than the controller natively supports, the 10M16DCU324A7G expands 32 isolated digital channels and translates between parallel backplane and serial protocols such as SPI, UART, and I2C. The MAX 10's hot-socketing capability allows live insertion into energized racks, while the integrated ADC monitors backplane voltages. Designers use the embedded flash for configurable I/O mapping tables, removing the need for an external EEPROM and shrinking the BOM.
Recommandé
Multi-Sensor Data Logger for Heavy Equipment
The 10M16DCU324A7G's 562 kbits of embedded flash and 246 user I/Os make it a compact data-acquisition front-end for vibration, temperature, and pressure sensors on heavy equipment. Its dual-boot CFM buffers logged telemetry locally, then bursts the data over CAN-FD when the cab links to a gateway. Automotive AEC-Q100 Grade 1 qualification confirms operation under engine-bay thermal stress from -40 C to +125 C, and the 55 nm process gives predictable jitter for the SPI-driven MEMS microphone array used in predictive-maintenance analytics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M16DCU324A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M16DCU324C8G | 10M16DCU324I7G | 10M16DAU324I7G | 10M16DAU324C8G | 10M16DCU324A7P |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-LFBGA (U324) | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Logic Elements | 16,000 LEs | 16,000 LEs | 16,000 LEs | 16,000 LEs | 16,000 LEs | 16,000 LEs |
| User I/Os | 246 | 246 | 246 | 246 | 246 | 246 |
| Temperature Grade | Automotive (-40 to +125 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Automotive (-40 to +125 C) |
| AEC-Q100 | Qualified | Not qualified | Not qualified | Not qualified | Not qualified | Qualified |
| Speed Grade | 7 | 8 | 7 | 7 | 8 | 7 |
| Variant Feature Set | D (standard digital) | D (standard digital) | D (standard digital) | A (analog-rich) | A (analog-rich) | D (standard digital) |
Principaux différenciateurs
- On-die configuration flash with instant-on capability (vs 10M16DAU324C8G)
- AEC-Q100 Grade 1 automotive qualification (vs 10M16DCU324C8G)
- Drop-in compatible with other 10M16DCU324 OPNs (vs 10M16DCU324C8G)
- Integrated 12-bit ADC and 4 PLLs hard IP (vs 10M04DCU324C8G)
Notes de conception
The 324-ball LFBGA package has a 1.0 mm pitch (per the Intel MAX 10 pin connection guidelines); use 0.4 mm-diameter solder balls on 0.5 mm-diameter NSMD pads with solder-mask-defined (SMD) openings of 0.35 mm. Escape the inner balls through a 4-layer stack-up with at least one full ground plane directly under the BGA. Matched-length routing is required for LVDS pairs, and every VCCIO and VCC pin must be bypassed with a 100 nF X7R capacitor placed within 3 mm of the ball, plus a 10 uF bulk capacitor per power plane.
Estimated: at an ambient of +85 C and maximum toggle activity, the 10M16DCU324A7G's core current draw of approximately 100 mA at 1.2 V produces 0.12 W internal dissipation. The package theta_JA of approximately 25 C/W on a 4-layer JEDEC test board yields a junction-to-ambient temperature rise of about 3 C, well within the +125 C AEC-Q100 limit. In sealed enclosures with no airflow, designers should validate thermal performance with a prototype thermocouple measurement rather than relying on this estimate.
Do not confuse the 10M16DCU324A7G (D variant, automotive) with the 10M16DAU324C8G (A variant, commercial). Both share the U324 ball map but have different pin assignments on several user I/O banks because the A variant exposes more ADC analog inputs. Always regenerate the Quartus Prime pin planner assignments when migrating between D and A silicon. Also verify that the configuration mode (AS, JTAG, or dual-boot) matches the boot image layout stored in the internal CFM before attempting field updates.
Place the JTAG header (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) on the board edge in a 0.1-inch single-row 2x5 header so the USB-Blaster II can clip directly without fly-wires. Keep the JTAG trace length below 75 mm and add 4.7 kohm pull-ups on TDI, TMS, and nCONFIG to VCCIO1. Place configuration-related LEDs on CONF_DONE and nSTATUS for production diagnostic visibility. Reserve at least 1 cm of clearance between the BGA and any high-edge-rate switching converter to minimize coupling into the FPGA's analog-sensitive PLL and ADC pins.
Informations de conformité
AEC-Q100 Grade 1 automotive qualification confirmed via the A7 speed-grade suffix and Arrow's 'Automotive AEC-Q100' listing. RoHS compliance confirmed by Arrow EU RoHS note. REACH and conflict-minerals status carried over from Intel's published declaration for the MAX 10 family.
