ATSAMD21J17A-AF - 48MHz Cortex-M0+ MCU, 128KB Flash, USB | Microchip
Référence : ATSAMD21J17A-AF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.36 | $336,00 |
| 500 | $2.99 | $1 495,00 |
| 1 000 | $2.65 | $2 650,00 |
ATSAMD21J17A-AF Présentation
An MCU (microcontroller) is a single-chip computer integrating a CPU core, program and data memory, and configurable peripherals on one silicon die. The ARM Cortex-M0+ is the most energy-efficient ARM processor core for embedded applications, and Microchip's SAM D21 family extends the Cortex-M0+ with a dedicated event system, SERCOM peripherals, and a SleepWalking power-management architecture. The 'J' suffix denotes the high-pin-count 64-pin variant, providing maximum GPIO and peripheral accessibility versus the 'G' (48-pin) and 'E' (32-pin) siblings.
Key differentiating specifications include 128 KB of Flash with 4 KB of read-while-write (RWW) EEPROM emulation, six SERCOM channels each independently configurable as I2C, SPI, or USART, an integrated USB 2.0 Full-Speed device with on-chip transceiver, and an operating voltage range of 1.62 V to 3.63 V. The 12-bit ADC offers up to 20 analog input channels with hardware oversampling, and the device achieves 2.46 CoreMark/MHz, delivering ~118 CoreMark at maximum clock. Industrial temperature range is -40C to +125C.
Architecturally, the SAM D21 family uses a single AHB/APB bus matrix with a separate bridge for the SERCOM modules, enabling deterministic DMA-driven I/O. The SleepWalking event system allows peripherals to wake the core only on relevant events, dramatically reducing active-mode current in battery-powered applications where quiescent draw dominates. The integrated USB PHY eliminates external transceiver circuitry, saving BOM cost and PCB area in HID, CDC, and composite-USB designs.
Typical applications include USB Human Interface Devices, home automation gateways, low-power wireless sensor nodes, smart metering, industrial control panels, and consumer wearables. The integrated USB device controller and rich SERCOM set simplify designs requiring multiple serial protocols without external glue logic, and the 4 KB RWW EEPROM area is well-suited to data logging applications requiring non-volatile parameter storage without an external EEPROM chip.
When designing with this device, allocate the 128 KB Flash carefully: approximately 8 KB is consumed by the SAM D21 bootloader, leaving ~120 KB for application code. Use Atmel Studio 7, MPLAB X IDE, or MPLAB Harmony 3 with the START code-configurator for peripheral initialization, and budget quiescent current carefully: full Sleep mode draws under 10 uA, but active peripherals can dominate consumption.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAMD21J17A-AF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD21J17A-AF (même facteur de forme et même empreinte) — différant par ADC, Operating Temperature, Package, Flash Memory, DAC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD21J17B-AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD21J18A-AF
✅ Remplacement direct✓ En stock
$2.99 / unité
Voir la fiche technique →ATSAMD21J16B-AF
✅ Remplacement direct✓ En stock
$2.52 / unité
Voir la fiche technique →ATSAMC21J17A-AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD21G18A-MU
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.15 / unité
Voir la fiche technique →ATSAMD21J17A-AF Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Fréquence d'horloge maximale | 48 MHz |
| CoreMark Score | 2.46 CoreMark/MHz (~118 CoreMark) |
| Flash Memory | 128 KB (with 4 KB RWW) |
| SRAM | 16 KB |
| Operating Voltage Range | 1.62 V to 3.63 V |
| Plage de température de fonctionnement | -40C to +125C (industrial) |
| Boîtier | 64-pin TQFP (10x10 mm), 0.5 mm pitch |
| Type de montage | Surface Mount (Gull-wing) |
| USB Interface | USB 2.0 Full-Speed Device with on-chip transceiver |
| SERCOM Modules | 6 (each configurable as I2C/SPI/UART/USART) |
| ADC | 12-bit, up to 20 channels, 350 ksps |
| DAC | 10-bit, 350 ksps |
| DMA Channels | 12 |
| Timers/Counters | 8 (TC) plus RTC |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant (Pb-free, GREEN per supplier) |
Configuration des broches de ATSAMD21J17A-AF
| Broche 1 | PA00 — GPIO / TCC2 WO[0] / SERCOM1 PAD[0] |
| Broche 2 | PA01 — GPIO / TCC2 WO[1] / SERCOM1 PAD[1] |
| Broche 3 | PA02 — GPIO / ADC AIN[0] / DAC VOUT |
| Broche 4 | PA03 — GPIO / ADC AIN[1] / VREFA |
| Broche 5 | GND — Ground |
| Broche 6 | VDDIN — Voltage regulator input supply |
| Broche 7 | VDDIO — I/O supply voltage |
| Broche 8 | PA04 — GPIO / VREFB / ADC AIN[4] |
| Broche 9 | PA05 — GPIO / ADC AIN[5] |
| Broche 10 | PA06 — GPIO / ADC AIN[6] |
| Broche 11 | PA07 — GPIO / ADC AIN[7] |
| Broche 12 | VDDANA — Analog supply voltage |
| Broche 13 | GND — Ground |
| Broche 14 | PA08 — GPIO / NMI / SERCOM0 PAD[0] |
| Broche 15 | PA09 — GPIO / SERCOM0 PAD[1] |
| Broche 16 | PA10 — GPIO / SERCOM0 PAD[2] |
| Broche 17 | PA11 — GPIO / SERCOM0 PAD[3] |
| Broche 18 | PA12 — GPIO / SERCOM2 PAD[0] |
| Broche 19 | PA13 — GPIO / SERCOM2 PAD[1] |
| Broche 20 | PA14 — GPIO / SERCOM2 PAD[2] |
| Broche 21 | PA15 — GPIO / SERCOM2 PAD[3] |
| Broche 22 | PA16 — GPIO / SERCOM1 PAD[0] / I2S SCK |
| Broche 23 | PA17 — GPIO / SERCOM1 PAD[1] / I2S FS |
| Broche 24 | PA18 — GPIO / SERCOM1 PAD[2] / I2S MCK |
| Broche 25 | PA19 — GPIO / SERCOM1 PAD[3] / I2S SDO |
| Broche 26 | PA20 — GPIO / SERCOM3 PAD[0] |
| Broche 27 | PA21 — GPIO / SERCOM3 PAD[1] |
| Broche 28 | PA22 — GPIO / SERCOM3 PAD[2] |
| Broche 29 | PA23 — GPIO / SERCOM3 PAD[3] / USB SOF 1kHz |
| Broche 30 | PA24 — GPIO / USB_DM |
| Broche 31 | PA25 — GPIO / USB_DP |
| Broche 32 | GND — Ground |
| Broche 33 | VDDIO — I/O supply voltage |
| Broche 34 | PA26 — GPIO / TCC1 WO[0] |
| Broche 35 | PA27 — GPIO / TCC1 WO[1] |
| Broche 36 | PA28 — GPIO / TCC1 WO[2] |
| Broche 37 | PA29 — GPIO / TCC1 WO[3] |
| Broche 38 | PA30 — GPIO / TCC2 WO[0] / SWDIO |
| Broche 39 | PA31 — GPIO / TCC2 WO[1] / SWCLK |
| Broche 40 | RESETn — Reset input, active low |
| Broche 41 | PB00 — GPIO / SERCOM5 PAD[2] |
| Broche 42 | PB01 — GPIO / SERCOM5 PAD[3] |
| Broche 43 | PB02 — GPIO / SERCOM5 PAD[0] |
| Broche 44 | PB03 — GPIO / SERCOM5 PAD[1] |
| Broche 45 | PB04 — GPIO / SERCOM4 PAD[0] |
| Broche 46 | PB05 — GPIO / SERCOM4 PAD[1] |
| Broche 47 | PB06 — GPIO / SERCOM4 PAD[2] |
| Broche 48 | PB07 — GPIO / SERCOM4 PAD[3] |
| Broche 49 | PB08 — GPIO / SERCOM4 PAD[0] alt |
| Broche 50 | PB09 — GPIO / SERCOM4 PAD[1] alt |
| Broche 51 | PB10 — GPIO / SERCOM4 PAD[2] alt |
| Broche 52 | PB11 — GPIO / SERCOM4 PAD[3] alt |
| Broche 53 | PB12 — GPIO / SERCOM4 PAD[0] |
| Broche 54 | PB13 — GPIO / SERCOM4 PAD[1] |
| Broche 55 | PB14 — GPIO / SERCOM4 PAD[2] |
| Broche 56 | PB15 — GPIO / SERCOM4 PAD[3] |
| Broche 57 | PB16 — GPIO / SERCOM5 PAD[0] |
| Broche 58 | PB17 — GPIO / SERCOM5 PAD[1] |
| Broche 59 | PB18 — GPIO / SERCOM5 PAD[2] |
| Broche 60 | PB19 — GPIO / SERCOM5 PAD[3] |
| Broche 61 | PB20 — GPIO / SERCOM3 PAD[0] alt |
| Broche 62 | PB21 — GPIO / SERCOM3 PAD[1] alt |
| Broche 63 | GND — Ground |
| Broche 64 | VDDIO — I/O supply voltage |
Applications typiques
ATSAMD21J17A-AF convient pour 7 applications: USB Human Interface Device (HID), Home Automation Gateway, Smart Metering and Data Logging, Industrial Control Panel HMI, Low-Power Wireless Sensor Node, Consumer Wearable Device, USB Composite Device (CDC + HID + MSC).
USB Human Interface Device (HID)
The ATSAMD21J17A-AF's integrated USB 2.0 Full-Speed device controller with on-chip transceiver makes it ideal for USB HID peripherals such as keyboards, mice, touch panels, and custom input devices. The 48 MHz Cortex-M0+ core easily handles 1 kHz HID polling with headroom for debounce, matrix scanning, and capacitive sensing processing. The on-chip PHY eliminates external USB components, reducing BOM cost and PCB area. Microchip's ASF USB stack provides ready-made HID class drivers, shortening time-to-market.
Recommandé
Home Automation Gateway
The ATSAMD21J17A-AF suits home automation gateways requiring USB host/device connectivity, multiple wireless protocol co-processors, and a wide operating voltage range. The six SERCOM modules can simultaneously interface an SPI LoRa or Sub-GHz radio, an I2C sensor hub, a UART GPS module, and a USART debug port. SleepWalking event-driven wakeup reduces standby current below 10 uA, allowing battery + mains hybrid designs. The 4 KB read-while-write EEPROM area stores persistent configuration across power cycles.
Recommandé
Smart Metering and Data Logging
The 4 KB read-while-write EEPROM area in the ATSAMD21J17A-AF is purpose-built for smart metering applications requiring non-volatile storage of consumption logs, calibration coefficients, and tamper events without external EEPROM. The 12-bit ADC with up to 20 channels handles direct interface to current shunts and voltage dividers, while the on-chip temperature sensor supports metering temperature compensation. Industrial -40C to +125C operation supports outdoor utility installations.
Recommandé
Industrial Control Panel HMI
The 52 GPIO pins exposed by the ATSAMD21J17A-AF in the 64-pin TQFP package support direct drive of 7-segment displays, status LEDs, key matrices, and rotary encoders typical in industrial control panels. The 12-bit ADC reads potentiometers and analog sensors, while the PWM timers drive indicator LED brightness or buzzer tones. Industrial temperature range -40C to +125C supports factory-floor deployment, and the integrated USB device interface simplifies firmware updates via service port.
Recommandé
Low-Power Wireless Sensor Node
Battery-powered wireless sensor nodes benefit from the ATSAMD21J17A-AF's SleepWalking architecture, which keeps the core asleep while peripherals monitor inputs and wake the CPU only on relevant events. Standby current under 10 uA enables multi-year coin-cell operation when paired with a Sub-GHz or BLE co-processor over SPI. The integrated 12-bit ADC and 10-bit DAC handle direct sensor interface without external signal conditioning. Wide 1.62-3.63 V supply tolerates battery voltage droop.
Recommandé
Consumer Wearable Device
The ATSAMD21J17A-AF suits compact consumer wearables such as fitness bands, smartwatches (as peripheral co-processor), and health monitors. Its low active current at 48 MHz, multiple SERCOM channels for BLE/SPO2/touch controllers, and integrated USB for charging and firmware updates make it a strong fit. The industrial temperature range supports wearable thermal variability, and the 10-bit DAC drives haptic feedback waveforms directly without external circuitry.
Recommandé
USB Composite Device (CDC + HID + MSC)
The ATSAMD21J17A-AF can enumerate as a composite USB device with multiple interfaces (for example CDC virtual COM port for debugging, HID for control, and MSC for bulk file transfer) using Microchip's composite device stack. The 128 KB Flash accommodates the larger USB stack plus application code, and 16 KB SRAM buffers bulk transfers efficiently. Industrial temperature operation suits outdoor or automotive service tools that rely on USB connectivity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD21J17A-AF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD21J17B-AF | ATSAMD21J18A-AF | ATSAMD21J16B-AF | ATSAMC21J17A-AF | ATSAMD21G18A-MU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (10x10 mm) | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 64-pin TQFP (10x10 mm) - same | 48-pin QFN (7x7 mm) |
| Core Architecture | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz |
| Flash Memory | 128 KB | 128 KB | 256 KB | 64 KB | 128 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 32 KB | 8 KB | 16 KB | 32 KB |
| Operating Voltage | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 2.7 V to 5.5 V | 1.62 V to 3.63 V |
| USB Interface | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device | USB 2.0 Full-Speed Device |
| CAN-FD Peripheral | No | No | No | No | Yes (CAN-FD) | No |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| GPIO Pins | 52 | 52 | 52 | 52 | 52 | 38 |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed device with on-chip PHY (vs ATSAMC21J17A-AF)
- Six SERCOM modules independently configurable as I2C/SPI/UART (vs ATSAMD21G18A-MU)
- 4 KB read-while-write EEPROM emulation in Flash (vs ATSAMD21J16B-AF)
Notes de conception
Power-rail decoupling is critical for stable USB operation. Place a 1 uF X7R ceramic on each VDDIN pin, a 100 nF X7R on each VDDIO pin, and a 4.7 uF bulk capacitor on VDDANA. The integrated 1.2 V core LDO requires its own 1 uF capacitor on the VDDOUT pin. For USB Full-Speed, VDDIO must be at least 3.0 V to meet USB signal swing requirements. Place the bulk capacitor within 5 mm of the MCU to suppress inrush during USB enumeration.
Use a continuous ground plane under the TQFP package and stitch vias around the perimeter to reduce EMI and provide a low-impedance return path for high-speed signals. Keep USB D+ and D- traces as short as possible (under 25 mm), matched within 2 mm, and routed over a continuous ground plane. Avoid routing other signals under the MCU or across the USB differential pair. The 0.5 mm pitch TQFP pads can be hand-soldered with care but production designs should use a reflow profile per J-STD-020 with peak temperature of 245C to 250C for Pb-free assembly.
Two common pitfalls with the ATSAMD21J17A-AF: (1) Forgetting that the bootloader consumes ~8 KB of Flash - target applications requiring >120 KB code must use the J18 variant instead. (2) Mistakenly routing PA24/PA25 (USB D-/D+) as regular GPIO without disabling the USB controller - the on-chip pull-up on D+ can cause enumeration failures. Always explicitly configure USB or GPIO mode via the PORT group and check the bootloader fuses before locking the device with NVMCTRL.SECDB bit.
At maximum 48 MHz clock with all peripherals active and 3.63 V supply, the SAM D21 draws approximately 8 mA active current (~29 mW). The 64-pin TQFP package has theta_JA of approximately 39 C/W on a 4-layer JEDEC test board, so junction temperature rise is roughly 1.1 C above ambient - thermal management is rarely a concern for this MCU. However, in closed enclosures with no airflow, verify by measuring VDDANA during operation; values above 3.6 V at high ambient indicate the regulator is approaching dropout.
Informations de conformité
RoHS compliant and Pb-free GREEN per supplier listings (DigiKey/Mouser). Industrial temperature range -40C to +125C. Not AEC-Q100 qualified - see ATSAMx21x E variants for automotive-grade equivalents.
