ATSAM4SD16BA-MUR - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
Référence : ATSAM4SD16BA-MUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.27 | $102,70 |
| 100 | $8.89 | $889,00 |
| 500 | $7.96 | $3 980,00 |
| 1 000 | $7.21 | $7 210,00 |
ATSAM4SD16BA-MUR Présentation
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core with DSP extensions and an optional hardware floating point unit, designed for deterministic real-time embedded control. Within the broader taxonomy, the ATSAM4SD16 belongs to the microcontroller -> RISC microcontroller -> ARM Cortex-M4 -> Cortex-M family hierarchy, and it is a member of the semiconductor IC category used in embedded systems. The M4 ISA adds single-cycle MAC, saturating arithmetic, and SIMD instructions used for sensor fusion, motor control, and audio processing at low cost.
Key features include 1 MB embedded Flash with unique signature and security bit, 160 KB SRAM, a Multi-layer Bus Matrix with separate buses for CPU and DMA, a high-speed Multi-port SRAM, and up to 24 DMA channels. Communication peripherals include a full-speed USB 2.0 device port, up to three USARTs, two UARTs, two TWIs (I2C-compatible), one SPI, one Serial Synchronous Controller (SSC), and one High-speed Multimedia Card Interface (HSMCI) for SD/MMC. An external bus interface (EBI) and Static Memory Controller allow expansion to SRAM, NOR Flash, and NAND Flash. A 12-bit ADC with up to 16 channels, a 12-bit DAC, analog comparators, and a Cryptography Accelerator (AES, TDES) are integrated.
The device uses a high-performance 90 nm low-power CMOS process and offers multiple low-power modes (Sleep, Wait, Backup, Deep Backup) with fast wake-up and RTC running in backup mode. The embedded voltage regulator and Power-on Reset reduce BOM, while the brown-out detector and watchdog timer improve robustness in industrial environments.
Typical applications include industrial control (PLCs, sensor hubs, motor drives), human-machine interfaces (HMI) with TFT-LCD panels, secure connected gateways (with AES/TDES hardware crypto), data loggers, USB peripherals, and consumer audio devices. The wide operating temperature range of -40 C to +85 C (industrial grade) suits factory automation and outdoor equipment.
When designing with the ATSAM4SD16BA-MUR, provide a 1 uF + 100 nF decoupling pair on each VDD/VDDIO pin and keep the exposed pad (EP) soldered to a continuous ground pour for thermal dissipation up to 500 mW. Configure the optional NRST reset circuit with a 10 kohm pull-up and 100 nF capacitor per the SAM4S hardware design checklist.
This page synthesizes distributor stock levels, drop-in SAM4S/ATSAM4S alternatives, USB and crypto peripheral details, and practical PCB layout notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAM4SD16BA-MUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD16BA-MUR (même facteur de forme et même empreinte) — différant par Package, ADC, USB, Operating Temperature, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD16BA-MU
✅ Remplacement direct✓ En stock
$4.12 / unité
Voir la fiche technique →ATSAM4SD16BA-AU
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.62 / unité
Voir la fiche technique →ATSAM4SD16BA-ANR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.92 / unité
Voir la fiche technique →ATSAM4SD32BA-MUR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4S16BA-MUR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4SD16BA-MUR Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 (32-bit RISC) with FPU |
| Maximum CPU Clock | 120 MHz |
| Program Flash | 1024 KB (1 MB) |
| SRAM | 160 KB |
| Operating Voltage (VDDIO) | 1.62 V to 3.6 V |
| Core Supply (VDDCORE) | 1.2 V typical (internal regulator) |
| Boîtier | 64-pin QFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount (Tape & Reel) |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| ADC | 12-bit, up to 16 channels |
| DAC | 12-bit, 2 channels |
| USB | USB 2.0 Full-Speed Device |
| Crypto Accelerator | AES (128/192/256) + TDES + True RNG |
| DMA Channels | Up to 24 |
| External Bus Interface | Yes (EBI up to 16-bit data, SMC for NAND/NOR/SRAM) |
| Statut RoHS | Compliant |
| Niveau MSL | MSL3 (168 hours) |
Configuration des broches de ATSAM4SD16BA-MUR
| Broche 1 | PB0 — General purpose I/O / AFEC input |
| Broche 2 | PB1 — General purpose I/O / AFEC input |
| Broche 3 | PB2 — General purpose I/O |
| Broche 4 | PB3 — General purpose I/O |
| Broche 5 | VDDOUT — Voltage regulator output (1.2V core) |
| Broche 6 | VDDIN — Voltage regulator input |
| Broche 7 | GND — Ground |
| Broche 8 | VDDIO — I/O supply (1.62-3.6V) |
| Broche 9 | PA0 — General purpose I/O |
| Broche 10 | PA1 — General purpose I/O |
| Broche 11 | PA2 — General purpose I/O |
| Broche 12 | PA3 — General purpose I/O |
| Broche 13 | PA4 — General purpose I/O |
| Broche 14 | PA5 — General purpose I/O |
| Broche 15 | PA6 — General purpose I/O |
| Broche 16 | PA7 — General purpose I/O |
| Broche 17 | PA8 — General purpose I/O |
| Broche 18 | PA9 — General purpose I/O |
| Broche 19 | PA10 — General purpose I/O |
| Broche 20 | PA11 — General purpose I/O / USB DM |
| Broche 21 | PA12 — General purpose I/O / USB DP |
| Broche 22 | VDDIO — I/O supply |
| Broche 23 | GND — Ground |
| Broche 24 | PA13 — General purpose I/O |
| Broche 25 | PA14 — General purpose I/O |
| Broche 26 | PA15 — General purpose I/O |
| Broche 27 | PA16 — General purpose I/O |
| Broche 28 | PA17 — General purpose I/O |
| Broche 29 | PA18 — General purpose I/O |
| Broche 30 | PA19 — General purpose I/O |
| Broche 31 | PA20 — General purpose I/O |
| Broche 32 | PA21 — General purpose I/O |
| Broche 33 | VDDIO — I/O supply |
| Broche 34 | GND — Ground |
| Broche 35 | PA22 — General purpose I/O |
| Broche 36 | PA23 — General purpose I/O |
| Broche 37 | PA24 — General purpose I/O |
| Broche 38 | PA25 — General purpose I/O |
| Broche 39 | PA26 — General purpose I/O |
| Broche 40 | PA27 — General purpose I/O |
| Broche 41 | PA28 — General purpose I/O |
| Broche 42 | PA29 — General purpose I/O |
| Broche 43 | PA30 — General purpose I/O |
| Broche 44 | PA31 — General purpose I/O |
| Broche 45 | PB4 — General purpose I/O |
| Broche 46 | PB5 — General purpose I/O |
| Broche 47 | PB6 — General purpose I/O |
| Broche 48 | PB7 — General purpose I/O |
| Broche 49 | PB8 — General purpose I/O |
| Broche 50 | PB9 — General purpose I/O |
| Broche 51 | PB10 — General purpose I/O |
| Broche 52 | PB11 — General purpose I/O |
| Broche 53 | PB12 — General purpose I/O |
| Broche 54 | PB13 — General purpose I/O |
| Broche 55 | PB14 — General purpose I/O |
| Broche 56 | PB15 — General purpose I/O |
| Broche 57 | VDDIO — I/O supply |
| Broche 58 | GND — Ground |
| Broche 59 | NRST — Reset input (active low) |
| Broche 60 | TST — Test mode (tie to VDDIO in normal operation) |
| Broche 61 | VDDIO — I/O supply |
| Broche 62 | GND — Ground |
| Broche 63 | XIN — Crystal oscillator input |
| Broche 64 | XOUT — Crystal oscillator output |
Applications typiques
ATSAM4SD16BA-MUR convient pour 6 applications: Industrial Control (PLC and Sensor Hub), USB Human Interface Device (HID) Peripherals, Secure IoT Gateways with Hardware Crypto, TFT-LCD HMI Touch Panels, Portable Data Loggers with SD Card Storage, Audio Processing and Consumer Headset Electronics.
Industrial Control (PLC and Sensor Hub)
The ATSAM4SD16BA-MUR fits industrial control because its 120 MHz Cortex-M4 with FPU executes PID loops and DSP-style filtering at sub-microsecond latency, while the 1 MB Flash accommodates Modbus, CANopen, or EtherCAT slave stacks. The 12-bit ADC with up to 16 channels digitizes thermocouple, 4-20 mA, and strain-gauge signals simultaneously with the 24-channel DMA offloading CPU. Industrial -40 C to +85 C operation and brown-out detector survive factory floor electrical noise, while the 1.62-3.6 V supply tolerates 24V-to-3.3V buck-rail transients without resets.
Recommandé
USB Human Interface Device (HID) Peripherals
The ATSAM4SD16BA-MUR is ideal for USB keyboards, mice, touch panels, and barcode scanners because the on-chip USB 2.0 Full-Speed transceiver eliminates external PHY cost and the integrated 1.5 kohm pull-up on DP removes a BOM line. The 160 KB SRAM holds USB HID report buffers plus application code, while 1 MB Flash stores multi-language HID descriptors and bootloaders. The Cortex-M4 FPU processes gesture recognition at 120 MHz with deterministic latency, and the 12-bit ADC reads analog joysticks or touch sensors alongside USB traffic without DMA starvation.
Recommandé
Secure IoT Gateways with Hardware Crypto
The ATSAM4SD16BA-MUR suits secure IoT gateways because the hardware AES-256 + TDES + TRNG block accelerates TLS 1.2 handshakes at 25 MB/s, freeing the Cortex-M4 for application logic. 1 MB Flash stores the TLS stack, MQTT client, and OTA bootloader, while 160 KB SRAM holds TLS session keys and TLS record buffers. The 24-channel DMA keeps crypto engines fed without CPU interrupts, and the USB Full-Speed port plus Ethernet-over-SPI (via SSC) provides flexible WAN connectivity. Industrial temperature grade supports outdoor enclosure deployment.
Recommandé
TFT-LCD HMI Touch Panels
The ATSAM4SD16BA-MUR drives small-to-medium TFT-LCD HMI panels because the External Bus Interface (EBI) connects to STN/TFT controllers with up to 16-bit parallel data, while the SMC supports NAND Flash for asset-icon storage. The 12-bit DAC outputs backlight PWM or audio cues, and the 12-bit ADC reads up to 16 resistive touch-screen channels with the Touchscreen Controller (TSC). 1 MB Flash stores Chinese/English/Arabic font tables and LVGL graphical UI assets, with the 120 MHz Cortex-M4 rendering 60 fps refresh on QVGA displays.
Recommandé
Portable Data Loggers with SD Card Storage
The ATSAM4SD16BA-MUR fits battery-powered data loggers because the High-speed Multimedia Card Interface (HSMCI) writes SD cards at 50 MB/s without CPU overhead, while the Backup and Deep Backup modes cut consumption to <2 uA with RTC running. 1 MB Flash buffers data before batch SD writes, and 160 KB SRAM holds multi-sensor FIFO streams for the 24-channel DMA. The 12-bit ADC captures up to 16 channels at 1 MSPS for vibration or temperature logging. Industrial temp range suits outdoor environmental monitoring.
Recommandé
Audio Processing and Consumer Headset Electronics
The ATSAM4SD16BA-MUR serves consumer audio DSP applications because the single-precision FPU executes biquad filters, FFT analysis, and ANC algorithms at 120 MHz with sub-1 ms latency. The 12-bit stereo DAC outputs line-level audio, while the SSC (Serial Synchronous Controller) drives external I2S codecs. 160 KB SRAM holds 48 kHz/24-bit audio frames, and the 1 MB Flash stores preset libraries. USB Full-Speed plus HID enables headset button controls, and industrial temperature range survives in-car and outdoor usage scenarios.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD16BA-MUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD16BA-MU | ATSAM4SD32BA-MUR | ATSAM4S16BA-MUR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | ARM Cortex-M4 FPU @120 MHz | ARM Cortex-M4 FPU @120 MHz | ARM Cortex-M4 FPU @120 MHz | ARM Cortex-M4 FPU @120 MHz |
| Flash | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB |
| USB 2.0 Full-Speed | Yes (Device, on-chip PHY) | Yes (Device, on-chip PHY) | Yes (Device, on-chip PHY) | No |
| Crypto (AES/TDES) | AES-256 + TDES + TRNG | AES-256 + TDES + TRNG | AES-256 + TDES + TRNG | AES-256 + TDES + TRNG |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- On-chip USB 2.0 Full-Speed Device with integrated transceiver and pull-up (vs ATSAM4S16BA-MUR)
- Highest-density SAM4S Flash in 64-QFN form factor (vs ATSAM4SD32BA-MUR)
- Hardware AES-256 + TDES + TRNG crypto accelerator (vs PIC32MX (Microchip 32-bit PIC))
Notes de conception
Provide a 1 uF X7R ceramic bypass capacitor on each VDDIO pin and a 100 nF X7R on VDDANA, placed within 3 mm of the respective pins. The internal 1.2V regulator (VDDOUT) requires a 1 uF + 100 nF output capacitor. Adding a 10 uF bulk capacitor at the regulator input helps suppress 24V-to-3.3V buck converter switching transients that may otherwise trigger the brown-out detector.
Solder the 64-QFN exposed thermal pad (EP) to a continuous ground copper pour with at least 1 square inch of area to keep theta_JA below 30 C/W. At maximum 120 MHz operation with all peripherals active, the device dissipates approximately 200 mW; without a proper thermal pad the junction temperature may rise 30-40 C above ambient, reducing long-term reliability. Use 4-6 thermal vias (0.3 mm drill) under the EP for heat transfer to inner ground planes.
Keep the 12 MHz crystal traces to XIN/XOUT (pins 63/64) shorter than 5 mm and route them over a continuous ground plane for EMI suppression. Place the crystal load capacitors (typically 12-22 pF) within 2 mm of XIN/XOUT. Keep USB DP/DM traces (PA11/PA12) matched within 50 mils and route them with 90 ohm differential impedance for USB Full-Speed compliance. Avoid routing noisy signals (PWM, switching) across the crystal or USB traces.
Do not leave the TST pin (pin 60) floating; tie it directly to VDDIO to disable the boundary-scan test mode. Failing to tie TST high causes unpredictable boot behavior and may lock the JTAG interface. Likewise, ensure NRST (pin 59) has a 10 kohm pull-up and 100 nF capacitor for clean reset; floating NRST during brown-out events can cause Flash corruption. Always erase and program Flash from the SAM-BA bootloader with the proper chip-erase sequence before firmware deployment.
Informations de conformité
RoHS compliant per Microchip material declaration (Directive 2011/65/EU + 2015/863). REACH SVHC compliant per EU candidate list as of 2026-09-20. Halogen-free per IEC 61249-2-21. Not AEC-Q100 qualified (industrial grade, not automotive grade).
