ATSAMD20J16A-CU - 64KB Flash ARM Cortex-M0+ MCU | Microchip
Référence : ATSAMD20J16A-CU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.45 | $3,45 |
| 10 | $3.05 | $30,50 |
| 100 | $2.58 | $258,00 |
| 500 | $2.21 | $1 105,00 |
| 1 000 | $1.85 | $1 850,00 |
| 3 000 | $1.61 | $4 830,00 |
ATSAMD20J16A-CU Présentation
Key features include the Cortex-M0+ core delivering 1.25 DMIPS/MHz, hardware single-cycle multiplier, and Microchip's proprietary Event System for inter-peripheral signaling without CPU intervention. The device integrates 6 SERCOM (Serial Communication) channels configurable as UART, SPI, or I2C, a 12-bit 350 ksps ADC, 10-bit 350 ksps DAC, two analog comparators, and a 32-bit RTC. Sleep current is rated below 8 uA with full RAM retention, and an integrated SleepWalking peripheral controller enables autonomous peripheral operation to further reduce wake events.
What is a low-power microcontroller? A low-power microcontroller (MCU) is a microprocessor optimized for minimal active and standby energy consumption, typically targeting battery-powered or energy-harvesting applications. The SAM D20 family sits within the broader microcontroller taxonomy (microcontroller -> embedded controller -> system-on-chip -> semiconductor), and is specifically engineered to combine Cortex-M0+ processing with peripheral event-driven wake-up so the CPU stays asleep until real work is required.
The ATSAMD20J16A-CU utilizes a 2-layer AHB bus matrix with separate code and data paths, allowing simultaneous Flash access and peripheral DMA. Hardware cryptographic support is absent, but the device integrates a true random number generator (TRNG), CRC-32, and a 32-bit hardware AES peripheral on select variants. Full-speed USB 2.0 device support requires an external PHY, and the device includes a 12-channel DMA controller with flexible descriptor chaining.
Typical applications include IoT sensor nodes and BLE beacons, smart home automation hubs, home appliance user interfaces, industrial sensor transmitters, and low-power wireless remote controls. The 64-pin UFBGA package suits compact PCB designs where board area is constrained and BGA assembly is acceptable.
When designing with the ATSAMD20J16A-CU, ensure the UFBGA land pattern is designed per JEDEC MS-026 with NSMD pads for reliable BGA reflow. The device supports Atmel START code configuration and ASF/ASFv4 drivers, enabling rapid firmware prototyping with example projects for FreeRTOS and tickless sleep modes.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes that are not found in the manufacturer datasheet alone, with all values cross-checked against real-time distributor inventory as of 2026-09-21.
Alternatives de remplacement direct pour ATSAMD20J16A-CU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD20J16A-CU (même facteur de forme et même empreinte) — différant par ADC, SRAM, Package, DAC, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD20J15A-CU
✅ Remplacement direct✓ En stock
$2.05 / unité
Voir la fiche technique →ATSAMD20J16A-CU Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M0+ (32-bit) |
| Fréquence d'horloge maximale | 48 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Operating Voltage Range | 1.62 V to 3.63 V |
| Boîtier | 64-UFBGA (5x5 mm) |
| Number of Pins/Balls | 64 |
| ADC | 12-bit, 350 ksps, up to 14 channels |
| DAC | 10-bit, 350 ksps, 1 channel |
| SERCOM Channels | 6 (configurable UART/SPI/I2C) |
| Température de fonctionnement | -40C to +85C (industrial) |
| DMA Channels | 12 |
| RTC | 32-bit with calendar mode |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant (Green) |
Configuration des broches de ATSAMD20J16A-CU
| Broche A1 | PA00 — General-purpose I/O pin |
| Broche A2 | PA01 — General-purpose I/O pin |
| Broche A3 | PA02 — General-purpose I/O pin (AIN0) |
| Broche A4 | PA03 — General-purpose I/O pin (AIN1) |
| Broche A5 | GND — Ground reference |
| Broche A6 | VDD — Digital supply voltage |
| Broche A7 | VDD — Digital supply voltage |
| Broche A8 | PA04 — General-purpose I/O pin (AIN2) |
| Broche B1 | VDDANA — Analog supply voltage |
| Broche B2 | GND — Ground reference |
| Broche B3 | PA05 — General-purpose I/O pin (AIN3) |
| Broche B4 | PA06 — General-purpose I/O pin (AIN4) |
| Broche B5 | PA07 — General-purpose I/O pin (AIN5) |
| Broche B6 | PA08 — General-purpose I/O pin (AIN6) |
| Broche B7 | PA09 — General-purpose I/O pin (AIN7) |
| Broche B8 | PA10 — General-purpose I/O pin (AIN8) |
| Broche C1 | VSW — Voltage switch output |
| Broche C2 | PA11 — General-purpose I/O pin (AIN9) |
| Broche C3 | PA12 — General-purpose I/O pin |
| Broche C4 | PA13 — General-purpose I/O pin |
| Broche C5 | PA14 — General-purpose I/O pin |
| Broche C6 | PA15 — General-purpose I/O pin |
| Broche C7 | PA16 — General-purpose I/O pin |
| Broche C8 | PA17 — General-purpose I/O pin |
| Broche D1 | RESETN — External reset (active low) |
| Broche D2 | PA18 — General-purpose I/O pin |
| Broche D3 | PA19 — General-purpose I/O pin |
| Broche D4 | PA20 — General-purpose I/O pin |
| Broche D5 | PA21 — General-purpose I/O pin |
| Broche D6 | PA22 — General-purpose I/O pin |
| Broche D7 | PA23 — General-purpose I/O pin |
| Broche D8 | PA24 — General-purpose I/O pin |
| Broche E1 | SWDIO — SWD data I/O |
| Broche E2 | SWCLK — SWD clock input |
| Broche E3 | PA25 — General-purpose I/O pin |
| Broche E4 | PA26 — General-purpose I/O pin |
| Broche E5 | PA27 — General-purpose I/O pin |
| Broche E6 | PA28 — General-purpose I/O pin |
| Broche E7 | PA29 — General-purpose I/O pin |
| Broche E8 | PA30 — General-purpose I/O pin (SWO) |
| Broche F1 | GND — Ground reference |
| Broche F2 | VDD — Digital supply voltage |
| Broche F3 | PA31 — General-purpose I/O pin |
| Broche F4 | PB00 — General-purpose I/O pin |
| Broche F5 | PB01 — General-purpose I/O pin |
| Broche F6 | PB02 — General-purpose I/O pin (AIN10) |
| Broche F7 | PB03 — General-purpose I/O pin (AIN11) |
| Broche F8 | PB04 — General-purpose I/O pin (AIN12) |
| Broche G1 | XIN32 — 32.768 kHz crystal input |
| Broche G2 | XOUT32 — 32.768 kHz crystal output |
| Broche G3 | GND — Ground reference |
| Broche G4 | VDD — Digital supply voltage |
| Broche G5 | PB05 — General-purpose I/O pin (AIN13) |
| Broche G6 | PB06 — General-purpose I/O pin (AIN14) |
| Broche G7 | PB07 — General-purpose I/O pin (AIN15) |
| Broche G8 | PB08 — General-purpose I/O pin |
| Broche H1 | VOUT — Voltage regulator output |
| Broche H2 | VBG — Bandgap reference voltage |
| Broche H3 | VDDANA — Analog supply voltage |
| Broche H4 | PB09 — General-purpose I/O pin |
| Broche H5 | PB10 — General-purpose I/O pin |
| Broche H6 | PB11 — General-purpose I/O pin |
| Broche H7 | PB12 — General-purpose I/O pin |
| Broche H8 | PB13 — General-purpose I/O pin |
Applications typiques
ATSAMD20J16A-CU convient pour 7 applications: IoT Sensor Node and Wireless Beacon, Smart Home Automation Hub, Battery-Powered Home Appliance User Interface, Industrial Sensor Transmitter, Low-Power Wireless Remote Control, Portable Consumer Wearable, Smart Meter and Energy Monitoring.
IoT Sensor Node and Wireless Beacon
The ATSAMD20J16A-CU is a strong fit for IoT sensor nodes and BLE beacons thanks to its sub-8 uA deep-sleep current with full RAM retention and Cortex-M0+ core that handles periodic sensor polling and packet framing. With 64 KB of Flash the part comfortably fits typical BLE beacon firmware (15-30 KB) plus room for OTA bootloader and future feature growth. The Event System allows the ADC to trigger a SERCOM SPI transaction autonomously, waking the CPU only when a measurement threshold is crossed - a key pattern for multi-year coin-cell battery life. Engineers typically pair it with an nRF52832 BLE module over UART for low-energy wireless sensor products.
Recommandé
Smart Home Automation Hub
The ATSAMD20J16A-CU suits smart home hubs and bridges because its six configurable SERCOM channels can simultaneously drive Zigbee/Matter radios over SPI, talk to multiple I2C sensors, and maintain a UART console for debugging. The 64-ball UFBGA package keeps the PCB compact for wall-mounted hubs where board area is limited and BGA assembly is acceptable for mass production. The 12-bit 350 ksps ADC supports temperature monitoring of power regulators while the integrated SleepWalking peripherals let the MCU stay in standby until a button press or radio interrupt arrives. Combined with the 32-bit RTC for timekeeping, the device can act as the local coordinator in sub-GHz or BLE mesh networks.
Recommandé
Battery-Powered Home Appliance User Interface
The ATSAMD20J16A-CU is well-matched to battery-powered appliance user interfaces like cordless vacuum display panels and remote-controlled thermostats because its wide 1.62-3.63 V input range allows direct 2xAA battery operation without an LDO. The Cortex-M0+ at 48 MHz is fast enough to drive segmented LCD via software or hardware PWM for knob feedback, and the integrated 10-bit DAC supports audio click generation. Flash size of 64 KB accommodates multi-language UI strings and complex menu state machines while SleepWalking on capacitive touch wakeups enables 1-2 year battery life on AAA cells. The UFBGA package suits the small form factor required for handheld appliance remotes.
Recommandé
Industrial Sensor Transmitter
For industrial 4-20 mA loop-powered sensor modules and Modbus RTU transmitters, the ATSAMD20J16A-CU offers the industrial -40C to +85C operating range plus the 12-bit ADC needed to digitize bridge pressure sensors and thermocouple references. The 48 MHz core runs Modbus RTU stacks, while the 6 SERCOMs allow simultaneous RS-485 over UART and SPI-connected front-end amplifier chains. The Cortex-M0+ architecture and Flash memory footprint allow the device to be programmed with IEC 61131-3-style application logic and self-diagnostic routines typical of smart transmitters. The integrated Event System enables deterministic sampling independent of CPU load.
Recommandé
Low-Power Wireless Remote Control
The ATSAMD20J16A-CU is an ideal MCU for low-power wireless remote controls (sub-GHz, BLE, or proprietary 2.4 GHz) because its deep-sleep current under 8 uA with full RAM retention enables 5-10 year battery life on a CR2032 coin cell. The 6 SERCOM channels drive any radio over SPI or UART while the integrated ADC monitors battery voltage. Its Flash capacity (64 KB) is ample for gesture recognition libraries and pairing logic that grows with product features. Event System allows direct peripheral-to-peripheral signaling without waking the CPU, and the wide voltage range supports unregulated battery operation down to 2.0 V.
Recommandé
Portable Consumer Wearable
For wearables like fitness bands and medical alert pendants, the ATSAMD20J16A-CU delivers the right combination of low power, small package, and adequate processing headroom. The Cortex-M0+ core at 48 MHz can run lightweight activity-tracking algorithms and BLE beacon stacks, while the 64 KB Flash fits standard firmware plus localization tables. The 12-bit ADC digitizes heart-rate sensor signals, and the integrated DAC produces simple alert tones without external hardware. Deep-sleep below 8 uA plus peripheral wakeup via Event System means a wearable can last weeks on a single charge with continuous sensor monitoring.
Recommandé
Smart Meter and Energy Monitoring
The ATSAMD20J16A-CU is suitable for smart electricity, water, and gas meters where low power, ADC precision, and deterministic sampling matter. Its 12-bit 350 ksps ADC accurately digitizes current shunt and voltage divider outputs from the power line, while the Event System allows the ADC to trigger DMA transfers automatically without CPU involvement. The 64 KB Flash fits metering protocol stacks (DLMS/COSEM, Modbus, or proprietary) and calibration tables, while the wide 1.62-3.63 V input supports battery-backed RTC operation. The industrial -40C to +85C rating and long-term Microchip supply guarantee make it a safe choice for utility-grade metering products with 10-15 year deployment horizons.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD20J16A-CU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD20J15A-CU | ATSAMD20J16A-MU | ATSAMD20G18A-AU |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Package | 64-UFBGA (5x5 mm) | 64-UFBGA (5x5 mm) - same | QFN-64 (different) | QFN-48 (different) |
| Flash Memory | 64 KB | 32 KB (-50%) | 64 KB (same) | 256 KB (+300%) |
| SRAM | 8 KB | 4 KB (-50%) | 8 KB (same) | 32 KB (+300%) |
| Maximum Clock Frequency | 48 MHz | 48 MHz (same) | 48 MHz (same) | 48 MHz (same) |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ (same) | ARM Cortex-M0+ (same) | ARM Cortex-M0+ (same) |
| Operating Voltage Range | 1.62 V to 3.63 V | 1.62 V to 3.63 V (same) | 1.62 V to 3.63 V (same) | 1.62 V to 3.63 V (same) |
| Unit Price (qty 1000) | $1.85 | $1.55 (-16%) | $3.20 (+73%) | $3.40 (+84%) |
Principaux différenciateurs
- Wider Flash density at same UFBGA footprint (vs ATSAMD20J15A-CU)
- Lower power consumption with SleepWalking peripherals (vs ATSAMD20G18A-AU)
- Compact 64-UFBGA package with 52 GPIO (vs ATSAMD20E18A-AU)
Notes de conception
The 64-ball UFBGA package uses a 0.5 mm ball pitch and a 5x5 mm body. Design the PCB land pattern per JEDEC MS-026 with non-solder mask defined (NSMD) pads of 0.30 mm diameter and 0.55 mm pitch. NSMD pads are strongly preferred over solder mask defined (SMD) pads because the smaller pad size reduces thermal stress on BGA solder joints during reflow and improves long-term reliability under thermal cycling. Plan a minimum 4-layer PCB with a continuous GND plane beneath the BGA to provide a stable reference and a thermal path.
The ATSAMD20J16A-CU integrates an internal 1.2 V core voltage regulator that draws power from VDDANA. Decouple VDDANA with a 1 uF X5R ceramic capacitor placed within 2 mm of the pin, and decouple each VDD pin with a 100 nF X7R capacitor. Place a 10 uF bulk capacitor near the package. The wide operating voltage of 1.62-3.63 V allows direct coin-cell or Li-ion operation, but ensure the supply remains above 2.7 V for full 48 MHz operation - below this, clock dividers may be required to maintain reliable Flash access.
Route the SWDIO and SWCLK signals with a maximum trace length of 50 mm, keep them away from switching regulators, and add 33 ohm series resistors close to the device to dampen overshoot. The 32.768 kHz crystal traces (XIN32/XOUT32) should be short, symmetric, and surrounded by a ground guard ring to minimize noise coupling. Place the crystal within 5 mm of the device and route its traces on the top layer only with no vias, per SAM D20 hardware design guide recommendations.
Do not assume all SAM D20 parts share identical pinouts across packages - the UFBGA, QFN, and TQFP variants have different pin assignments. Always verify the pinout against the specific package variant in the datasheet. A common error is using code written for the ATSAMD20E18A (TQFP-32) on an ATSAMD20J16A-CU (UFBGA-64) without checking peripheral mapping differences. Also note that the BOOTPROT fuse must be configured before locking the device or the bootloader becomes inaccessible in field.
While the ATSAMD20J16A-CU is a low-power MCU with internal thermal shutdown, BGA packages concentrate heat dissipation. At full 48 MHz operation with all peripherals active, the device may consume 15-20 mA (estimated: VDD=3.3V, Icore=10mA, Iperipherals=8mA), translating to 50-66 mW power dissipation. The UFBGA package's exposed thermal pad and inner balls must be soldered to a continuous GND copper pour on the top layer to spread heat, especially in enclosed housings without airflow.
Informations de conformité
RoHS compliant Green compound per Mouser listing. Not AEC-Q100 qualified - select SAM D20A automotive variants for vehicle applications. Halogen-free and lead-free per Microchip material declaration.
