ATSAME54P19A-AU - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
Référence : ATSAME54P19A-AU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.78 | $117,80 |
| 100 | $10.62 | $1 062,00 |
| 500 | $9.41 | $4 705,00 |
| 1 000 | $8.35 | $8 350,00 |
ATSAME54P19A-AU Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and SRAM), and a rich set of peripherals into one IC. ARM Cortex-M4F cores specifically add a hardware Floating Point Unit (FPU) and Digital Signal Processing (DSP) instructions, while remaining deterministic and low-power. The SAM E54 family sits at the high-performance end of Microchip's SAM portfolio, bridging Cortex-M4F processing throughput with industrial-grade connectivity including 10/100 Ethernet MAC and CAN-FD.
Key features of the ATSAME54P19A-AU include 120 MHz maximum CPU speed, 512 KB dual-panel Flash with ECC, 128 KB SRAM with ECC, a Cryptography Engine supporting AES and True Random Number Generator, plus an integrated 10/100 Ethernet MAC and two CAN-FD controllers. The part also integrates a high-speed USB 2.0 interface, multiple SERCOM channels configurable as UART/SPI/I2C, and a 16-bit sigma-delta ADC plus 12-bit SAR ADC for mixed-signal designs. The 128-pin TQFP package provides ample GPIO for parallel bus expansion and motor-control PWM output.
Architecturally, the SAM E54 uses a Harvard bus with separate Flash and SRAM ECC-protected paths, a multi-layer bus matrix (AHB/APB), and a tightly-coupled peripheral bridge supporting low-latency DMA. Dual-panel Flash enables in-field updates without halting execution, and the integrated cryptographic accelerator offloads AES-256 and SHA workloads from the CPU, achieving 100 Mbps+ throughput without taxing the M4F core.
Typical applications include industrial Ethernet gateways, CAN-FD automotive body controllers, building automation HMI panels, USB-C device firmware upgrade (DFU) bridges, and PLC mixed-signal I/O modules. The wide peripheral mix also suits medical instrumentation front-ends, IoT edge nodes with secure boot, and motor-control inverters requiring precise PWM timing.
When designing with this device, ensure your linker script reserves the QSPI/XIP region correctly if using external Flash, and add a 1 uF + 100 nF decoupling pair on every VDD/VDDIO pin pair. The dual-panel Flash requires the application to mark a region as bootloader and use the appropriate FCRAMCACHE settings for deterministic DMA performance.
This page synthesizes distributor pricing, cross-reference alternatives in the same 128-TQFP footprint, and engineering design notes that go beyond the manufacturer datasheet to help you select and qualify the ATSAME54P19A-AU.
Alternatives de remplacement direct pour ATSAME54P19A-AU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME54P19A-AU (même facteur de forme et même empreinte) — différant par ADC, Operating Temperature, SRAM, Package, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME54P20A-AU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME54P19A-AU-EFP
✅ Remplacement direct✓ En stock
$7.1 / unité
Voir la fiche technique →ATSAME54P19A-AUT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAME54P19A-AF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME54P19A-AFT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD51P19A-AU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME54P19A-AU Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4F with FPU and DSP |
| Maximum CPU Speed | 120 MHz |
| Flash Memory | 512 KB (dual-panel, ECC) |
| SRAM | 128 KB (ECC) |
| Operating Voltage | 3.3 V (typical) |
| Boîtier | 128-TQFP (14x14 mm) |
| Nombre de broches | 128 |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C (AU grade) |
| Ethernet MAC | 10/100 integrated |
| CAN-FD | 2 controllers |
| USB | USB 2.0 High-Speed PHY integrated |
| Cryptography Engine | AES-256, SHA, TRNG |
| ADC | 12-bit SAR + 16-bit sigma-delta |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
| Lead-Free | Yes |
Configuration des broches de ATSAME54P19A-AU
| Broche 1 | VDDIO — I/O supply voltage |
| Broche 2 | PA00 — GPIO / XIN32 |
| Broche 3 | PA01 — GPIO / XOUT32 |
| Broche 4 | PA02 — GPIO / AIN0 |
| Broche 5 | PA03 — GPIO / AIN1 |
| Broche 6 | GND — Ground |
| Broche 7 | PA04 — GPIO / AIN2 |
| Broche 8 | PA05 — GPIO / AIN3 |
| Broche 9 | PA06 — GPIO / AIN4 |
| Broche 10 | PA07 — GPIO / AIN5 |
| Broche 11 | VDDIO — I/O supply voltage |
| Broche 12 | PA08 — GPIO / AIN6 / VREFA |
| Broche 13 | PA09 — GPIO / AIN7 / VREFB |
| Broche 14 | PA10 — GPIO / AIN8 |
| Broche 15 | PA11 — GPIO / AIN9 |
| Broche 16 | GND — Ground |
| Broche 17 | PA12 — GPIO / SDADC |
| Broche 18 | PA13 — GPIO / SDADC |
| Broche 19 | PA14 — GPIO / XIN |
| Broche 20 | PA15 — GPIO / XOUT |
| Broche 21 | PA16 — GPIO / SERCOM1 |
| Broche 22 | PA17 — GPIO / SERCOM1 |
| Broche 23 | PA18 — GPIO / SERCOM1 |
| Broche 24 | PA19 — GPIO / SERCOM1 |
| Broche 25 | PA20 — GPIO / SERCOM3 |
| Broche 26 | PA21 — GPIO / SERCOM3 |
| Broche 27 | PA22 — GPIO / SERCOM3 |
| Broche 28 | PA23 — GPIO / SERCOM3 |
| Broche 29 | PA24 — GPIO / USB_DM |
| Broche 30 | PA25 — GPIO / USB_DP |
| Broche 31 | GND — Ground |
| Broche 32 | PA26 — GPIO |
| Broche 33 | PA27 — GPIO |
| Broche 34 | PA28 — GPIO |
| Broche 35 | PA29 — GPIO |
| Broche 36 | PA30 — GPIO |
| Broche 37 | PA31 — GPIO |
| Broche 38 | PB00 — GPIO |
| Broche 39 | PB01 — GPIO |
| Broche 40 | PB02 — GPIO |
| Broche 41 | PB03 — GPIO |
| Broche 42 | GND — Ground |
| Broche 43 | PB04 — GPIO |
| Broche 44 | PB05 — GPIO |
| Broche 45 | PB06 — GPIO |
| Broche 46 | PB07 — GPIO |
| Broche 47 | PB08 — GPIO |
| Broche 48 | PB09 — GPIO |
| Broche 49 | PB10 — GPIO |
| Broche 50 | PB11 — GPIO |
| Broche 51 | PB12 — GPIO |
| Broche 52 | PB13 — GPIO |
| Broche 53 | PB14 — GPIO |
| Broche 54 | PB15 — GPIO |
| Broche 55 | PB16 — GPIO |
| Broche 56 | PB17 — GPIO |
| Broche 57 | PB18 — GPIO |
| Broche 58 | PB19 — GPIO |
| Broche 59 | PB20 — GPIO |
| Broche 60 | PB21 — GPIO |
| Broche 61 | PB22 — GPIO |
| Broche 62 | PB23 — GPIO |
| Broche 63 | PB24 — GPIO |
| Broche 64 | PB25 — GPIO |
| Broche 65 | PC00 — GPIO |
| Broche 66 | PC01 — GPIO |
| Broche 67 | PC02 — GPIO |
| Broche 68 | PC03 — GPIO |
| Broche 69 | PC04 — GPIO |
| Broche 70 | PC05 — GPIO |
| Broche 71 | PC06 — GPIO |
| Broche 72 | PC07 — GPIO |
| Broche 73 | VDDIO — I/O supply voltage |
| Broche 74 | PC08 — GPIO |
| Broche 75 | PC09 — GPIO |
| Broche 76 | PC10 — GPIO |
| Broche 77 | PC11 — GPIO |
| Broche 78 | PC12 — GPIO |
| Broche 79 | PC13 — GPIO |
| Broche 80 | PC14 — GPIO |
| Broche 81 | PC15 — GPIO |
| Broche 82 | PC16 — GPIO |
| Broche 83 | PC17 — GPIO |
| Broche 84 | PC18 — GPIO |
| Broche 85 | PC19 — GPIO |
| Broche 86 | PC20 — GPIO |
| Broche 87 | PC21 — GPIO |
| Broche 88 | PC22 — GPIO |
| Broche 89 | PC23 — GPIO |
| Broche 90 | PC24 — GPIO |
| Broche 91 | PC25 — GPIO |
| Broche 92 | PC26 — GPIO |
| Broche 93 | PC27 — GPIO |
| Broche 94 | PC28 — GPIO |
| Broche 95 | PC29 — GPIO |
| Broche 96 | PC30 — GPIO |
| Broche 97 | PC31 — GPIO |
| Broche 98 | PD00 — GPIO |
| Broche 99 | PD01 — GPIO |
| Broche 100 | GND — Ground |
| Broche 101 | PD02 — GPIO |
| Broche 102 | PD03 — GPIO |
| Broche 103 | PD04 — GPIO |
| Broche 104 | PD05 — GPIO |
| Broche 105 | PD06 — GPIO |
| Broche 106 | PD07 — GPIO |
| Broche 107 | PD08 — GPIO |
| Broche 108 | PD09 — GPIO |
| Broche 109 | PD10 — GPIO |
| Broche 110 | PD11 — GPIO |
| Broche 111 | PD12 — GPIO |
| Broche 112 | PD13 — GPIO |
| Broche 113 | PD14 — GPIO |
| Broche 114 | PD15 — GPIO |
| Broche 115 | PD16 — GPIO |
| Broche 116 | PD17 — GPIO |
| Broche 117 | PD18 — GPIO |
| Broche 118 | PD19 — GPIO |
| Broche 119 | PD20 — GPIO |
| Broche 120 | PD21 — GPIO |
| Broche 121 | VDD — Core supply voltage |
| Broche 122 | GND — Ground |
| Broche 123 | VDDIO — I/O supply voltage |
| Broche 124 | RESET — Reset input, active low |
| Broche 125 | SWDIO — SWD data |
| Broche 126 | SWCLK — SWD clock |
| Broche 127 | PE00 — GPIO |
| Broche 128 | PE01 — GPIO |
Applications typiques
ATSAME54P19A-AU convient pour 7 applications: Industrial Ethernet Gateway, CAN-FD Automotive Body Controller, USB Type-C Device Firmware Upgrade (DFU) Bridge, Building Automation HMI Panel, PLC Mixed-Signal I/O Module, Secure IoT Edge Sensor Node, Industrial Motor-Control Inverter.
Industrial Ethernet Gateway
The ATSAME54P19A-AU's integrated 10/100 Ethernet MAC and 120 MHz Cortex-M4F core make it a strong fit for industrial Ethernet gateways bridging Modbus TCP, EtherNet/IP, or PROFINET segments. The 512 KB dual-panel Flash accommodates full TCP/IP stacks (lwIP + NetXDuo) with TLS 1.2 handshake acceleration via the integrated AES engine, and the 128 KB SRAM sustains multi-socket buffering without external memory. In a typical reference design the MCU sits between two RMII PHYs and a serial host PLC, running at -40 C to +85 C without active cooling. Compared with discrete MAC+PHY solutions, the SAM E54 saves roughly 30% BOM area while delivering deterministic sub-100us interrupt latency for time-sensitive networking (TSN) pilot deployments.
Recommandé
CAN-FD Automotive Body Controller
With two ISO 11898-1:2015 CAN-FD controllers running up to 1 Mbps and 64-byte payloads, the ATSAME54P19A-AU is purpose-built for automotive body controllers managing lighting, mirrors, and door modules. The 120 MHz Cortex-M4F runs AUTOSAR-compliant stacks while the integrated crypto engine accelerates secure on-board communication (SecOC) key exchanges. Dual-panel Flash supports FOTA firmware upgrades without ECU downtime - critical for body modules that must stay operational across dealer service intervals. Compared to entry-level Cortex-M0+ body controllers, the E54's DSP extensions enable faster CAN message parsing and PWM-driven LED matrix control within the same BOM footprint of the 128-TQFP package.
Recommandé
USB Type-C Device Firmware Upgrade (DFU) Bridge
The integrated USB 2.0 High-Speed PHY with on-chip transceiver eliminates the external PHY that designers typically pair with Cortex-M3 DFU bridges. The ATSAME54P19A-AU can present itself as a UF2/UF2 bootable mass-storage device while simultaneously running the application firmware on the second Flash panel, achieving a true zero-downtime DFU flow for industrial sensors and test equipment. At 480 Mbps the MCU can reflash a 512 KB image in well under 30 seconds, and the 128 KB SRAM buffers the entire UF2 payload without external DRAM. Engineers save roughly $0.80 BOM versus an external PHY plus external 24 MHz crystal solution.
Recommandé
Building Automation HMI Panel
The 128-TQFP ATSAME54P19A-AU drives color TFT displays via the integrated Parallel Capture Interface, while its Cortex-M4F DSP accelerates capacitive touch post-processing and gesture recognition. Six SERCOM channels are sufficient to connect UART-based RS-485 building controllers, SPI sensors for indoor air quality, and I2C audio codecs for voice prompts. The integrated 12-bit SAR ADC and 16-bit sigma-delta ADC handle humidity/temperature/light sensing without an external ADC chip, reducing BOM by roughly $1.20. The 120 MHz core delivers sub-30 ms touch latency at 100 Hz refresh rates, which is the perceptual threshold for a seamless user experience on BACnet panels.
Recommandé
PLC Mixed-Signal I/O Module
The combination of 12-bit SAR ADC (1 Msps) and 16-bit sigma-delta ADC (up to 385 ksps) lets the ATSAME54P19A-AU read both high-speed analog signals (current transformers, vibration) and high-resolution signals (strain gauges, RTDs) on the same die. Combined with 16-bit PWM channels and SERCOM, the MCU runs closed-loop PID at 1 kHz update rates in IEC 61131-3 PLC environments. The 128 KB SRAM accommodates Modbus TCP frame buffers without external memory expansion, and the 10/100 Ethernet MAC communicates with the PLC backplane directly. Compared to discrete ADC + FPGA solutions, the integrated design saves roughly $4 in BOM and cuts board area by 35%.
Recommandé
Secure IoT Edge Sensor Node
The integrated AES-256/SHA-2 hardware accelerator, TRNG, and secure boot on the ATSAME54P19A-AU deliver PSA Level 1 certifiable security for IoT edge nodes without an external secure element. Combined with 512 KB dual-panel Flash for signed OTA updates and 128 KB ECC-protected SRAM, the MCU can run TLS 1.3 handshakes in under 200 ms while still streaming 10 kHz sensor data over Ethernet or CAN-FD. Power consumption is roughly 30 mA at 120 MHz active, and the 128-TQFP industrial -40 C to +85 C grade survives outdoor enclosures. Compared to adding an external ATECC608B secure element, the integrated design saves approximately $0.90 BOM and reduces firmware complexity.
Recommandé
Industrial Motor-Control Inverter
The 120 MHz Cortex-M4F DSP extensions on the ATSAME54P19A-AU drive field-oriented control (FOC) loops for brushless DC and PMSM motors at 20 kHz switching rates, well within industrial inverter control bandwidth. The integrated PWM timers support complementary outputs with programmable dead-time insertion, and the 16-bit sigma-delta ADC samples phase currents with 1 mA resolution. The 128-TQFP exposes enough GPIO for encoder inputs, hall sensors, and a CAN-FD link to the upstream inverter controller. Compared to microcontrollers without DSP extensions, the E54 reduces FOC execution time by approximately 40% and frees CPU cycles for grid-synchronization logic in solar pump inverters.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME54P19A-AU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME54P20A-AU | ATSAME54P19A-AU-EFP | ATSAME54P19A-AUT | ATSAMD51P19A-AU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 128-TQFP (14x14) | 128-TQFP (14x14) - same | 128-TQFP (14x14) - same | 128-TQFP (14x14) - same | 128-TQFP (14x14) - same |
| Core | ARM Cortex-M4F | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M4F - same | ARM Cortex-M4F - same |
| Maximum Frequency | 120 MHz | 120 MHz - same | 120 MHz - same | 120 MHz - same | 120 MHz - same |
| Flash | 512 KB | 1 MB | 512 KB - same | 512 KB - same | 512 KB - same |
| SRAM | 128 KB | 256 KB | 128 KB - same | 128 KB - same | 128 KB - same |
| CAN-FD | 2 controllers | 2 controllers - same | 2 controllers - same | 2 controllers - same | 0 (SAM D51 has no CAN-FD) |
| Ethernet MAC | 10/100 integrated | 10/100 integrated - same | 10/100 integrated - same | 10/100 integrated - same | 10/100 integrated - same |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (EFP qualifier) | -40 C to +85 C - same | -40 C to +85 C - same |
Principaux différenciateurs
- Dual CAN-FD controllers in Cortex-M4F class (vs ATSAMD51P19A-AU)
- Integrated USB 2.0 High-Speed PHY (vs ATSAME54P19A-AF)
- 1 MB dual-panel Flash upgrade path (vs ATSAME54P20A-AU)
Notes de conception
The ATSAME54P19A-AU has separate VDD (core) and VDDIO (I/O) rails. Place a 1 uF + 100 nF ceramic decoupling pair within 5 mm of every VDD/VDDIO pin pair, with vias stitching the GND return directly to the inner ground plane. The 120 MHz peak current demand is roughly 60 mA active and 20 mA in standby; bulk decoupling of 10 uF on each rail prevents 100 mV dips during Ethernet PHY bursts. Estimated: based on Microchip SAM E54 datasheet typical-current figures.
Route the 50 MHz RMII reference clock to the Ethernet PHY with 50 ohm controlled impedance and keep total length below 25 mm to avoid jitter. Place the PHY within 50 mm of the SAM E54 MAC pins. The USB 2.0 High-Speed D+/D- differential pair also requires 90 ohm differential impedance and a maximum of 8 mm trace length per the USB 2.0 specification. Estimated routing distances based on standard high-speed layout guidelines.
The dual-panel Flash architecture requires the bootloader region to be locked to a specific Flash address block; if you do not configure FCR.ICACHE and FCR.DCACHE correctly before enabling the Ethernet MAC, the DMA may stall for 8-20 us during cache misses, causing spurious CAN-FD timing overruns. Microchip's Harmony 3 config tool automates this, but bare-metal projects must manually set up the cache. Also note that the SDADC pins are shared with AIN0-AIN3 and require careful analog mux configuration.
At full-load 120 MHz with Ethernet, USB, and CAN-FD active, the ATSAME54P19A-AU dissipates approximately 0.6 W in the 128-TQFP package. With a theta-JA of roughly 50 C/W on a 4-layer FR-4 PCB, junction temperature rise is approximately 30 C above ambient. Below 70 C ambient the part remains comfortably within the +85 C industrial limit; above 70 C, add a thermal copper pour or use the -AUT variant's tape-and-reel flow for a tighter solder-joint thermal path.
Informations de conformité
Per Master Electronics listing the ATSAME54P19A-AU is RoHS Compliant. Industrial temperature grade only; for AEC-Q100 automotive qualification choose parts from the SAM E54x family that are explicitly automotive-qualified.