10M40DCF672C8G - MAX 10 40K LE FPGA 672-BGA | Intel
Référence : 10M40DCF672C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82.75 | $827,50 |
| 100 | $74.2 | $7 420,00 |
| 500 | $66.9 | $33 450,00 |
| 1 000 | $60.4 | $60 400,00 |
10M40DCF672C8G Présentation
What is a MAX 10 FPGA? MAX 10 is Intel's non-volatile FPGA family that combines traditional FPGA logic fabric with built-in flash configuration memory, hardened analog blocks (ADC), and instant-on capability. It sits in the hierarchy: programmable logic device (PLD) -> FPGA -> non-volatile FPGA -> low-density logic-integration FPGA -> system-on-chip building block. This category targets glue-logic replacement, I/O expansion, and bridge functions in industrial, automotive, and consumer systems where cost, board area, and instant-on behavior matter more than the highest logic density.
Key specifications of the 10M40DCF672C8G include 40,000 logic elements, 1,290 Kbits (M9K) embedded RAM, 4 PLLs, 2 hard memory controllers, 2 integrated 12-bit ADCs, and 500 maximum user I/Os. The -8 speed grade denotes the fastest commercial speed bin. Logic density, embedded flash, and on-chip analog make the part a single-chip alternative to CPLD-plus-microcontroller or CPLD-plus-external-ADC designs.
Architecturally, MAX 10 devices use a TSMC 55nm embedded flash process and a look-up-table (LUT) based logic array with routing fabric. Hardened IP blocks include the ADC subsystem, PLLs, and DDR3/LPDDR2 memory controllers. Internal configuration flash is accessed through a JTAG, AS, or JTAG-driven in-system programming interface, allowing field updates without external storage.
Typical applications include industrial motor control and sensor aggregation, factory automation bridges (e.g., I2C/SPI/UART to Ethernet gateways), video/display interface conversion, automotive infotainment and ADAS I/O expansion, and portable medical instrument front-end logic. The integrated dual ADC enables direct temperature, voltage, and current monitoring without external ADCs.
Designers should evaluate whether 500 user I/Os, 40K LEs, and 1.29 Mbit of block RAM are sufficient headroom for their pipeline. Quartus Prime is the supported design entry and synthesis toolchain, with free Lite Edition supporting the full MAX 10 family. The 672-pin FBGA requires a 4-layer or higher PCB with microvia construction for breakout routing.
This page combines distributor pricing, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers compare options and qualify a replacement quickly.
Alternatives de remplacement direct pour 10M40DCF672C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M40DCF672C8G (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Speed Grade, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M40DCF672C7G
✅ Remplacement direct✓ En stock
$83.57 / unité
Voir la fiche technique →10M40DAF672C8G
✅ Remplacement direct✓ En stock
$86.1 / unité
Voir la fiche technique →10M40DAF672C7G
✅ Remplacement direct✓ En stock
$67.2 / unité
Voir la fiche technique →10M40DAF672I7G
✅ Remplacement direct✓ En stock
$65.85 / unité
Voir la fiche technique →10M25DCF672C8G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M25DCF672C7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M40DCF672C8G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory (M9K blocks) | 1,290,240 bits (1,290 Kbit) |
| Maximum User I/Os | 500 |
| PLLs | 4 |
| Hard Memory Controllers | 2 (DDR3/LPDDR2) |
| Integrated ADC | 2 x 12-bit SAR |
| Configuration Memory | Internal dual-configuration flash |
| Process Technology | 55 nm TSMC embedded flash |
| Speed Grade | -8 (fastest commercial) |
| Boîtier | 672-ball FBGA (F672) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | 0 C to +85 C (Commercial) |
| Supply Voltage (Core) | 1.2 V |
| Statut RoHS | Compliant |
| Programming Interface | JTAG / Active Serial (AS) |
Guide de configuration des broches du 10M40DCF672C8G 672-ball fbga (f672)
Configuration des broches du 10M40DCF672C8G (boîtier 672-ball fbga (f672)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M40DCF672C8G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M40DCF672C8G convient pour 6 applications: Industrial Motor Control, Industrial Sensor Aggregation & Bridges, Display & Video Interface Conversion, Automotive Infotainment & ADAS I/O Expansion, Portable Medical Instrumentation, Test & Measurement Front-End Logic.
Industrial Motor Control
The 10M40DCF672C8G is well-suited for industrial motor control applications. Its 40,000 logic elements support encoder decoding (QEP, SSI), space-vector PWM generation, and field-oriented control state machines. The two integrated 12-bit ADCs sample phase currents directly without external ADCs, while four PLLs synthesize motor-switching frequencies from a single reference. Combined with the 672-FBGA package's 500 user I/Os, the device handles multi-axis BLDC, stepper, and servo-drive designs. Compared with a discrete CPLD-plus-microcontroller solution, MAX 10 consolidates logic, ADC, and configuration into one non-volatile chip, reducing BOM and improving reliability in harsh industrial environments.
Recommandé
Industrial Sensor Aggregation & Bridges
The 10M40DCF672C8G serves as an aggregation gateway between I2C, SPI, UART, and Ethernet-based fieldbuses in factory automation. With 500 user I/Os, the device can host dozens of sensor interfaces simultaneously while the 1,290 Kbit of block RAM buffers high-rate data bursts. The MAX 10's instant-on flash configuration means the bridge is operational within milliseconds of power-up, which is critical in time-sensitive PROFINET or EtherCAT networks. Industrial temperature variants (-40 to +100 C) such as the 10M40DAF672I7G share the same pinout for harsher environments. Compared with discrete MCU-plus-CPLD designs, the integrated ADC enables additional analog monitoring on the same board.
Recommandé
Display & Video Interface Conversion
The 10M40DCF672C8G is frequently used for video bridging tasks such as RGB-to-LVDS, MIPI-DSI adaptation, and parallel-CSI-2 aggregation in industrial HMIs and infotainment panels. The 40K LEs accommodate line buffers and color-space converters, while 500 user I/Os handle wide parallel video buses. Hard DDR3 memory controllers allow frame-buffer use of external SDRAM, and the integrated ADC can read touchscreen or backlight feedback. Designers porting from older Cyclone III/IV designs find the MAX 10 an attractive migration path thanks to instant-on boot and reduced board complexity. Compared with ASSPs, the FPGA offers field-upgradeable protocols.
Recommandé
Automotive Infotainment & ADAS I/O Expansion
The 10M40DCF672C8G is used in automotive infotainment and ADAS ECUs to expand I/O and accelerate signal conditioning. 500 user I/Os accommodate multiple camera inputs, CAN-FD bus interfaces, and LVDS display links. The on-chip dual-configuration flash supports A/B firmware updates and rollback, essential for functional-safety requirements. While the commercial -8 grade targets in-cabin environments, industrial-temperature variants such as the 10M40DAF672I7G extend coverage to under-hood zones. Compared with microcontrollers, MAX 10 provides deterministic parallel processing for sensor fusion front-ends and reduces host CPU load.
Recommandé
Portable Medical Instrumentation
The 10M40DCF672C8G is suitable for portable patient-monitoring and diagnostic-instrument front-ends. The integrated 12-bit ADC digitizes ECG, SpO2, and temperature signals without an external converter, reducing board area in handheld devices. Dual-configuration flash enables redundant firmware images for safety-critical boot, and instant-on behavior supports fast clinician-power-up. The 40K LEs implement filtering, feature extraction, and bus-bridging tasks. Compared with ASIC-based designs, the MAX 10 reduces NRE cost and supports late-stage protocol changes. Designers typically pair it with a low-power MCU host for display and wireless functions.
Recommandé
Test & Measurement Front-End Logic
The 10M40DCF672C8G is widely deployed in test and measurement equipment such as bench oscilloscopes, logic analyzers, and protocol testers. The 500 user I/Os handle multi-channel sampling and trigger distribution, while 1,290 Kbit of block RAM implements deep acquisition buffers. The integrated ADC supports auxiliary analog monitoring of temperature and rail voltage. Quartus Prime IP libraries offer JESD204B, I2C, SPI, and UART cores that shorten development cycles. Compared with discrete FPGA-plus-PROM designs, the MAX 10's on-chip flash configuration reduces bill-of-materials count and improves field-upgrade reliability for production tester fleets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M40DCF672C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M40DCF672C7G | 10M40DAF672C8G | 10M40DAF672C7G | 10M25DCF672C8G |
|---|---|---|---|---|---|
| Package | 672-ball FBGA (F672) | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same | 672-ball FBGA (F672) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 (-37.5%) |
| Speed Grade | -8 (fastest commercial) | -7 | -8 | -7 | -8 |
| Configuration Flash | Dual | Dual | Single | Single | Dual |
| Embedded Memory | 1,290 Kbit | 1,290 Kbit | 1,290 Kbit | 1,290 Kbit | 675 Kbit (-47.7%) |
| Maximum User I/Os | 500 | 500 | 500 | 500 | 380 |
| Integrated ADC | 2 x 12-bit SAR | 2 x 12-bit SAR | 2 x 12-bit SAR | 2 x 12-bit SAR | 2 x 12-bit SAR |
| Temperature Grade | Commercial (0 to +85 C) | Commercial | Commercial | Commercial | Commercial |
Principaux différenciateurs
- Internal dual-configuration flash eliminates external boot PROM (vs 10M40DAF672C8G)
- 40K logic elements versus 25K in the 10M25DCF672C8G (vs 10M25DCF672C8G)
- -8 commercial speed grade offers the fastest timing bin in the family (vs 10M40DCF672C7G)
Notes de conception
The 672-ball FBGA package uses a 1.0 mm ball pitch on a 27 x 27 mm body. Per Intel's MAX 10 hardware design guide, the PCB must use microvia-in-pad or staggered microvia construction with at least 4 layers to break out the inner balls. Standard through-via dog-bone fanout will not work below an 8-layer board at this pin density. Allow at least 0.4 mm trace-and-space rules for the breakout region and use a keep-out zone under the BGA for power-plane stitching.
MAX 10 devices require at least four separate power rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), VCCIO (banked 1.2-3.3 V), and VCCPD (3.0-3.3 V configuration). Use a dedicated ferrite or Pi filter between VCCA and VCCINT to keep PLL noise below 1 percent ripple. Decoupling requires 0.1 uF X7R capacitors within 2 mm of every VCC pin and bulk 10-47 uF tantalum or ceramic capacitors near each power rail entry. Power-on sequence should follow VCCIO -> VCCPD -> VCCINT -> VCCA per the datasheet.
Bank I/O voltages can be mixed on the same device as long as each bank's VCCIO pin is supplied independently. When routing differential pairs such as LVDS, maintain 100 ohm differential impedance with matched pair lengths within 5 mils. The hard memory controllers require DQ, DQS, and clock traces matched within 50 mils for DDR3 at 303 MHz. Place external SDRAM within 25 mm of the FPGA to avoid timing issues and use ground stitching vias every 5 mm along the byte lanes.
Do not leave unused I/O pins floating - configure them as outputs driving low or as inputs with weak pull-ups to avoid spurious current draw and noise coupling. The dual-configuration flash feature requires both CFG0 and CFG1 pins to be properly terminated; floating configuration pins can cause unreliable boot. When migrating bitstreams from -8 to -7 speed grade, re-run timing analysis because some paths may fail timing closure at the slower grade. Always compile with the Quartus Prime fitter seed sweep enabled for production designs.
Informations de conformité
RoHS and REACH compliance per Intel product page. Commercial temperature grade only; industrial temperature variants (I7G suffix) available for harsher environments. Not AEC-Q100 qualified - automotive designs should evaluate the -I suffix variants separately.