ATSAM4N8BA-MUR - 100MHz Cortex-M4 MCU 512KB Flash | Microchip
Référence : ATSAM4N8BA-MUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.82 | $1,82 |
| 10 | $1.71 | $17,10 |
| 100 | $1.55 | $155,00 |
| 500 | $1.4 | $700,00 |
| 1 000 | $1.3 | $1 300,00 |
ATSAM4N8BA-MUR Présentation
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the lowest level of the embedded processing hierarchy: microcontroller unit (MCU) -> embedded processor -> microprocessor -> computing system. The SAM4N family belongs to Microchip's (formerly Atmel) SAM4 line of ARM Cortex-M4-based flash MCUs, targeting cost-sensitive embedded control applications that need 32-bit performance without floating-point heavy workloads.
Key features of the ATSAM4N8B device include six USARTs, three SPI interfaces, and three I2C/TWI interfaces for fast serial communication, plus a 10-channel 12-bit ADC, a 10-bit DAC, PWM channels, timers, and a real-time clock (RTC). The supply range of 1.62V to 3.6V allows direct battery operation from single-cell lithium chemistry or 3.3V industrial rails.
Architecturally, the ARM Cortex-M4 core at 100 MHz delivers approximately 125 DMIPS with single-cycle multiply and hardware division, while the 512KB single-cycle flash and 64KB SRAM support large protocol stacks and data buffers typical of industrial gateways and sensing nodes.
Typical applications include industrial automation nodes, motor control and PWM-driven power stages, sensor hubs using the 12-bit ADC, and building/HVAC controllers that rely on the RTC and multiple serial ports.
Design consideration: the QFN exposed pad is the main ground/thermal path and must be soldered to a solid ground pour; also budget supply decoupling across all VDD/VDDIO pairs given the multi-rail 1.62V to 3.6V architecture.
This page synthesizes distributor pricing (as of 2026-09-20), drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAM4N8BA-MUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4N8BA-MUR (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Flash Memory, Series, Maximum Clock Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4N8BA-MU
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.76 / unité
Voir la fiche technique →ATSAM4N16BA-MU
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →ATSAM4N8AA-MUR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAM4LC8BA-UUR
✅ Remplacement direct✓ En stock
$3.95 / unité
Voir la fiche technique →ATSAM4LS8BA-AUR
✅ Remplacement direct✓ En stock
$4.72 / unité
Voir la fiche technique →ATSAM4N8BA-MUR Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Fréquence d'horloge maximale | 100 MHz |
| Flash Memory | 512KB (512K x 8) |
| SRAM | 64KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| USART Peripherals | 6 |
| SPI Peripherals | 3 |
| I2C Peripherals | 3 |
| ADC Resolution / Channels | 12-bit, 10 channels |
| DAC Resolution | 10-bit |
| Other Peripherals | PWM, timers, RTC |
| Boîtier | 64-QFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Temperature Grade | Industrial |
| Statut RoHS | Compliant (GREEN, per Mouser listing) |
| Packaging Code | MUR = Tape & Reel, MRL A |
Guide de configuration des broches du ATSAM4N8BA-MUR 64-qfn (9x9 mm) with exposed pad
Configuration des broches du ATSAM4N8BA-MUR (boîtier 64-qfn (9x9 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAM4N8BA-MUR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAM4N8BA-MUR convient pour 6 applications: Industrial Automation Nodes, Motor Control and PWM Power Stages, Sensor Hubs and Data Acquisition, Building Automation and HVAC Controllers, Portable and Battery-Powered Instruments, IoT Edge Nodes and Networked Sensors.
Industrial Automation Nodes
The ATSAM4N8BA-MUR fits industrial automation nodes because its six USARTs and three SPI/I2C buses can service RS-485 fieldbus drops, isolated sensors, and local flash logging concurrently, while the 100 MHz Cortex-M4 core handles protocol stacks with margin. The industrial temperature grade and 1.62V to 3.6V supply tolerate noisy 3.3V industrial rails. Placed as the main controller, the MCU's PWM and timer resources drive actuators, and the 10-channel 12-bit ADC digitizes up to ten analog process signals without an external front-end, cutting BOM cost versus a smaller 8-bit MCU plus ADC solution.
Recommandé
Motor Control and PWM Power Stages
The ATSAM4N8BA-MUR suits PWM-driven motor and power stages because its hardware PWM channels and timers generate complementary drive signals without CPU intervention, and the 10-channel 12-bit ADC samples current and voltage feedback for closed-loop control at 100 MHz core speed. The 1.62V to 3.6V supply interfaces directly with gate-driver logic inputs at 3.3V. Firmware latency is predictable thanks to the Cortex-M4 deterministic interrupt architecture. Trade-off: the part lacks a floating-point unit benefit path for heavy FOC math, so fixed-point control or an external co-processor may be preferred for high-precision servo loops.
Recommandé
Sensor Hubs and Data Acquisition
The ATSAM4N8BA-MUR is a strong sensor-hub controller: its 10-channel 12-bit ADC digitizes analog sensors directly, the three I2C and three SPI ports aggregate digital sensors on separate buses to isolate fault domains, and 64KB SRAM buffers burst data before offloading over USART links. The 100 MHz Cortex-M4 executes filtering and averaging in real time. Powering the hub from a single 3.3V rail within the 1.62V to 3.6V range simplifies design, and the exposed-pad QFN grounds the analog reference plane for better ADC noise performance than plastic thin packages.
Recommandé
Building Automation and HVAC Controllers
HVAC and building controllers benefit from the ATSAM4N8BA-MUR's real-time clock for scheduled operation, six USARTs for multi-zone communication (BACnet/Modbus style multi-drop over RS-485), and the 12-bit ADC for temperature, humidity, and pressure sensor integration. The 512KB flash holds protocol stacks plus web-style configuration interfaces, and the industrial temperature grade suits rooftop and mechanical-room environments. The 100 MHz core keeps control loops and communication simultaneous without task starvation, and the wide 1.62V to 3.6V supply rides brownouts from shared 3.3V rails with simple decoupling.
Recommandé
Portable and Battery-Powered Instruments
Handheld instruments use the ATSAM4N8BA-MUR because its 1.62V to 3.6V supply runs directly from two-cell alkaline or single-cell lithium sources, and its sleep modes preserve battery life between measurements. The 10-bit DAC generates test/reference stimuli, the 12-bit ADC captures responses, and the Cortex-M4 core performs DSP-style filtering on the 100 MHz pipeline. The 64-QFN 9x9 mm footprint keeps the PCB compact for enclosure-constrained products. Designers should budget the exposed pad as the thermal return path and use the MCU's low-power modes plus RTC wake for months-long field operation between battery changes.
Recommandé
IoT Edge Nodes and Networked Sensors
For IoT edge nodes, the ATSAM4N8BA-MUR provides the local intelligence: 512KB flash stores MQTT/CoAP stacks and OTA-capable bootloaders, the multiple USART/SPI/I2C ports link radios (Wi-Fi, LoRa, BLE modules) and sensors simultaneously, and the RTC timestamps events. The 100 MHz Cortex-M4 handles TLS-adjacent pre-processing and payload framing deterministically. Its 1.62V to 3.6V input pairs naturally with 3.3V radio modules on a shared rail. Firmware headroom is the key consideration: with 64KB SRAM, keep TLS buffers lean or select the 1MB ATSAM4N16BA-MU drop-in sibling if protocol growth is expected over the product lifetime.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4N8BA-MUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4N8BA-MU | ATSAM4N16BA-MU | ATSAM4N8AA-MUR | ATSAM4LC8BA-UUR | ATSAM4LS8BA-AUR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm), EP | 64-QFN (9x9 mm) - same | 64-pin package - same family footprint | 64-QFN (9x9 mm) - same | 64-QFN | 64-QFN |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, 100 MHz | ARM Cortex-M4, lower-power implementation | ARM Cortex-M4, lower-power implementation |
| Flash Memory | 512KB | 512KB | 1MB | 256KB | 512KB class | 512KB class |
| SRAM | 64KB | 64KB | 128KB | 64KB | 64KB class | 64KB class |
| Serial Peripherals | 6 USART, 3 SPI, 3 I2C | 6 USART, 3 SPI, 3 I2C | similar SAM4N peripheral set | similar SAM4N peripheral set | SAM4L peripheral set (different mux) | SAM4L peripheral set (different mux) |
| Packaging | Tape & Reel (MUR) | Tray (MU) | Tray (MU) | Tape & Reel (MUR) | Tape & Reel (UUR) | Tape & Reel (AUR) |
Principaux différenciateurs
- Best memory/price balance in the 64-QFN SAM4N lineup (vs ATSAM4N16BA-MU)
- Twelve serial peripherals for multi-bus designs (vs ATSAM4LC8BA-UUR)
- Full 512KB at 100 MHz without a family downgrade (vs ATSAM4N8AA-MUR)
Notes de conception
The 64-QFN 9x9 mm exposed pad is the primary ground and thermal connection. Design a 3x3 or larger array of thermal vias under the pad to a solid internal ground plane, and ensure the stencil applies 50-70% paste coverage to avoid voiding during reflow. All VDD and VDDIO pairs need a 100 nF ceramic capacitor within 2 mm of each pin pair, plus one bulk 4.7-10 uF capacitor per rail. Follow Microchip's SAM4N datasheet layout section for the NRST pull-up and SWD debug header placement.
Supply range is 1.62V to 3.6V. In mixed systems with a 5V rail, use a 3.3V LDO and confirm no external peripheral drives MCU I/O above 3.6V; series resistors or level shifters protect the inputs. For battery designs, monitor the brown-out reset threshold against the battery discharge curve so the MCU does not write to flash near the minimum supply. Estimated: a node sleeping most of the time with periodic 100 MHz bursts benefits greatly from configuring sleep modes and gating unused peripheral clocks, since active-mode current scales with clock frequency.
When migrating between SAM4N memory-density variants (ATSAM4N8AA / 8BA / 16BA), the linker script flash and RAM sizes must be updated and the pin multiplexing re-verified against the correct datasheet table - pin functions differ subtly across package options. When considering a cross-family swap to SAM4L parts (ATSAM4LC8BA-UUR, ATSAM4LS8BA-AUR), note that the peripheral architecture, clock tree, and pinout differ from SAM4N despite the similar 64-QFN footprint; budget PCB and firmware rework. Always program the flash via a verified SWD image before mass production.
Informations de conformité
Mouser lists the part as QFN, GREEN, IND TEMP, MRL A - GREEN denotes Microchip's RoHS-compliant, halogen-free designation. REACH and conflict-minerals status should be confirmed via Microchip's official material declarations.
