10M40DCF256C8G - MAX 10 FPGA, 40K LE, 256-FBGA | Intel
Référence : 10M40DCF256C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95.2 | $95,20 |
| 10 | $89.1 | $891,00 |
| 100 | $82.4 | $8 240,00 |
| 500 | $76.3 | $38 150,00 |
| 1 000 | $71.8 | $71 800,00 |
10M40DCF256C8G Présentation
A field-programmable gate array (FPGA) is a programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits (ICs) > programmable logic > digital semiconductors. Unlike application-specific integrated circuits (ASICs), FPGAs allow designers to implement arbitrary digital logic, signal processing, and glue-logic functions after PCB fabrication. Modern non-volatile FPGAs such as MAX 10 additionally integrate a configuration flash memory on-die, removing the need for external boot PROMs and enabling instant-on behavior comparable to microcontrollers.
Key features of the 10M40DCF256C8G include 4-input look-up tables (LUT4) for combinatorial logic, embedded 18 × 18 multipliers for DSP operations, embedded SRAM blocks, phase-locked loops (PLLs) for clock management, and a hard ADC block unique to MAX 10 family. The -8 speed grade indicates the fastest commercial timing bin, while the C suffix denotes the commercial temperature range and the G suffix denotes a lead-free / RoHS-compliant Pb-free terminal finish. The 256-pin FBGA package supports high I/O density while maintaining a small footprint suitable for space-constrained industrial and consumer designs.
MAX 10 FPGAs are designed for system-level integration. They feature on-die flash for instant-on configuration, an integrated ADC for analog monitoring, and support for Nios II soft-core processors. The internal flash also supports dual-boot and remote upgrade, simplifying firmware updates in deployed equipment. These capabilities make MAX 10 suited to motor control, industrial I/O bridging, video processing pipelines, and protocol-conversion designs.
Typical applications include industrial control and factory automation, where the FPGA provides deterministic logic for PLCs and sensor aggregation; communications infrastructure, where it implements bridging between legacy and modern interfaces; automotive driver-assistance modules that require instant-on logic; consumer electronics that need flexible glue logic; and test & measurement equipment that requires reconfigurable DSP. The on-die ADC further enables system-level analog monitoring.
When designing with the 10M40DCF256C8G, pay attention to bank I/O voltage constraints (each I/O bank supports a single VCCIO), reference-clock pin assignment for PLL jitter performance, and JTAG chain ordering when programming multiple devices in series. Thermal performance in the 17 mm × 17 mm FBGA-256 package supports up to approximately 4 W without external heatsinking in still air. Quartus Prime (Intel/Altera) is the primary design tool, with free Quartus Prime Lite supporting this device.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the MAX 10 family and select Cyclone parts, and practical design notes not collated in the manufacturer datasheet.
Alternatives de remplacement direct pour 10M40DCF256C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M40DCF256C8G (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), Speed Grade, Embedded Memory (bits).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M40DCF256C7G
✅ Remplacement direct✓ En stock
$26.4 / unité
Voir la fiche technique →10M40DCF256A7G
✅ Remplacement direct✓ En stock
$21.8 / unité
Voir la fiche technique →10M40DAF256C8G
✅ Remplacement direct✓ En stock
$55.2 / unité
Voir la fiche technique →10M40DAF256C7G
✅ Remplacement direct✓ En stock
$46.83 / unité
Voir la fiche technique →10M40DAF256I7G
✅ Remplacement direct✓ En stock
$65.8 / unité
Voir la fiche technique →10M25DCF256C8G
✅ Remplacement direct✓ En stock
$24.95 / unité
Voir la fiche technique →10M40DCF256C8G Valeurs maximales et caractéristiques électriques
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 |
| Type de mémoire | Embedded SRAM (block RAM) |
| Number of I/O | 178 (MAX) |
| On-die Flash | Yes (non-volatile configuration) |
| Integrated ADC | Yes (MAX 10 family feature) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Speed Grade | -8 (fastest commercial) |
| Température de fonctionnement | 0 °C to 85 °C (TJ, commercial, C-suffix) |
| Boîtier | 256-FBGA (F256, 17 mm × 17 mm) |
| Type de montage | Surface Mount (BGA) |
| Terminal Finish | Lead-free / Pb-free (G suffix, RoHS) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Method | On-die flash (instant-on) |
| Design Tool | Intel Quartus Prime (Lite / Standard / Pro) |
| AEC-Q100 | Not qualified (use I-suffix variants for industrial) |
Guide de configuration des broches du 10M40DCF256C8G 256-fbga (f256, 17 mm × 17 mm)
Configuration des broches du 10M40DCF256C8G (boîtier 256-fbga (f256, 17 mm × 17 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M40DCF256C8G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M40DCF256C8G convient pour 6 applications: Industrial Motor Control, Communications Protocol Bridging, Factory Automation and PLC I/O, Video and Image Processing Pipelines, Test and Measurement Equipment, Automotive Infotainment / Driver-Assistance (Commercial Variants Only).
Industrial Motor Control
The 10M40DCF256C8G is well-suited to multi-axis industrial motor-control designs where deterministic logic, integrated ADC for current/voltage sensing, and instant-on configuration from on-die flash are required. Its 40,000 logic elements plus embedded 18×18 multipliers support field-oriented control (FOC) loops for two or more axes simultaneously, while the MAX 10's hard ADC samples shunt currents at >1 MSPS without an external analog front end. Compared to a microcontroller + external ADC approach, the FPGA delivers deterministic sub-microsecond loop times and parallel execution of commutation, protection, and communication tasks in a single package.
Recommandé
Communications Protocol Bridging
The 10M40DCF256C8G serves as a flexible bridge between legacy and modern communications interfaces (UART/SPI/I2C to GbE, custom protocols, or frame converters) in telecom and industrial-networking gear. With 178 user I/O and a 1.2 V core at 55 nm, the device supports multiple parallel interfaces concurrently while keeping power under approximately 1 W in typical bridging workloads. On-die flash enables remote firmware updates via the user-flash memory (UFM) subsystem, allowing deployed equipment to upgrade without service interruption - a key advantage over SRAM-based FPGAs that require external boot PROMs.
Recommandé
Factory Automation and PLC I/O
The 10M40DCF256C8G provides deterministic scan-time logic for compact PLCs, distributed I/O stations, and protocol-converter modules in factory-automation systems. Its 1,290,240 bits of embedded block SRAM buffer high-speed encoder/counter inputs and support cyclic data exchange over EtherCAT, PROFINET, or EtherNet/IP soft-macros. The MAX 10 family's integrated ADC also handles analog sensor monitoring (temperature, pressure, level) without external ADCs, reducing BOM cost. The 256-FBGA package fits within a 25 mm × 25 mm PCB module outline typical of DIN-rail-mounted field devices.
Recommandé
Video and Image Processing Pipelines
The 10M40DCF256C8G's embedded multipliers and block RAM implement real-time video processing pipelines (deinterlacing, scaling, color-space conversion, overlay blending) for industrial imaging, machine-vision cameras, and digital signage. With ~1.3 Mbit of block SRAM it can line-buffer one or two 720p video streams, while the 178 user I/O support parallel RGB, LVDS, or MIPI CSI-2 (with external serializer) interfaces. The 55 nm process delivers sufficient performance for entry-level 1080p60 processing; for higher resolutions or HDR pipelines, a Cyclone IV/V GX with transceivers is recommended instead.
Recommandé
Test and Measurement Equipment
The 10M40DCF256C8G delivers reconfigurable DSP and glue logic for entry-level bench instruments (logic analyzers, protocol analyzers, function generators). Its combination of logic elements, block RAM, and PLLs (per MAX 10 family datasheet) supports custom triggering, parallel data acquisition, and pattern generation. The on-die flash enables instant-on operation - useful for portable test gear that must power up and display results without delay. The integrated ADC handles low-speed analog measurements (1 MSPS+), although for high-bandwidth scopes external ADC + serializer + Cyclone V/10 GX is preferred.
Recommandé
Automotive Infotainment / Driver-Assistance (Commercial Variants Only)
While the C-suffix 10M40DCF256C8G is the commercial 0-85 °C variant, the same 256-FBGA footprint supports industrial- and automotive-grade MAX 10 variants for non-safety-critical driver-assistance and infotainment subsystems (rear-seat entertainment, instrument-cluster logic, sensor pre-processing). Designers should select the I-suffix industrial variant or AEC-Q100-qualified Cyclone V/10 GX parts for any safety-critical function. The 10M40DCF256C8G serves as a development platform that pin-migrates to the automotive-temp sibling 10M40DAF256I7G in the same FBGA-256 footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M40DCF256C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M40DCF256C7G | 10M40DAF256C8G | 10M40DAF256I7G | 10M25DCF256C8G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 256-FBGA (F256) | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same |
| Family | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 (-37.5%) |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 819,200 (-36.5%) |
| Speed Grade | -8 (fastest commercial) | -7 (slower) | -8 (same) | -7 (industrial) | -8 (same) |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to 100 °C (industrial) | 0 °C to 85 °C (commercial) |
| On-die Flash / ADC | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Principaux différenciateurs
- On-die non-volatile configuration flash (vs 10M25DCF256C8G (same family, lower density))
- Integrated ADC for system-level analog monitoring (vs 10M16DCF256C8G (smaller MAX 10 with same ADC))
- 40,000 LE for higher-density designs (vs 10M25DCF256C8G (25,000 LE in same F256 footprint))
Notes de conception
Estimated: at typical logic utilization (~50% LE, moderate toggle rate) the 10M40DCF256C8G draws roughly 0.4-0.8 W from the 1.2 V core supply. With VCCIO bank I/O voltages of 1.2/1.5/1.8/2.5/3.3 V (one rail per bank, per MAX 10 datasheet), unused banks should still be tied to a valid VCCIO rail rather than floated, and unused I/O should be set to 'weak pull-up' in the Quartus Pin Planner to minimize quiescent current.
The 256-FBGA package (F256) at 17 mm × 17 mm with a ground-bonded thermal pad supports approximately 4 W dissipation in still air without external heatsinking. For designs pushing 4+ W (high utilization + high toggle rate, e.g., 1080p video processing), provide a top-side thermal pad soldered to an inner copper plane, or a small BGA-pattern heatsink with thermal interface material. Junction temperature must remain below 125 °C for commercial operation.
Use a multi-layer PCB (at least 6 layers) with a continuous ground plane on layer 2 for the FBGA fan-out. Escape the 1.0 mm pitch BGA with micro-via-in-pad (stacked or staggered, 0.4 mm pad with 0.2 mm via) and route the inner-layer traces at 50 Ω controlled impedance for clock/differential pairs. Place 0.1 µF + 10 µF decoupling capacitors within 1-2 mm of each VCC pin, and a single bulk 47-100 µF near the regulator output. JTAG chain ordering matters when programming multiple devices in series - document the chain in a schematic-level diagram.
Do not confuse the MAX 10's on-die configuration flash (instant-on, single-chip) with Cyclone IV/V SRAM-based FPGAs that require an external EPCS/EPCQ boot PROM. Also, the MAX 10 has no transceivers - if your design needs multi-Gbps SERDES (PCIe, GbE SGMII, HDMI TMDS), move to Cyclone IV GX/V, Cyclone 10 GX, or Lattice ECP5. Finally, always re-run the Quartus Prime Fitter with timing constraints across all corners (slow 85 °C model, fast 0 °C model) before signing off the design - the -8 speed grade margin is not infinite.
Informations de conformité
G suffix in the order code indicates lead-free (Pb-free) terminal finish, consistent with the RoHS-compliant 256-FBGA package. Commercial temperature range (C suffix) only; use I-suffix variants (e.g., 10M40DAF256I7G) for industrial temperatures or where AEC-Q100 qualification is required. Halogen-free status not stated in the retrieved web snippets and is recorded as 'unknown'.
