Microchip Technology

ATSAM4SD32CB-CN - SAM4S ARM Cortex-M4 MCU 120MHz 2MB Flash | Microchip

Référence : ATSAM4SD32CB-CN ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.62 V to 3.6 V Vdss 100-TFBGA, 9 mm x 9 mm Package 120 MHz Speed 2 MB (2048 KB), dual-bank with cache Memory
À partir de $14.75 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-20
Tarifs dégressifs
Qté Prix unitaire Total
1 $23.77 $23,77
10 $21.5 $215,00
100 $18.95 $1 895,00
500 $16.4 $8 200,00
1 000 $14.75 $14 750,00
ℹ️ Tous les prix sont en USD

ATSAM4SD32CB-CN Présentation

The Microchip Technology ATSAM4SD32CB-CN is an ARM Cortex-M4 SAM4S microcontroller integrating 2MB of Flash and 160KB of SRAM, operating at up to 120 MHz core clock, and housed in a 100-ball TFBGA (9x9 mm) package. The device is the production revision B of the SAM4SD32 family and is rated for the extended industrial temperature range (-40C to +85C).

A 32-bit MCU (microcontroller) is a single-chip computer that integrates a processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on one die. Microcontrollers sit within the broader taxonomy of microprocessors -> embedded processors -> microcontrollers -> ARM Cortex-M microcontrollers. The Cortex-M4 core additionally provides a single-precision FPU and DSP extensions, making the SAM4S suitable for signal-processing tasks in addition to conventional control.

Key features of the ATSAM4SD32CB-CN include a full-speed USB Device port with embedded transceiver, up to two HS USB hosts/device/OTG capable ports in the family, a 16-bit static memory controller for external NAND Flash / NOR / SDRAM, dual 16-bit ADC and a 12-bit DAC, multiple UART/USART, TWI (I2C), SPI, SSC, and an on-chip temperature sensor. The dual-bank Flash with cache memory accelerates code execution from on-chip storage, while the integrated voltage regulator supports single-supply operation from a 1.62V to 3.6V source (with separate I/O and core domains).

Architecturally the SAM4S combines an M-class core with a Multi-layer Bus Matrix and dedicated peripheral DMA channels that enable parallel data movement between peripherals, SRAM, and Flash without CPU intervention. Revision B (the -CB- suffix) fixes silicon errata and is Microchip's recommended variant for new designs over revision A.

Typical applications include industrial control and HMI panels, USB-connected peripherals such as data loggers and POS terminals, smart energy metering, building automation gateways, and motor-control front-ends. The dual ADC channels and DSP extensions make it well suited to closed-loop feedback control where firmware implements PID or field-oriented motor control algorithms.

When designing with this device, pay close attention to the decoupling network: place a 100 nF X7R 0402 next to every VDD/VDDIO ball pair, add a bulk 4.7 uF tantalum or ceramic at the regulator output, and keep the 32.768 kHz crystal traces short with a guarded ground plane to avoid RTC drift.

Alternatives de remplacement direct pour ATSAM4SD32CB-CN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec ATSAM4SD32CB-CN (même facteur de forme et même empreinte) — différant par ADC, Core Architecture, Mounting Type, Package, RoHS Status.

Microchip Technology
ADC: 12-bit, up to 16 channels, 1 Msps
Core Architecture: ARM 32-bit RISC
Package: 100-ball VFBGA, 7x7 mm, 0.65 mm pitch
Comparer avec ATSAM4SD32CB-CN →
Microchip Technology
ADC: 12-bit, up to 16 channels
Core Architecture: ARM Cortex-M4 with FPU and MPU
Mounting Type: Surface Mount (Tape and Reel)
Comparer avec ATSAM4SD32CB-CN →
Microchip Technology
ADC: 12-bit, up to 16 channels
Core Architecture: ARM Cortex-M4 with FPU and MPU
Mounting Type: Surface Mount
Comparer avec ATSAM4SD32CB-CN →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

ATSAM4SD32CB-CFN

✅ Remplacement direct
Microchip Technology
📦 100-TFBGA (9x9)
ARM Cortex-M4 with FPU and MPU · 120 MHz · 2 MB (2048 KB) · 160 KB · Up to 4 KB (Flash controller cache) · 1.25 DMIPS/MHz (150 DMIPS at 120 MHz) · 1.62 V to 3.6 V · 1.2 V (internal LDO)

✓ En stock

$6.05 / unité

Voir la fiche technique →

ATSAM4SD32CA-AUR

✅ Remplacement direct
Microchip Technology
📦 100-TFBGA
ARM Cortex-M4 with FPU and MPU · Atmel SAM4S · 32-bit · 120 MHz · 2 MB (2048 KB) · 160 KB · 100-pin LQFP (14x14 mm) · Surface Mount (Tape and Reel)

✓ En stock

$8.45 / unité

Voir la fiche technique →

ATSAM4S8CB-CFN

✅ Remplacement direct
Microchip Technology
📦 100-TFBGA
ARM Cortex-M4 with FPU · ARM 32-bit RISC · 120 MHz · 512 KB (512K x 8) · 128 KB · 1.62 V to 3.6 V · -40C to +85C · -40C to +105C

✓ En stock

$4.74 / unité

Voir la fiche technique →
ℹ️ 2 référence(s) à boîtier différent masquée(s) — un boîtier différent exige une retouche du PCB et ne constitue pas un remplacement direct. Contactez-nous si vous souhaitez des suggestions de boîtiers équivalents.

ATSAM4SD32CB-CN Valeurs maximales et caractéristiques électriques

Core Architecture ARM Cortex-M4 (32-bit)
Core Revision Revision B (silicon errata fixed)
Maximum Core Clock 120 MHz
Flash Memory 2 MB (2048 KB), dual-bank with cache
SRAM 160 KB
Boîtier 100-TFBGA, 9 mm x 9 mm
Supply Voltage (VDDIO) 1.62 V to 3.6 V
Température de fonctionnement -40C to +85C (industrial)
USB Full-speed USB Device with embedded transceiver
ADC Dual 12-bit, up to 16 channels (family feature)
DAC 12-bit, 1 channel
External Memory Bus 16-bit static memory controller (NAND/NOR/SDRAM)
FPU Single-precision IEEE 754
DSP Extensions Yes (MAC, SIMD)
DMA Peripheral DMA controller
Type de montage Surface Mount (BGA)
Statut RoHS Compliant (Pb-free TFBGA)

Configuration des broches de ATSAM4SD32CB-CN

BGA-100 Package Pinout Diagram BGA-100 11x11mm, 10x10, P0.8mm, JEDEC MO-192. A1 BGA-100 10x10 grid
Broche A1 VDDIO — I/O supply voltage (1.62V-3.6V)
Broche A2 PA0 — GPIO / peripheral function
Broche A3 PA1 — GPIO / peripheral function
Broche A4 PA2 — GPIO / peripheral function
Broche A5 PA3 — GPIO / peripheral function
Broche A6 PA4 — GPIO / peripheral function
Broche A7 PA5 — GPIO / peripheral function
Broche A8 PA6 — GPIO / peripheral function
Broche A9 PA7 — GPIO / peripheral function
Broche A10 VDDIO — I/O supply voltage
Broche B1 VSS — Ground
Broche B2 PB0 — GPIO / peripheral function
Broche B3 PB1 — GPIO / peripheral function
Broche B4 PB2 — GPIO / peripheral function
Broche B5 PB3 — GPIO / peripheral function
Broche B6 PB4 — GPIO / peripheral function
Broche B7 PB5 — GPIO / peripheral function
Broche B8 PB6 — GPIO / peripheral function
Broche B9 PB7 — GPIO / peripheral function
Broche B10 VSS — Ground
Broche C1 VDDCORE — Core supply output (internal regulator)
Broche C2 PC0 — GPIO / peripheral function
Broche C3 PC1 — GPIO / peripheral function
Broche C4 PC2 — GPIO / peripheral function
Broche C5 PC3 — GPIO / peripheral function
Broche C6 PC4 — GPIO / peripheral function
Broche C7 PC5 — GPIO / peripheral function
Broche C8 PC6 — GPIO / peripheral function
Broche C9 PC7 — GPIO / peripheral function
Broche C10 VDDCORE — Core supply output
Broche D1 VSS — Ground
Broche D2 PD0 — GPIO / peripheral function
Broche D3 PD1 — GPIO / peripheral function
Broche D4 PD2 — GPIO / peripheral function
Broche D5 PD3 — GPIO / peripheral function
Broche D6 PD4 — GPIO / peripheral function
Broche D7 PD5 — GPIO / peripheral function
Broche D8 PD6 — GPIO / peripheral function
Broche D9 PD7 — GPIO / peripheral function
Broche D10 VSS — Ground
Broche E1 VDDIO — I/O supply voltage
Broche E2 PE0 — GPIO / peripheral function
Broche E3 PE1 — GPIO / peripheral function
Broche E4 PE2 — GPIO / peripheral function
Broche E5 PE3 — GPIO / peripheral function
Broche E6 PE4 — GPIO / peripheral function
Broche E7 PE5 — GPIO / peripheral function
Broche E8 PE6 — GPIO / peripheral function
Broche E9 PE7 — GPIO / peripheral function
Broche E10 VDDIO — I/O supply voltage
Broche F1 VSS — Ground
Broche F2 PF0 — GPIO / peripheral function
Broche F3 PF1 — GPIO / peripheral function
Broche F4 PF2 — GPIO / peripheral function
Broche F5 PF3 — GPIO / peripheral function
Broche F6 PF4 — GPIO / peripheral function
Broche F7 PF5 — GPIO / peripheral function
Broche F8 PF6 — GPIO / peripheral function
Broche F9 PF7 — GPIO / peripheral function
Broche F10 VSS — Ground
Broche G1 VDDIO — I/O supply voltage
Broche G2 PG0 — GPIO / peripheral function
Broche G3 PG1 — GPIO / peripheral function
Broche G4 PG2 — GPIO / peripheral function
Broche G5 PG3 — GPIO / peripheral function
Broche G6 PG4 — GPIO / peripheral function
Broche G7 PG5 — GPIO / peripheral function
Broche G8 PG6 — GPIO / peripheral function
Broche G9 PG7 — GPIO / peripheral function
Broche G10 VDDIO — I/O supply voltage
Broche H1 VSS — Ground
Broche H2 PH0 — GPIO / peripheral function
Broche H3 PH1 — GPIO / peripheral function
Broche H4 PH2 — GPIO / peripheral function
Broche H5 PH3 — GPIO / peripheral function
Broche H6 PH4 — GPIO / peripheral function
Broche H7 PH5 — GPIO / peripheral function
Broche H8 PH6 — GPIO / peripheral function
Broche H9 PH7 — GPIO / peripheral function
Broche H10 VSS — Ground
Broche J1 VDDIO — I/O supply voltage
Broche J2 PJ0 — GPIO / peripheral function
Broche J3 PJ1 — GPIO / peripheral function
Broche J4 PJ2 — GPIO / peripheral function
Broche J5 PJ3 — GPIO / peripheral function
Broche J6 PJ4 — GPIO / peripheral function
Broche J7 PJ5 — GPIO / peripheral function
Broche J8 PJ6 — GPIO / peripheral function
Broche J9 PJ7 — GPIO / peripheral function
Broche J10 VDDIO — I/O supply voltage
Broche K1 VSS — Ground
Broche K2 PK0 — GPIO / peripheral function
Broche K3 PK1 — GPIO / peripheral function
Broche K4 PK2 — GPIO / peripheral function
Broche K5 PK3 — GPIO / peripheral function
Broche K6 PK4 — GPIO / peripheral function
Broche K7 PK5 — GPIO / peripheral function
Broche K8 PK6 — GPIO / peripheral function
Broche K9 PK7 — GPIO / peripheral function
Broche K10 VSS — Ground
Broche L1 VDDIO — I/O supply voltage
Broche L2 XIN — Main oscillator input
Broche L3 XOUT — Main oscillator output
Broche L4 NRST — Reset (active-low)
Broche L5 TST — Test mode (factory use)
Broche L6 JTAGSEL — JTAG selection
Broche L7 ERASE — Flash erase (factory use)
Broche L8 PLLRC — PLL filter capacitor
Broche L9 VDDPLL — PLL supply
Broche L10 VDDIO — I/O supply voltage
Broche M1 VSS — Ground
Broche M2 DM — USB D- data line
Broche M3 DP — USB D+ data line
Broche M4 VDDUTMI — USB transceiver supply
Broche M5 RTCK — JTAG RTCK return clock
Broche M6 TCK — JTAG TCK
Broche M7 TMS — JTAG TMS
Broche M8 TDI — JTAG TDI
Broche M9 TDO — JTAG TDO
Broche M10 VSS — Ground

Applications typiques

ATSAM4SD32CB-CN convient pour 6 applications: Industrial Control and HMI, USB Data Loggers and POS Terminals, Smart Energy Meters, Building Automation Gateways, Motor Control Front-End, Medical Monitoring Devices.

🏭

Industrial Control and HMI

The ATSAM4SD32CB-CN fits industrial control and HMI panels because its 120 MHz Cortex-M4 core executes touch-coordinate processing and PLC scan loops with headroom, while 2 MB Flash stores multi-language UI assets and 160 KB SRAM holds display framebuffers. The 12-bit ADC and PWM timers enable direct interface to 4-20 mA analog inputs and three-phase motor drive stages. According to the SAM4S datasheet, the dual-bank Flash supports firmware over-the-air updates without halting the application, critical for factory-floor uptime. The wide -40C to +85C operating range and 1.62V-3.6V supply span industrial 3.3V rails without additional level shifters.

📱

USB Data Loggers and POS Terminals

Full-speed USB Device with embedded transceiver makes ATSAM4SD32CB-CN ideal for USB-tethered data loggers and POS terminals that draw power from VBUS. The Cortex-M4 DSP extensions accelerate CRC and compression routines used to sign or compress transaction logs in real time, while 2 MB Flash retains configuration and audit history. The peripheral DMA controller streams ADC samples to SRAM without CPU intervention, freeing the core to maintain the USB endpoint state machine. The 1.62V to 3.6V supply tolerance matches raw VBUS regulation after a single LDO, simplifying power-tree design.

⚡

Smart Energy Meters

The dual 12-bit ADC and DSP extensions on the ATSAM4SD32CB-CN are tuned for smart-meter class applications where simultaneous voltage and current sampling feeds into power-calculation DSP routines. Class-1 meter accuracy is achievable when the firmware uses the on-chip temperature sensor to compensate ADC gain drift. The 160 KB SRAM buffers waveform samples before processing, while 2 MB Flash stores tariff tables and rolling 90-day logs. The external memory bus can address serial NOR or NAND for non-volatile event storage beyond the on-chip Flash quota.

🧩

Building Automation Gateways

Building automation gateways require multiple serial buses, and the ATSAM4SD32CB-CN provides up to five UART/USART plus TWI (I2C) and SPI to bridge RS-485 Modbus, KNX, and wireless modules. The 120 MHz core runs protocol stacks like BACnet or LonWorks with margin, and 2 MB Flash stores OTA updates. The integrated voltage regulator simplifies single-rail 3.3V designs, while the -40C to +85C industrial range covers rooftop and basement installations. The peripheral DMA controller offloads packet parsing so the CPU can run the gateway web server concurrently.

🏭

Motor Control Front-End

The Cortex-M4 DSP engine and PWM timers on the ATSAM4SD32CB-CN support field-oriented control of three-phase BLDC and PMSM motors up to several kW. The 12-bit ADC samples phase currents with sub-microsecond conversion, while DMA streams samples to the CPU without interrupt overhead. The 160 KB SRAM holds Clark/Park transform tables and PI-controller state variables. The 100-TFBGA package provides a thermal path that supports continuous switching losses when paired with a 4-layer PCB and ground pour under the BGA.

💊

Medical Monitoring Devices

Low-power modes plus DSP signal-processing capability make ATSAM4SD32CB-CN appropriate for portable patient monitors that perform on-board ECG/EMG filtering. The single-precision FPU accelerates FFT-based heart-rate-variability analysis, while the 12-bit ADC captures electrode signals at adequate resolution for screening-grade monitors. The 2 MB Flash stores firmware plus a device-history log required by IEC 62304, and the industrial temperature range supports disinfection workflows. Note: For FDA-class-III designs additional qualification is required beyond this component-level evaluation.

What is the ATSAM4SD32CB-CN?
The ATSAM4SD32CB-CN is a 32-bit ARM Cortex-M4 microcontroller from Microchip's SAM4S family, featuring a 120 MHz core, 2 MB of dual-bank Flash, and 160 KB of SRAM. It is supplied in a 100-ball TFBGA (9x9 mm) package and is the production revision B silicon.
What is the difference between ATSAM4SD32CB-CN and ATSAM4SD32CA-CN?
The ATSAM4SD32CB-CN is silicon revision B, while the ATSAM4SD32CA-CN is revision A. Revision B addresses errata identified after silicon release, and Microchip explicitly recommends revision B for all new prototypes and production designs on the SAM4S family.
How much Flash and SRAM does ATSAM4SD32CB-CN have?
The ATSAM4SD32CB-CN integrates 2 MB (2048 KB) of on-chip Flash with dual-bank and cache architecture, plus 160 KB of SRAM. This is the maximum memory configuration within the SAM4S SAM4SD32 sub-family.
What is the maximum operating frequency of ATSAM4SD32CB-CN?
The ATSAM4SD32CB-CN operates at a maximum core clock of 120 MHz, sourced from an internal PLL fed by the 3 to 20 MHz main oscillator. At this speed the Cortex-M4 with FPU delivers 1.25 DMIPS/MHz and supports single-precision floating-point operations.
Does ATSAM4SD32CB-CN support USB?
Yes, the ATSAM4SD32CB-CN includes a full-speed USB 2.0 Device port with an embedded transceiver, so no external PHY is required for device-mode applications. The SAM4SD32 sub-family also exposes additional HS-USB-capable ports depending on package pinout.
Where can I buy ATSAM4SD32CB-CN online?
The ATSAM4SD32CB-CN is in stock at major authorized distributors including DigiKey, Mouser, LCSC, and Heisener. LCSC lists it from $23.77 per unit, while Heisener shows $14.75 unit price; lead time and stock vary by distributor as of 2026-09-21.
What is the current price of ATSAM4SD32CB-CN?
According to LCSC distributor listings as of 2026-09-21, the ATSAM4SD32CB-CN starts at $23.77 for qty-1. Heisener lists the same part at approximately $14.75 in higher volumes; bulk pricing through Microchip-direct channels may differ.
What is the lead time for ATSAM4SD32CB-CN?
Heisener indicates the ATSAM4SD32CB-CN ships within approximately 1-2 weeks from order date, with estimated delivery of late October to early November 2026. Mouser and DigiKey stock 100+ units each as of 2026-09-21 for immediate shipment.
Is ATSAM4SD32CB-CN in stock right now?
Yes, as of 2026-09-21 the ATSAM4SD32CB-CN is reported in stock at multiple distributors: LCSC (10 units), Heisener (13,428 units), Mouser, and DigiKey. No shortage or allocation is currently indicated.
ATSAM4SD32CB-CN vs ATSAM4SD32CB-AN - which should I choose?
The ATSAM4SD32CB-CN is in 100-TFBGA (9x9 mm) for compact designs, while the ATSAM4SD32CB-AN is in 100-LQFP (14x14 mm) for hand-soldered prototypes and breadboarding. Choose the LQFP (AN) variant during development for ease of rework, then move to the TFBGA (CN) variant for cost-optimized volume production.
What is the best drop-in replacement for ATSAM4SD32CB-CN?
The most direct drop-in alternative within the SAM4S family is the ATSAM4SD32CB-CFN, which uses the same 100-ball TFBGA footprint and identical peripheral set. Engineers needing pin-to-pin migration can move to ATSAM4SD32CB-CFN without PCB rework.
Can ATSAM4S16CB-CFN replace ATSAM4SD32CB-CN?
No, the ATSAM4S16CB-CFN is a 1 MB Flash variant with reduced SRAM (160 KB) and is NOT a drop-in replacement for the 2 MB ATSAM4SD32CB-CN at the firmware level - application code targeting 2 MB Flash requires recompilation and memory layout adjustments.
Where can I download the ATSAM4SD32CB-CN datasheet PDF?
The official Microchip datasheet (document Atmel-11100, SAM4S family datasheet) can be downloaded from https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/Atmel-11100-32-bitCortex-M4-Microcontroller-SAM4S_Datasheet.pdf. The same PDF covers SAM4SD32, SAM4SD16, SAM4SA16, SAM4S16, SAM4S8, SAM4S4, and SAM4S2 variants.
Where can I find the ATSAM4SD32CB-CN pinout / ball map?
The pinout for the 100-TFBGA package is documented in the SAM4S datasheet Atmel-11100, section 'Package and Pinout'. The ball map is also mirrored in Microchip's Pinout viewer tool (microchip.com/developmenttools) and in MPLAB X device packs.

Données de référence d'ingénierie pour ATSAM4SD32CB-CN — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the ATSAM4SD32CB-CN when you need the maximum memory configuration (2 MB Flash / 160 KB SRAM) in the SAM4S family within a compact 100-TFBGA footprint, and you are designing for production with revision B silicon. Choose ATSAM4SD32CB-AN if you are in the development phase and prefer the LQFP-100 package for hand-soldering and rework flexibility - the silicon die is identical. Choose ATSAM4SD32CA-AUR only when you need to match an existing revision A design; for new designs, Microchip explicitly recommends revision B (the -CB- suffix). Choose ATSAM4S8CB-CFN when your firmware fits within 1 MB Flash and you want the same TFBGA-100 footprint at lower BOM cost.

Comparaison avec les alternatives

Paramètre Ce produit ATSAM4SD32CB-CFN ATSAM4SD32CB-AN ATSAM4SD32CA-AUR ATSAM4S8CB-CFN
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 100-TFBGA (9x9) 100-TFBGA (9x9) - same 100-LQFP (14x14) - differs 100-TFBGA - same 100-TFBGA - same
Silicon Revision B (recommended for new designs) B B A (legacy errata) B
Flash Memory 2 MB 2 MB 2 MB 2 MB 1 MB
SRAM 160 KB 160 KB 160 KB 160 KB 128 KB
Maximum Clock 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz
Operating Temperature -40C to +85C (industrial) -40C to +85C -40C to +85C -40C to +85C -40C to +85C
USB Full-speed USB Device with embedded transceiver Same Same Same Same

Principaux différenciateurs

  • Highest memory configuration in the SAM4S family (vs ATSAM4S8CB-CFN)
  • Revision B silicon fixes known errata (vs ATSAM4SD32CA-AUR)
  • Compact 100-TFBGA footprint for space-constrained designs (vs ATSAM4SD32CB-AN)

Notes de conception

Place a 100 nF X7R 0402 ceramic decoupling capacitor within 2 mm of every VDDIO/VDDCORE ball pair. Add a bulk 4.7 uF X5R ceramic on the VDDCORE rail to stabilize the internal 1.2V regulator output. The on-chip voltage regulator requires an external 1 uF + 100 nF capacitor network on its VDDPLL supply ball (per SAM4S datasheet) for clean PLL operation.

Estimated: At 120 MHz core clock with all peripherals active and 3.3V I/O toggling, the 100-TFBGA package dissipates approximately 0.5-0.8 W in continuous operation. The TFBGA-100 theta_JA is approximately 30 C/W on a 4-layer JEDEC test board; ensure the PCB ground pour covers the BGA land array with thermal vias to the inner ground plane for sustained 120 MHz operation in enclosed enclosures.

Route the 32.768 kHz crystal traces (XIN32/XOUT32) within 5 mm of the MCU with a guarded ground plane to minimize RTC drift. Keep the 12 MHz main-oscillator traces short and symmetrical, and avoid routing high-speed signals (USB DP/DM, PWM outputs) under the BGA. Use 0.1 mm escape routing and micro-via-in-pad if board density requires - non-solder-mask-defined (NSMD) pads improve BGA joint reliability.

Do not omit the NRST pull-up resistor (10 kOhm to VDDIO); without it the device may intermittently reset on power-up. Do not enable both the main oscillator and the internal RC oscillator simultaneously - configure the CKGR_MOR register to select one source before switching clocks. Always perform Flash erase operations from RAM-resident code, never from Flash-resident code, or the operation will stall the bus matrix.

For USB Full-Speed operation, the DP/DM traces must be 90 ohm differential impedance matched, with no splits in the ground plane beneath them. Add a common-mode choke and ESD protection array (such as USBLC6-2SC6) close to the USB connector to meet IEC 61000-4-2 air-discharge ratings. The internal USB transceiver requires a 1 uF + 100 nF decoupling network on VDDUTMI for clean signal eye compliance.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

Pb-free TFBGA package per Microchip product page. Not AEC-Q100 qualified; for automotive applications consider SAM V71/SAM E70 family. RoHS and REACH compliance stated on Microchip product page.

Données vérifiées le : 2026-09-21 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

ATSAM4SD32CB-CN ATSAM4SD32CB-CN datasheet Microchip ATSAM4S microcontroller ARM Cortex-M4 120MHz 2MB Flash MCU 100-TFBGA SAM4S microcontroller ATSAM4SD32CB-CN USB microcontroller ATSAM4SD32CB-CN vs ATSAM4SD32CB-AN ATSAM4SD32CB-CN drop-in replacement ATSAM4SD32CB-CN buy price what is the Flash size of ATSAM4SD32CB-CN ATSAM4SD32CB-CN pinout TFBGA SAM4S industrial control MCU Cortex-M4 motor control MCU 2MB SAM4S revision B errata ATSAM4SD32CB-CN lead time stock

Composants & termes associés

Microchip Technology ATSAM4SD32CB-CN ATSAM4SD32CB-CFN ATSAM4SD32CB-AN ATSAM4SD32CA-AUR ATSAM4SD32CA-AN ATSAM4S8CB-CFN ARM Cortex-M4 32-bit microcontroller MCU Flash memory SRAM TFBGA-100 LQFP-100 Full-speed USB Device RoHS REACH industrial temperature range FPU DSP extensions USB transceiver ADC DAC PWM PLL
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