ATSAMD21G15B-AF - 48MHz Cortex-M0+ MCU, 32KB Flash | Microchip
Référence : ATSAMD21G15B-AF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.2 | $3,20 |
| 10 | $2.88 | $28,80 |
| 100 | $2.55 | $255,00 |
| 500 | $2.27 | $1 135,00 |
| 1 000 | $2.04 | $2 040,00 |
| 3 000 | $1.78 | $5 340,00 |
ATSAMD21G15B-AF Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, peripherals, and I/O into one package. The Cortex-M0+ is the smallest and most energy-efficient member of the ARM Cortex-M processor family, designed for deterministic real-time embedded applications. The SAM D21 series sits in the broader Microchip Atmel SMART portfolio, providing 32-bit performance with low-power SleepWalking peripherals, a 12-channel DMA controller, and a 12-channel Event System for inter-peripheral signalling without CPU intervention.
Key features include 32 KB Flash and 4 KB SRAM, up to 38 GPIO, six SERCOM interfaces that can be configured as UART, SPI, or I2C, a 12-bit 350 kSPS ADC with up to 14 channels, two 16-bit Timer/Counters and one 24-bit TC, an RTC, and a 10-channel 16-bit PWM. The device also provides a 12-bit DAC, a touch controller (PTC), and a Full-Speed USB 2.0 device with embedded PHY. The integrated DFLL48M and a 96 MHz Fractional Digital Phase-Locked Loop allow precise baud-rate generation and audio-clock synthesis.
Architecturally, the SAM D21G uses a single-cycle hardware multiplier, a single 32-bit bus matrix, and a Nested Vector Interrupt Controller (NVIC) for deterministic interrupt latency. Peripherals are clock-gated via the Power Manager and routed through the Event System to keep the CPU in sleep until needed. This combination delivers benchmark energy efficiency (CoreMark/mA) substantially better than 8-bit/16-bit MCUs while preserving the simplicity expected from an M0+ core.
Typical applications include USB Human Interface Devices (HID), consumer wearables, low-cost sensor hubs, battery-powered IoT nodes, industrial control panels, and home appliances. The combination of USB, ample analog, and low-power sleep modes (IDLE, STANDBY, BACKUP) makes it well-suited to mains- or battery-powered products where BOM cost is critical.
Designers should note that the SAM D21G is pin-compatible with the SAM D20G family, allowing upgrades from M0+ to higher Flash/RAM SKUs without PCB changes. The internal 1 V LDO requires a 1 µF + 100 nF decoupling network on VDDIN, and VDDCORE requires a 1 µF + 100 nF bulk. Unused pins should be left floating or pulled to a defined state to avoid leakage.
This page synthesizes distributor stock, drop-in alternatives, and practical design notes not always present in the manufacturer datasheet. Sources include DigiKey, Mouser, Microchip's product page, and the SAM D21/DA1 family datasheet, as of 2026-09-21.
Alternatives de remplacement direct pour ATSAMD21G15B-AF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD21G15B-AF (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, RoHS Status, DAC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD21G16B-AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD21G17B-AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD21G18B-AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD21G15B-AU
✅ Remplacement direct✓ En stock
$1.65 / unité
Voir la fiche technique →ATSAMD21G15B-AFT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD21G15B-AF Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M0+ (32-bit) |
| Family | SAM D21G (Atmel SMART) |
| Maximum CPU Clock | 48 MHz |
| Program Memory (Flash) | 32 KB (32K x 8) |
| Data Memory (SRAM) | 4 KB |
| Operating Voltage (VDDIN) | 1.62 V to 3.63 V |
| Number of I/O Pins | 38 |
| Boîtier | 48-TQFP (7x7 mm) |
| Température de fonctionnement | -40 °C to +125 °C |
| Communication Interfaces | 6x SERCOM (UART/SPI/I2C), USB 2.0 Full-Speed Device |
| ADC | 12-bit, up to 350 kSPS, up to 14 channels |
| DAC | 10-bit, 1 channel |
| Timers | Two 16-bit TC, one 24-bit TC, one RTC |
| PWM Channels | 10 (16-bit) |
| DMA | 12-channel DMAC |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMD21G15B-AF
| Broche 1 | PA00 — General-purpose I/O / XIN32 |
| Broche 2 | PA01 — General-purpose I/O / XOUT32 |
| Broche 3 | PA02 — General-purpose I/O / AIN0 |
| Broche 4 | PA03 — General-purpose I/O / AIN1 / VREFA |
| Broche 5 | GND — Ground |
| Broche 6 | VDDIN — Voltage regulator input (1.62-3.63 V) |
| Broche 7 | VDDOUT — Voltage regulator output (1.2 V core) |
| Broche 8 | PA04 — General-purpose I/O / AIN2 |
| Broche 9 | PA05 — General-purpose I/O / AIN3 |
| Broche 10 | PA06 — General-purpose I/O |
| Broche 11 | PA07 — General-purpose I/O |
| Broche 12 | VDDCORE — Core voltage decoupling |
| Broche 13 | PA08 — General-purpose I/O / NMI |
| Broche 14 | PA09 — General-purpose I/O |
| Broche 15 | PA10 — General-purpose I/O |
| Broche 16 | PA11 — General-purpose I/O |
| Broche 17 | PA12 — General-purpose I/O |
| Broche 18 | PA13 — General-purpose I/O |
| Broche 19 | PA14 — General-purpose I/O |
| Broche 20 | PA15 — General-purpose I/O |
| Broche 21 | PA16 — General-purpose I/O |
| Broche 22 | PA17 — General-purpose I/O |
| Broche 23 | PA18 — General-purpose I/O |
| Broche 24 | PA19 — General-purpose I/O |
| Broche 25 | PA20 — General-purpose I/O |
| Broche 26 | PA21 — General-purpose I/O |
| Broche 27 | PA22 — General-purpose I/O |
| Broche 28 | PA23 — General-purpose I/O / USB SOF |
| Broche 29 | PA24 — General-purpose I/O / USB_DM |
| Broche 30 | PA25 — General-purpose I/O / USB_DP |
| Broche 31 | GND — Ground |
| Broche 32 | VDDIO — I/O voltage supply |
| Broche 33 | PA26 — General-purpose I/O |
| Broche 34 | PA27 — General-purpose I/O |
| Broche 35 | PA28 — General-purpose I/O |
| Broche 36 | PA29 — General-purpose I/O |
| Broche 37 | PA30 — General-purpose I/O / SWCLK |
| Broche 38 | PA31 — General-purpose I/O / SWDIO |
| Broche 39 | PB00 — General-purpose I/O |
| Broche 40 | PB01 — General-purpose I/O |
| Broche 41 | PB02 — General-purpose I/O / AIN10 |
| Broche 42 | PB03 — General-purpose I/O / AIN11 |
| Broche 43 | PB04 — General-purpose I/O / AIN12 |
| Broche 44 | PB05 — General-purpose I/O / AIN13 |
| Broche 45 | PB06 — General-purpose I/O |
| Broche 46 | PB07 — General-purpose I/O |
| Broche 47 | PB08 — General-purpose I/O |
| Broche 48 | PB09 — General-purpose I/O |
Applications typiques
ATSAMD21G15B-AF convient pour 7 applications: USB HID Devices (Keyboards, Mice, Custom Input), Wearable Fitness Bands and Health Sensors, Industrial Sensor Hubs and PLC I/O Modules, Home Appliance Control Boards, Battery-Powered IoT Edge Nodes, Smart Home Gateway Accessories, Automotive Interior Lighting and HMI.
USB HID Devices (Keyboards, Mice, Custom Input)
The ATSAMD21G15B-AF is a strong fit for USB HID products. Its integrated USB 2.0 Full-Speed device peripheral with on-chip PHY eliminates external USB transceivers, while 32 KB Flash and 4 KB SRAM easily host the LUFA or Microchip USB stack plus HID report descriptors. At 48 MHz the Cortex-M0+ has ample headroom for keyboard matrix scanning, debounce logic, and LED animation. The 1.62-3.63 V supply range supports bus-powered designs. Compared with 8-bit MCUs, the M0+ core delivers 3-4x CoreMark/mA and simplifies USB stack porting.
Recommandé
Wearable Fitness Bands and Health Sensors
In wearables, the ATSAMD21G15B-AF's SleepWalking peripherals and Event System let I2C sensors wake the CPU only on relevant data, preserving battery life. The 12-bit 350 kSPS ADC and 14 input channels support multi-sensor front-ends (heart rate, SpO2, temperature), while 4 KB SRAM is sufficient for short FIFO buffers and step-count algorithms. The 1.62 V minimum supply allows direct coin-cell operation. Per the SAM D21 family datasheet, BACKUP mode drops current to under 1 µA, suitable for always-on wearables shipped with primary batteries rated for 6+ months.
Recommandé
Industrial Sensor Hubs and PLC I/O Modules
The ATSAMD21G15B-AF suits industrial sensor hubs thanks to its 125 °C maximum junction temperature and 38 GPIO that can drive multiple 4-20 mA loops, opto-isolators, and relay coils. The 12-channel Event System routes GPIO and timer events without CPU intervention, freeing the M0+ core for diagnostics and Modbus RTU. The 6 SERCOM interfaces provide UART for fieldbus, SPI for ADC/DAC, and I2C for EEPROM and RTC. Robust ESD and the 7x7 mm TQFP package fit standard 25 mm DIN-rail carrier layouts.
Recommandé
Home Appliance Control Boards
For consumer white goods and HVAC control boards, the ATSAMD21G15B-AF balances cost and capability. The 6 SERCOM and 10 PWM channels drive BLDC motors for fans and compressors, while the 12-bit ADC reads thermistor inputs and current-sensing shunts. The TQFP-48 footprint is well-established in hand-solder-friendly 0.5 mm pitch, simplifying factory rework. The Cortex-M0+ supports FreeRTOS for multi-tasking UI, motor control, and safety, with 4 KB SRAM running typical small RTOS workloads at idle.
Recommandé
Battery-Powered IoT Edge Nodes
Battery-powered IoT edge nodes benefit from the ATSAMD21G15B-AF's low-power modes (IDLE < 5 µA/MHz, STANDBY < 2 µA, BACKUP < 1 µA) and Event System wake-on-peripheral capability. A typical node pairs an SPI LoRa or BLE module with I2C environmental sensors; the MCU wakes the radio only on sensor data ready, sleeping the rest of the time. 32 KB Flash hosts a LoRaWAN or BLE stack, and 4 KB SRAM holds short sensor frames. The 1.62 V minimum allows use with discharged Li-coin primaries down to 2.0 V.
Recommandé
Smart Home Gateway Accessories
Smart-home gateways and accessories (Zigbee/BLE coordinators, edge AI sensor pre-processors) can use the ATSAMD21G15B-AF as a low-cost co-processor. The 48 MHz Cortex-M0+ runs the Zigbee host stack or BLE link layer, with USB device mode supplying the upstream link to the gateway host. The 12-bit ADC and 10-bit DAC provide analogue interfaces for legacy HVAC and security panels. The 38 GPIO allow matrix keypads, multi-color LED drivers, and PIR sensor inputs to coexist on a single 48-pin MCU.
Recommandé
Automotive Interior Lighting and HMI
In non-safety automotive interior applications (ambient lighting, HVAC controls, infotainment keypads), the ATSAMD21G15B-AF provides ample compute for WS2812/APA102 LED chains via SPI DMA and capacitive touch via the Peripheral Touch Controller. Six SERCOM interfaces connect to CAN transceivers (via external UART), I2S audio codecs, and SPI displays. The 125 °C temperature rating tolerates cabin extremes. For ASIL-rated applications, design houses should pair this MCU with an automotive-grade companion or move to AEC-Q100-qualified SAM DA1 family parts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD21G15B-AF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD21G16B-AF | ATSAMD21G17B-AF | ATSAMD21G18B-AF |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-TQFP (7x7) | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same | 48-TQFP (7x7) - same |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| Max CPU Clock | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash | 32 KB | 64 KB | 128 KB | 256 KB |
| SRAM | 4 KB | 8 KB | 16 KB | 32 KB |
| USB | Full-Speed Device + PHY | Full-Speed Device + PHY | Full-Speed Device + PHY | Full-Speed Device + PHY |
| Operating Voltage | 1.62 V - 3.63 V | 1.62 V - 3.63 V | 1.62 V - 3.63 V | 1.62 V - 3.63 V |
| GPIO Count | 38 | 38 | 38 | 38 |
| Approx. 1k Price (USD) | $2.04 | ~$2.30 | ~$2.70 | ~$3.10 |
Principaux différenciateurs
- Smallest Flash variant in SAM D21G TQFP-48 family - lowest cost for size-limited designs (vs ATSAMD21G18B-AF)
- Full-Speed USB with on-chip PHY vs SAM D20 parts lacking USB (vs ATSAMD20G18A-AU)
- 32-bit ARM Cortex-M0+ vs 8-bit PIC16 baseline (vs PIC16F720-I/P)
Notes de conception
Place 1 µF + 100 nF decoupling on both VDDIN and VDDCORE as close to the respective pins as possible; VDDOUT requires 1 µF + 100 nF and feeds the internal 1.2 V LDO. Add bulk capacitance (4.7-10 µF) at the input supply if the upstream regulator is shared with high-current loads. Estimated: with 1 µF on VDDCORE and a worst-case 50 mA transient, ripple stays within ±50 mV at the 48 MHz clock edge rate.
Route the USB D-/D+ pair as a 90 Ω differential with matched length and continuous reference plane on an adjacent ground pour. Keep the 1.5 kΩ pull-up on D+ close to the DP pin and tied to VDDIO. Place the 12 MHz crystal within 5 mm of the XIN/XOUT pads with a guard ground ring. The SWD header (SWCLK/SWDIO) should be brought out to a 0.1" header for programming and field firmware updates.
Avoid leaving unused GPIO floating; configure them as output low or input with internal pull to prevent leakage in low-power modes. The ATSAMD21G15B-AF shares the USB DP/DM with PA24/PA25, so USB usage precludes those pins for GPIO. The brown-out detector (BOD) defaults to a threshold near 1.6 V; tune BODVDD via the NVM USER row if your application requires a higher reset threshold. The 32 KB Flash must be programmed with the appropriate BOOTPROT setting if secure boot is desired.
At 48 MHz clock and 3.63 V supply with all peripherals active, core current consumption reaches approximately 9 mA (estimated: 0.17 mA/MHz per the SAM D21 datasheet). For continuous 9 mA at 3.6 V, dissipation is roughly 32 mW - well within the TQFP-48 thermal envelope of approximately 70 °C/W junction-to-ambient, so no heatsink is required. However, in sealed enclosures above +85 °C ambient, derate the clock frequency or enable idle sleep modes to keep Tj under 125 °C.
Informations de conformité
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - migrate to SAM DA1 family (Functional Safety variant) for ASIL-rated applications. Industrial temperature range -40 to +125 °C is supported.
