ATSAMHA0E16A-MZT-BVAO - LIN SiP 32KB Cortex-M0+ MCU | Microchip
Référence : ATSAMHA0E16A-MZT-BVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.75 | $3,75 |
| 10 | $3.38 | $33,80 |
| 100 | $3 | $300,00 |
| 500 | $2.7 | $1 350,00 |
| 1 000 | $2.45 | $2 450,00 |
ATSAMHA0E16A-MZT-BVAO Présentation
A System-in-Package (SiP) combines multiple silicon dies inside one package to deliver a complete functional subsystem, reducing PCB area and BOM cost versus discrete MCU + LIN + LDO designs. Within Microchip's portfolio, the ATSAMHA0 family sits in the LIN-attached body-electronics segment, providing automotive Grade-0 capable Cortex-M0+ compute plus LIN physical-layer connectivity in a single AEC-Q100 qualified IC.
Key features of this part include 64 KB of Flash (64K x 8), 8 KB SRAM, 32 general-purpose I/O lines, an integrated LIN 2.x/SAE J2602 transceiver, an internal 3.3V LDO, a 12-bit ADC up to 10 channels, configurable SERCOM interfaces, and RTC with calendar. AEC-Q100 Grade 1 qualification supports automotive deployments, and the part operates over -40C to +105C.
The SAM HA0 core uses a single-cycle Cortex-M0+ pipeline with a 48 MHz maximum CPU clock, achieving 0.9 DMIPS/MHz. Integrated LIN transceiver and LDO eliminate external PHY and regulator components, enabling compact ECU modules. The 12-bit 350 ksps ADC, multi-mode timers, and SERCOM peripherals support PWM motor control, sensor signal acquisition, and LIN-based body network nodes.
Typical applications include automotive body controllers, HVAC control modules, mirror and seat controllers, LED lighting modules, sensor interfaces, and industrial sensor nodes requiring LIN connectivity. The wide operating range and AEC-Q100 qualification make it suitable for under-hood and cabin-mounted ECUs in passenger and commercial vehicles.
When designing with this SiP, follow the recommended LIN bus termination and ESD protection guidelines from the Microchip datasheet. Place bypass capacitors close to each supply pin and route the LIN pin with controlled impedance and proper shielding to meet automotive EMC requirements. Use the on-chip LDO for MCU core supply and decouple digital and analog domains to minimize noise coupling.
This page consolidates distributor pricing, AEC-Q100 qualified drop-in alternatives, and practical design guidance not assembled in the standalone Microchip datasheet, providing a focused selection reference for automotive LIN node designers.
Alternatives de remplacement direct pour ATSAMHA0E16A-MZT-BVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMHA0E16A-MZT-B
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMHA0G15A-MZT-BVAO
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMHA0E16A-MZT-BVAO Valeurs maximales et caractéristiques électriques
| Product Type | LIN System-in-Package (SiP) - MCU + LIN TRX + VREG |
| Core Processor | ARM Cortex-M0+ (32-bit) |
| CPU Maximum Frequency | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Read-While-Write Data Flash | 2 KB |
| Boîtier | 32-VQFN (5x5 mm) Exposed Pad |
| Type de montage | Surface Mount |
| Nombre de broches | 32 |
| Tension d'alimentation de fonctionnement | 3.3 V |
| Plage de température de fonctionnement | -40C to +105C |
| Integrated LIN Transceiver | Yes (LIN 2.x / SAE J2602) |
| Integrated Voltage Regulator | Yes (internal 3.3V LDO) |
| Automotive Qualification | AEC-Q100 |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMHA0E16A-MZT-BVAO
| Broche 1 | LIN — LIN bus transceiver I/O |
| Broche 2 | VBAT — Battery supply input to LIN TRX |
| Broche 3 | VCC — Internal 3.3V LDO output |
| Broche 4 | GND — Ground |
| Broche 5 | RESET — Reset input (active-low) |
| Broche 6 | SWDIO — SWD debug data |
| Broche 7 | SWCLK — SWD debug clock |
| Broche 8 | PA00 — GPIO / peripheral function |
| Broche 9 | PA01 — GPIO / peripheral function |
| Broche 10 | PA02 — GPIO / ADC input |
| Broche 11 | PA03 — GPIO / ADC reference |
| Broche 12 | PA04 — GPIO / SERCOM |
| Broche 13 | PA05 — GPIO / SERCOM |
| Broche 14 | PA06 — GPIO / SERCOM |
| Broche 15 | PA07 — GPIO / SERCOM |
| Broche 16 | PA08 — GPIO / peripheral function |
| Broche 17 | PA09 — GPIO / peripheral function |
| Broche 18 | PA10 — GPIO / peripheral function |
| Broche 19 | PA11 — GPIO / peripheral function |
| Broche 20 | VCC — Supply (decoupling) |
| Broche 21 | PA14 — GPIO / peripheral function |
| Broche 22 | PA15 — GPIO / peripheral function |
| Broche 23 | PA16 — GPIO / peripheral function |
| Broche 24 | PA17 — GPIO / peripheral function |
| Broche 25 | PA18 — GPIO / peripheral function |
| Broche 26 | PA19 — GPIO / peripheral function |
| Broche 27 | PA20 — GPIO / peripheral function |
| Broche 28 | PA21 — GPIO / peripheral function |
| Broche 29 | PA22 — GPIO / peripheral function |
| Broche 30 | PA23 — GPIO / peripheral function |
| Broche 31 | PA24 — GPIO / peripheral function |
| Broche 32 | PA25 — GPIO / peripheral function |
Applications typiques
ATSAMHA0E16A-MZT-BVAO convient pour 6 applications: Automotive Body Control Module, HVAC Control Module, Automotive LED Lighting Module, Automotive Seat and Mirror Controller, Industrial Sensor LIN Node, Automotive Door Module.
Automotive Body Control Module
The ATSAMHA0E16A-MZT-BVAO is well-suited for automotive body control modules because it integrates the Cortex-M0+ MCU with LIN 2.x transceiver and 3.3V LDO in a single 32-VQFN SiP. With 48 MHz CPU performance, 64KB Flash, and 8KB SRAM, it handles body-domain tasks such as door/window control, seat adjustment, mirror actuation, and interior lighting. The integrated LIN PHY eliminates external transceiver footprint, while AEC-Q100 qualification and -40C to +105C operation allow placement in cabin or adjacent underhood zones.
Recommandé
HVAC Control Module
For HVAC control modules, the ATSAMHA0E16A-MZT-BVAO provides LIN-attached body-network connectivity plus sufficient MCU performance for temperature sensor acquisition and actuator drive PWM generation. The integrated 12-bit ADC and SERCOM peripherals support multi-channel temperature/pressure sensing, while the AEC-Q100 qualification ensures reliable operation across automotive thermal stress. The 32-VQFN 5x5 mm footprint keeps PCB area small enough for compact HVAC panel designs behind the dashboard.
Recommandé
Automotive LED Lighting Module
The ATSAMHA0E16A-MZT-BVAO drives automotive LED lighting modules via its PWM-capable timers and LIN bus connectivity for centralized body-network control. The 48 MHz Cortex-M0+ core executes lighting algorithms including fade, color-mix, and diagnostic routines, while the integrated LIN transceiver interfaces to body-control modules over a single-wire bus. AEC-Q100 qualification and exposed thermal pad simplify thermal management for LED driver stages that share the same PCB.
Recommandé
Automotive Seat and Mirror Controller
Seat and mirror controllers benefit from the ATSAMHA0E16A-MZT-BVAO's combination of LIN connectivity, sufficient Flash for position-memory tables, and automotive-grade qualification. The SiP integrates a LIN PHY and LDO, allowing direct LIN bus attachment without external analog components, while the Cortex-M0+ core handles end-stop detection, current sensing, and motor drive PWM generation for multiple actuators within the seat module.
Recommandé
Industrial Sensor LIN Node
Industrial sensor LIN nodes use the ATSAMHA0E16A-MZT-BVAO to deliver LIN-attached sensor signal acquisition in factory automation environments. The integrated 12-bit ADC and SERCOM peripherals support analog and digital sensor interfaces, while the AEC-Q100 over-spec'd temperature range (-40C to +105C) tolerates industrial ambient conditions. The 64KB Flash accommodates sensor calibration tables and protocol stacks, making this SiP a compact solution for distributed industrial sensor networks.
Recommandé
Automotive Door Module
Door modules powered by the ATSAMHA0E16A-MZT-BVAO integrate window lift, door lock, mirror, and ambient lighting control in a single LIN-attached ECU. The Cortex-M0+ core at 48 MHz handles multi-actuator sequencing and current monitoring, while the integrated LIN transceiver enables body-network communication for central lock and child-safety features. AEC-Q100 qualification and -40C to +105C operation support deployment in side-door and tailgate environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMHA0E16A-MZT-BVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMHA0E16A-MZT-B | ATSAMHA0G15A-MZT-BVAO |
|---|---|---|---|
| Package | 32-VQFN (5x5) | 32-VQFN (5x5) | 32-VQFN (5x5) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| CPU Frequency | 48 MHz | 48 MHz | 48 MHz |
| Integrated LIN TRX | Yes | Yes | Yes |
| Integrated LDO | Yes (3.3V) | Yes (3.3V) | Yes (3.3V) |
| AEC-Q100 | Qualified | Qualified | Qualified |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C |
Principaux différenciateurs
- Single-package LIN + MCU + LDO integration (vs Discrete MCU + external LIN TRX + external LDO designs)
- AEC-Q100 qualification for automotive deployment (vs Industrial-grade Cortex-M0+ MCUs)
- Family pin compatibility within SAM HA0 series (vs ATSAMHA0G15A-MZT-BVAO)
Notes de conception
Place the ATSAMHA0E16A-MZT-BVAO's decoupling capacitors (typically 100 nF ceramic) as close as possible to each VCC pin and the exposed thermal pad. Route the LIN pin with controlled impedance (typically 30-50 ohm) and keep the LIN trace short to minimize EMI susceptibility. Connect the exposed pad to a solid ground pour for thermal dissipation and low-impedance ground return.
The 32-VQFN (5x5) package with exposed pad provides the primary thermal path. Estimated: at 25C ambient with 200 mW internal dissipation, the junction temperature stays well below the +105C operating limit thanks to the 5x5 mm exposed-pad PCB footprint. For continuous high-current LIN bus activity, recommend at least 1 square inch of copper area beneath the exposed pad to keep junction rise below 30C.
Common pitfalls when designing with the ATSAMHA0E16A-MZT-BVAO include: omitting the LIN bus master pull-up resistor, which prevents LIN communication from initializing; incorrect SWD pin routing that prevents debug access; and failing to decouple the integrated LDO output, causing MCU reset under LIN bus load transients. Always reference the Microchip SAM HA0 hardware design checklist before tape-out.
Informations de conformité
AEC-Q100 automotive qualified per Microchip product page and DigiKey listing. RoHS and REACH compliance per Hotenda product entry. Halogen-free status not explicitly stated in verified data.
