A54SX08-2FG144I - 8K Gate SX FPGA, 144-FBGA | Microchip
Référence : A54SX08-2FG144I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.1 | $391,00 |
| 100 | $35.2 | $3 520,00 |
| 500 | $32.8 | $16 400,00 |
| 1 000 | $30.5 | $30 500,00 |
A54SX08-2FG144I Présentation
A field-programmable gate array (FPGA) is a semiconductor device that implements configurable digital logic through programmable interconnect and logic blocks. Within the programmable logic hierarchy, the SX family sits in the one-time-programmable (OTP) antifuse FPGA category, positioned below high-density families such as SX-A and RTAX, and competes with low-density SRAM FPGAs and CPLDs. Its sea-of-modules architecture provides a fine-grained fabric suited to high-speed glue logic, state machines, and bus interface functions.
Key features of the A54SX08-2FG144I include the antifuse interconnect technology manufactured on a 0.35 um CMOS process, dual voltage supply operation at 3.3V and 5V, and a -2 speed grade supporting toggle rates up to 320 MHz. Because the configuration is stored in antifuse elements, the device is nonvolatile and instantly operational at power-up with no external configuration ROM and no configuration-time vulnerability.
Architecturally, each SX logic module is a multiplexer-based cell whose small grain minimizes routing delay, which is why the family achieves ASIC-like timing predictability. Routing resources are organized for short, deterministic interconnect, so designers can meet timing without extensive place-and-route iteration. The dual 3.3V/5V I/O capability allows direct interfacing with legacy 5V TTL systems while the core runs at 3.3V.
Typical applications include industrial control and automation, 5V-legacy bus bridging, telecommunications line-card glue logic, and avionics/industrial systems where instant-on, single-chip operation and resistance to configuration corruption are required. Industrial-grade (-I suffix) screening suits harsh environments.
Design consideration: the antifuse fabric is one-time-programmable, so programming errors cannot be recovered; prototype on the identical die in a reprogrammable flow or verify the design thoroughly before committing to production programming.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A54SX08-2FG144I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A54SX08-2FG144I (même facteur de forme et même empreinte) — différant par Package, Family, Operating Temperature, Logic Cells, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A54SX08-2FGG144I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A54SX08-2FGG144
✅ Remplacement direct✓ En stock
$38.5 / unité
Voir la fiche technique →A54SX08-FG144I
✅ Remplacement direct✓ En stock
$109.79 / unité
Voir la fiche technique →A54SX08-FG144
✅ Remplacement direct✓ En stock
$109.78 / unité
Voir la fiche technique →A54SX08-FGG144I
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →A54SX08-2FG144I Valeurs maximales et caractéristiques électriques
| System Gates | 8000 |
| Logic Cells | 512 |
| Logic Modules | 768 |
| Number of I/O | 111 |
| Maximum System Frequency | 320 MHz |
| Process Technology | 0.35 um CMOS |
| Tension d'alimentation | 3.3 V / 5 V |
| Program Technology | Antifuse (one-time programmable) |
| Speed Grade | -2 |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 144-Ball Fine-Pitch BGA (FG144) |
| Type de montage | Surface Mount |
| Configuration | Nonvolatile, instant-on (no external boot device) |
| Family | Actel SX (54SX) |
Guide de configuration des broches du A54SX08-2FG144I 144-ball fine-pitch bga (fg144)
Configuration des broches du A54SX08-2FG144I (boîtier 144-ball fine-pitch bga (fg144)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A54SX08-2FG144I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A54SX08-2FG144I convient pour 6 applications: Industrial Control and Automation, 5V Legacy Bus Bridging, Telecommunications Line-Card Glue Logic, Avionics and Harsh-Environment Systems, ASIC Prototyping and Emulation Glue, Test and Measurement Instrumentation.
Industrial Control and Automation
The A54SX08-2FG144I fits industrial control well: the -I suffix guarantees -40C to +85C operation for factory-floor cabinets, and 111 user I/O absorbs dense sensor, encoder, and actuator interfaces in a single 144-ball FBGA. The antifuse fabric is instant-on and immune to configuration corruption from power glitches or EMI, a real advantage in electrically noisy motor-control environments where SRAM FPGAs risk corrupted boot. Logic runs at up to 320 MHz-class performance for fast interlocks and PWM glue logic. Use the device between a microcontroller and high-speed I/O where deterministic, non-reprogrammable logic is acceptable and single-chip integration reduces BOM count.
Recommandé
5V Legacy Bus Bridging
Dual 3.3V/5V supply operation makes the A54SX08-2FG144I a natural bridge between legacy 5V TTL buses (VME-style backplanes, industrial parallel buses, older peripheral interfaces) and modern 3.3V subsystems. The I/O structure supports 5V signaling while the core runs at 3.3V, eliminating level-shifter arrays that would otherwise add propagation delay and parts count. With 320 MHz-class antifuse timing, even multi-level bus arbitration and decoding logic stays within tight setup/hold budgets. Place the FPGA at the backplane interface with its 111 I/O handling address, data, and control lanes in one chip, and rely on the nonvolatile configuration so the bridge is functional immediately at power-up.
Recommandé
Telecommunications Line-Card Glue Logic
Telecom line cards frequently need high-speed glue logic: address decoding, clock distribution gating, framing interface adaptation, and hot-swap sequencing. The A54SX08-2FG144I's fine-grained multiplexer-based modules provide deterministic, low-skew routing that suits these fixed-function paths, and the -2 speed grade sustains 320 MHz-class toggle rates for OC-level bit streams and backplane clocks. The fine-pitch BGA keeps signal stubs short for signal integrity at these rates, while instant-on antifuse configuration means the line card presents valid logic to the backplane within microseconds of power application - important for system-level power sequencing. One chip replaces dozens of 74-series devices, cutting power and board area.
Recommandé
Avionics and Harsh-Environment Systems
Antifuse FPGAs are a traditional choice in avionics and harsh environments because the configuration cannot be disturbed by radiation-induced configuration upsets, unlike SRAM fabrics. The A54SX08-2FG144I's industrial -40C to +85C range and nonvolatile instant-on behavior support instrumentation and control units in commercial aerospace-adjacent and ground-based harsh applications. The 8K-gate density is well matched to ARINC-style protocol adaptation, discrete-to-digital conversion, and built-in-test logic. For full space or military screening, migrate within the Microchip portfolio to RTAX radiation-tolerant families, but for cost-sensitive harsh industrial programs the SX antifuse fabric delivers configuration robustness at a fraction of the cost.
Recommandé
ASIC Prototyping and Emulation Glue
The SX family's ASIC-like, fine-grained architecture makes the A54SX08-2FG144I useful for prototyping small control blocks and interface state machines destined for ASICs, with predictable timing that eases correlation between FPGA prototype and final silicon. Multiple devices can be combined on a prototype board, with the 111 I/O per device handling substantial inter-FPGA and host interfaces. The dual 3.3V/5V I/O simplifies interfacing with test equipment still using 5V logic levels. Because the antifuse fabric is programmed once, prototype iterations should use verified netlists; pair the device with the higher-density A54SX16/32 family members when the design grows beyond 8K gates during experimentation.
Recommandé
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A54SX08-2FG144I as timing/controller logic: counter/timer front ends, trigger arbitration, and bus interface adaptation all map well to the 320 MHz-class fine-grained fabric. The dual 3.3V/5V I/O directly connects to legacy 5V instrument backplanes and TTL test points, while the FBGA package minimizes loop inductance for clean clock distribution. Nonvolatile instant-on configuration lets an instrument be measurement-ready the moment power is applied, with no configuration download delay that could stall automated test sequences. Use the industrial temperature grade for instruments deployed in unconditioned manufacturing-floor environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A54SX08-2FG144I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A54SX08-2FGG144I | A54SX08-2FGG144 | A54SX08-FG144I | A54SX08-2TQG144I |
|---|---|---|---|---|---|
| Package | 144-Ball FBGA (FG144) | 144-Ball FBGA - same | 144-Ball FBGA - same | 144-Ball FBGA - same | 144-TQFP - different footprint |
| Brand | Microsemi (Microchip) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| User I/O | 111 | 111 | 111 | 111 | 113 |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | 0C to +70C (Commercial) | -40C to +85C | -40C to +85C |
| Lead-Free Finish | No (standard FG tin-lead) | Yes (GG green) | Yes (GG green) | No | Yes (GG green) |
Principaux différenciateurs
- Industrial temperature with full -2 speed grade (vs A54SX08-2FGG144)
- Identical drop-in for RoHS builds (vs A54SX08-2FGG144I)
- Fine-pitch BGA over TQFP for signal integrity and area (vs A54SX08-2TQG144I)
- Nonvolatile antifuse fabric vs SRAM alternatives (vs A54SX08-2TQG144I (and all SRAM FPGAs))
Notes de conception
The A54SX08-2FG144I requires both a 3.3V rail (core) and optionally a 5V rail for legacy I/O banks. Provide independent decoupling networks on each supply: bulk capacitance plus local high-frequency ceramics at the FBGA power balls. Because the BGA power balls sit under the die, use short, wide via fanout to the planes. Estimated: dynamic power scales with clock frequency and toggle rate, so at 320 MHz-class operation budget realistic activity factors rather than worst-case 100% toggling when sizing the 3.3V rail.
Antifuse FPGAs are one-time-programmable: a flawed bitstream permanently consumes a device. Complete full functional simulation and static timing analysis in the Libero toolchain before programming, and program one pilot unit per lot to validate the programming setup. Also note the package difference trap: A54SX08-2TQG144I (TQFP) is not footprint-compatible with the FG144 FBGA despite identical die. Confirm date codes when sourcing legacy stock, and qualify the GG (lead-free) variant early if RoHS compliance may be required later.
At 320 MHz-class output toggling, the fine-pitch BGA offers low inductance but requires disciplined breakout: keep via stubs short, reference high-speed I/O to a continuous ground plane, and series-terminate long nets to control ringing, especially on 5V-swing I/O where overshoot margins differ from 3.3V banks. Distribute clocks through dedicated routing resources and avoid loading fast clock nets with excess fanout. For mixed 3.3V/5V designs, group same-voltage banks together to simplify return-path management.
Informations de conformité
The FG suffix indicates standard tin-lead finish; for lead-free/RoHS-constrained builds use the pin-identical A54SX08-2FGG144I (GG green variant). Formal RoHS/REACH certificates not present in provided data - obtain from Microchip product page.
