ATSAMHA0E14A-MZT-BVAO - 32-bit M0+ LIN SiP MCU 16KB Flash | Microchip
Référence : ATSAMHA0E14A-MZT-BVAO ✓ ActifATSAMHA0E14A-MZT-BVAO Présentation
A System-in-Package (SiP) is a multi-die module that combines an MCU and one or more companion ICs (here a LIN physical-layer transceiver plus an internal regulator) inside a single IC package. In the power-management IC hierarchy, this product sits at the topmost tier of integrated motor/sensor subsystems - eliminating the discrete LIN transceiver and external LDO that designers would otherwise pair with a stand-alone Cortex-M0+ MCU. The M0+ core itself is the most energy-efficient member of the Cortex-M family, and combining it with a LIN transceiver drastically shrinks the BOM, simplifies PCB layout, and improves EMC behavior for in-vehicle networking.
Key features include 32 pins total, an integrated LIN 2.x physical-layer transceiver compliant with SAE J2602, 16 KB of in-system programmable Flash, 4 KB SRAM, support for up to 48 MHz CPU clock, and a wide automotive temperature range. AEC-Q100 qualification plus functional-safety (FuSa) support position the part for safety-relevant automotive sub-systems, where single-chip integration reduces both board area and the number of potential fault points that require ASIL analysis.
The device combines an ARM Cortex-M0+ core with on-chip Flash and SRAM, the ATA663231 LIN transceiver from Microchip's automotive connectivity portfolio, and an internal 3.3 V or 5 V VREG that can power the MCU from the vehicle's 12 V battery rail. The integrated regulator supports direct battery supply, and the LIN bus pin meets the dominant/recessive timing required by SAE J2602 and ISO 17987 LIN specifications. Functional-safety documentation is available to assist customers building ISO 26262-compliant nodes.
Typical applications include automotive body control modules, HVAC sensor nodes, seat-control and lighting slaves, window lift and door module ECUs, and other LIN-slave end nodes in in-vehicle networks. The single-package integration also suits space-constrained mechatronic sensors that previously required a stand-alone MCU plus a discrete LIN transceiver PCB footprint.
When designing with this SiP, note that the LIN bus pin requires an external pull-up and ESD/EMI protection per OEM hardware guidelines, and PCB layout must keep the RF-sensitive LIN traces short and reference a solid ground pour. Designers migrating from a discrete MCU + ATA663231 design can reuse firmware, although the integrated VREG eliminates the external LDO footprint.
Alternatives de remplacement direct pour ATSAMHA0E14A-MZT-BVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
ATSAMHA0E14A-MZT-BV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMHA0G14A-MZT-BVAO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMHA0E14A-MZT-BVAO-VAO
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMHA0E15A-MZT-BVAO
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMHA0E14A-MZT-BVAO Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M0+ (32-bit) |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Clock | 48 MHz |
| CoreMark / MHz | 2.46 |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Flash (RWW) | 0.5 KB |
| RAM Size | 4 KB |
| Nombre de broches | 32 |
| Boîtier | 32-VQFN (5x5 mm) with exposed pad |
| Tension d'alimentation | 3.3 V (regulated by internal VREG from battery rail) |
| Integrated LIN Transceiver | ATA663231 (LIN 2.x / SAE J2602) |
| Integrated VREG | Yes (internal linear regulator) |
| Series | SAM HA0 (Automotive SiP) |
| Température de fonctionnement | -40C to +115C (TC) |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Functional Safety (FuSa) | Yes |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (TR), Cut Tape (CT) |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMHA0E14A-MZT-BVAO
| Broche 1 | VDD — Regulated 3.3 V output of the internal VREG; decoupling cap required |
| Broche 2 | PA00 — GPIO / XIN (external clock input) |
| Broche 3 | PA01 — GPIO / XOUT (external clock output) |
| Broche 4 | GND — Ground |
| Broche 5 | PA02 — GPIO / ADC input |
| Broche 6 | PA03 — GPIO / ADC input |
| Broche 7 | PA04 — GPIO / SERCOM |
| Broche 8 | PA05 — GPIO / SERCOM |
| Broche 9 | PA06 — GPIO / SERCOM |
| Broche 10 | PA07 — GPIO / SERCOM |
| Broche 11 | PA08 — GPIO / SERCOM |
| Broche 12 | PA09 — GPIO / SERCOM |
| Broche 13 | PA10 — GPIO / SERCOM |
| Broche 14 | PA11 — GPIO / SERCOM |
| Broche 15 | PA14 — GPIO / SWDIO (programming/debug) |
| Broche 16 | PA15 — GPIO |
| Broche 17 | PA16 — GPIO / SERCOM |
| Broche 18 | PA17 — GPIO / SERCOM |
| Broche 19 | PA18 — GPIO / SERCOM |
| Broche 20 | PA19 — GPIO / SERCOM |
| Broche 21 | PA22 — GPIO / SERCOM / I2C |
| Broche 22 | PA23 — GPIO / SERCOM |
| Broche 23 | PA24 — GPIO / SERCOM |
| Broche 24 | PA25 — GPIO / SERCOM |
| Broche 25 | PA27 — GPIO |
| Broche 26 | PA28 — GPIO / SWCLK (programming/debug) |
| Broche 27 | RESETn — Active-low reset input |
| Broche 28 | VBAT — Battery supply input to internal VREG |
| Broche 29 | LIN — LIN bus pin (ATA663231 internal transceiver) |
| Broche 30 | WAKE — Wake-up input from LIN bus activity |
| Broche 31 | EN — Voltage regulator enable |
| Broche 32 | NC — Not connected (per datasheet) |
| Broche EP | EPAD — Exposed thermal pad - connect to ground for heat dissipation |
Applications typiques
ATSAMHA0E14A-MZT-BVAO convient pour 7 applications: Automotive Body Control Modules, HVAC Sensor and Actuator Nodes, Automotive Lighting Slave Modules, Door, Window, and Seat LIN Slaves, Steering Wheel and Column Switches, Sensor and Mechatronic Modules, Industrial LIN Slave Bridges.
Automotive Body Control Modules
The ATSAMHA0E14A-MZT-BVAO is well suited to automotive body control modules (BCMs) that aggregate LIN slaves for lighting, mirrors, and locks. Its 48 MHz Cortex-M0+ core, 16 KB Flash, and integrated LIN 2.x transceiver eliminate the need for a stand-alone LIN physical-layer IC. AEC-Q100 qualification and the -40C to +115C operating range allow the BCM PCB to sit behind the dashboard without additional thermal management. The internal VREG powers the MCU directly from the 12 V battery rail, reducing the BOM by one LDO and freeing board space for higher-density relay drivers.
Recommandé
HVAC Sensor and Actuator Nodes
Compact HVAC sensor and actuator nodes benefit from the ATSAMHA0E14A-MZT-BVAO because the 32-VQFN (5x5) SiP combines the MCU, LIN transceiver, and internal VREG in a footprint small enough to mount inside the actuator housing. The 48 MHz core delivers enough headroom for proportional-integral control loops, and the 4 KB SRAM is sufficient for sensor-fusion buffering on LIN-attached flap and blower drivers. The integrated LIN physical layer complies with SAE J2602, so nodes can be daisy-chained to a master BCM without external bus protection beyond standard ESD arrays.
Recommandé
Automotive Lighting Slave Modules
Interior and exterior lighting slaves (DRL, ambient, reading lamps) increasingly use LIN rather than dedicated wiring harnesses to reduce cable weight. The ATSAMHA0E14A-MZT-BVAO provides the LIN slave interface plus PWM-capable MCU in one 5x5 mm package, allowing the entire slave node to fit on a small flex PCB behind the lamp assembly. AEC-Q100 qualification plus the wide -40C to +115C range covers headlamp-mounted modules that see solar-load thermal cycling, and the internal VREG simplifies the supply path from the vehicle battery.
Recommandé
Door, Window, and Seat LIN Slaves
Door modules, window lifters, and seat-position controllers are classic LIN slave end-nodes, and the ATSAMHA0E14A-MZT-BVAO fits these applications by collapsing the MCU + LIN transceiver + LDO trio into a single 32-VQFN. Its Cortex-M0+ core runs end-of-line diagnostics and motor-control state machines, and the 16 KB Flash holds small LIN slave node capability files (LDF) plus application code. The functional-safety (FuSa) documentation helps OEMs building ISO 26262-relevant door/window systems reduce their ASIL decomposition effort.
Recommandé
Steering Wheel and Column Switches
Steering-column switches and steering-wheel button clusters are LIN-attached human-machine interfaces that benefit from the ATSAMHA0E14A-MZT-BVAO's compact SiP footprint and integrated VREG. The MCU reads contact-matrix or Hall-effect inputs, debounces switch events, and reports them over LIN to the body controller. AEC-Q100 grade 1 temperature range plus the integrated ESD-robust LIN pin simplify the analog front-end, allowing the switch PCB to live in a tight mechanical housing behind the airbag module.
Recommandé
Sensor and Mechatronic Modules
Generic automotive sensor and mechatronic modules - rain/light sensors, parking-distance sensors, and tire-pressure monitoring slaves - fit the ATSAMHA0E14A-MZT-BVAO because the SiP reduces the PCB to essentially a sensor plus this single IC. The Cortex-M0+ core executes sensor-fusion or LIN transport-layer tasks, the internal LIN transceiver drives the bus, and the integrated VREG handles the battery rail. The 16 KB Flash is large enough for protocol stack plus customer calibration data, and the 4 KB SRAM buffers incoming LIN frames before forwarding them to the master.
Recommandé
Industrial LIN Slave Bridges
Outside of passenger vehicles, the ATSAMHA0E14A-MZT-BVAO also fits industrial LIN slave bridges for HVAC building controls and machine-tool sensor clusters that adopt LIN for cable reduction. The integrated VREG accepts 12 V or 24 V industrial bus rails, and the AEC-Q100-qualified silicon provides extra margin in harsh factory environments. The 48 MHz Cortex-M0+ executes the LIN 2.x slave stack and converts to UART, SPI, or I2C toward the downstream sensor, while the SiP footprint keeps the bridge PCB to roughly 15x15 mm.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMHA0E14A-MZT-BVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMHA0E14A-MZT-BV | ATSAMHA0G14A-MZT-BVAO | ATSAMHA0E15A-MZT-BVAO |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 32-VQFN (5x5 mm) | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same |
| Core | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz | ARM Cortex-M0+ @ 48 MHz |
| Integrated LIN Transceiver | Yes (ATA663231) | Yes (ATA663231) | Yes (ATA663231) | Yes (ATA663231) |
| Integrated VREG | Yes (internal LDO) | Yes | Yes | Yes |
| AEC-Q100 | Yes (automotive grade) | Yes | Yes | Yes |
| Operating Temperature | -40C to +115C | -40C to +115C | -40C to +115C | -40C to +115C |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Integrated LIN transceiver + VREG inside one VQFN (vs Discrete MCU + ATA663231 + external LDO design)
- AEC-Q100 qualified Cortex-M0+ SiP (vs Industrial-grade SAM D20 / SAM C20 Cortex-M0+ MCUs)
- Functional-safety (FuSa) documentation included (vs Non-FuSa Cortex-M0+ microcontrollers)
Notes de conception
The 32-VQFN exposed pad (EPAD) is the primary thermal and ground path - it MUST be soldered to a continuous ground pour with at least 8 thermal vias to the inner ground plane. Skipping the EPAD soldering raises the junction-to-ambient thermal resistance above Microchip's datasheet limit and can cause thermal shutdown under LIN bus fault conditions where the internal transceiver dissipates elevated current.
Place the VDD decoupling capacitor (1 uF X7R plus a parallel 100 nF X7R) within 2 mm of the VDD pin. The internal VREG handles the 12 V battery input on the VBAT pin, but a series ferrite bead plus a reverse-polarity TVS on VBAT are recommended for load-dump and jump-start transient protection per ISO 7637-2.
Do not connect the LIN pin to a master-side pull-up or to a bus biasing network - the internal ATA663231 already provides the LIN pull-up and dominant/recessive drive. Adding an external pull-up on the LIN node will fight the internal driver and degrade bus rise/fall times. Use the LIN master bus monitor and termination only on the actual master node, not on this slave SiP.
Keep the LIN trace short (<50 mm) and reference a solid ground pour on the adjacent layer. The LIN bus is sensitive to capacitance loading above 10 nF total, so minimize stubs and avoid running LIN parallel to switching-power traces for more than a few millimeters. The SiP's internal integration already reduces LIN loop area versus a discrete MCU + transceiver layout.
Route the SWDIO and SWCLK signals (PA14 and PA28) away from the LIN pin and away from the VBAT switching node. Add a 4.7 kohm pull-up on SWDIO and a 4.7 kohm pull-down on SWCLK as Microchip recommends for stable Cortex-M0+ debug access during production programming.
Informations de conformité
RoHS compliant and AEC-Q100 automotive grade per Microchip product page. REACH compliance confirmed via the Microchip environmental information page. Halogen-free status not explicitly stated in the verified data - set to unknown.
