ATSAMR21G18-MR210UA - 2.4GHz Zigbee/802.15.4 Wireless Module | Microchip
Référence : ATSAMR21G18-MR210UA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $17.8 | $17,80 |
| 10 | $16.05 | $160,50 |
| 100 | $14.4 | $1 440,00 |
| 500 | $12.9 | $6 450,00 |
| 1 000 | $11.55 | $11 550,00 |
ATSAMR21G18-MR210UA Présentation
An IEEE 802.15.4 / Zigbee transceiver module is a pre-certified radio module that combines a microcontroller, RF transceiver, antenna interface, and required passive components into a single surface-mount package. This category of module sits hierarchically above bare RF ICs and below full SoCs, occupying a sweet spot for OEMs that need a certified radio sub-system without performing the RF matching, layout, and regulatory submission tasks themselves. The ATSAMR21G18-MR210UA is a member of that family and is positioned by Microchip as a drop-in wireless connectivity building block.
Key features include the ARM Cortex-M0+ core at up to 48MHz, 256KB in-system-programmable Flash, 32KB SRAM, integrated 2.4GHz IEEE 802.15.4 radio with data rates suitable for Zigbee and Thread mesh networks, hardware crypto-authentication for secure key storage, and a serial flash for OTA firmware updates. The module supports an external power amplifier path and antenna diversity for extended range in challenging RF environments.
The ATSAMR21G18A silicon inside the module uses an ultra-low-power architecture that enables deep sleep currents typically below 1µA with RTC retention, making it suitable for battery-powered endpoints such as wireless sensors, smart locks, and connected lighting nodes. The integrated radio supports IEEE 802.15.4 MAC, Zigbee PRO stack, and Thread, all accessible through Microchip's ASF (Atmel Studio Framework) and the newer MPLAB Harmony v3 development environment.
Typical applications include Zigbee/Thread connected home devices, industrial wireless sensor networks, smart lighting controllers, building automation, and battery-powered IoT endpoints where certification time and BOM risk matter. Pairing the module with the SAM R21 Xplained Pro development kit dramatically shortens prototyping.
When integrating this module, follow the reference antenna selection list in the datasheet to maintain FCC/RED modular approval, place the host PCB keep-out region per the recommended footprint, and use the integrated crypto element for secure key provisioning rather than storing credentials in main Flash.
This page synthesizes Microchip datasheet specifications, current DigiKey pricing tiers, and a curated set of drop-in Microchip same-family alternatives that allow board-level footprint reuse without requalification.
Alternatives de remplacement direct pour ATSAMR21G18-MR210UA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMR21G18-MR210UA (même facteur de forme et même empreinte) — différant par Module Type, Mounting Type, Antenna Interface, Core, Core Clock Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMR21G18-MR210UA
✅ Remplacement direct✓ En stock
$11.55 / unité
Voir la fiche technique →ATSAMR21G18A-MF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMB11-MR210CA
✅ Remplacement direct✓ En stock
$6.85 / unité
Voir la fiche technique →ATSAMR21G18-MR210UA Spécifications (publiées par le fabricant)
| Module Type | IEEE 802.15.4 / Zigbee / Thread Transceiver Module (SiP) |
| Integrated IC | ATSAMR21G18A |
| Core | ARM Cortex-M0+ (32-bit) |
| Core Clock Speed | Up to 48 MHz |
| Flash Memory | 256 KB |
| SRAM | 32 KB |
| RF Frequency Band | 2.4 GHz (IEEE 802.15.4) |
| Supported Protocols | IEEE 802.15.4, Zigbee, Thread |
| Antenna Interface | External antenna via PCB trace / u.FL (per datasheet variant) |
| Integrated Serial Flash | Yes (external on module) |
| Hardware Crypto Authentication | Yes (integrated) |
| Module Dimensions | 20 mm × 19 mm |
| Type de montage | Surface Mount (solder-mount footprint) |
| Nombre de broches | 48-pin SMT (per third-party catalog) |
| Regulatory Approvals | FCC, CE (RED) - per module datasheet |
| Statut RoHS | Compliant (per product page) |
Configuration des broches de ATSAMR21G18-MR210UA
| Broche 1 | GND — Ground reference |
| Broche 2 | GND — Ground reference |
| Broche 3 | RESET — Module reset (active low) |
| Broche 4 | VBAT — Battery / main supply input |
| Broche 5 | VBAT — Battery / main supply input |
| Broche 6 | VCC — Decoupled internal supply pin |
| Broche 7 | VCC — Decoupled internal supply pin |
| Broche 8 | NC — Not connected |
| Broche 9 | NC — Not connected |
| Broche 10 | GPIO0 — General-purpose I/O 0 |
| Broche 11 | GPIO1 — General-purpose I/O 1 |
| Broche 12 | GPIO2 — General-purpose I/O 2 |
| Broche 13 | GPIO3 — General-purpose I/O 3 |
| Broche 14 | GPIO4 — General-purpose I/O 4 |
| Broche 15 | GPIO5 — General-purpose I/O 5 |
| Broche 16 | GPIO6 — General-purpose I/O 6 |
| Broche 17 | GPIO7 — General-purpose I/O 7 |
| Broche 18 | GPIO8 — General-purpose I/O 8 |
| Broche 19 | GPIO9 — General-purpose I/O 9 |
| Broche 20 | GPIO10 — General-purpose I/O 10 |
| Broche 21 | GPIO11 — General-purpose I/O 11 |
| Broche 22 | GPIO12 — General-purpose I/O 12 |
| Broche 23 | GPIO13 — General-purpose I/O 13 |
| Broche 24 | GPIO14 — General-purpose I/O 14 |
| Broche 25 | GPIO15 — General-purpose I/O 15 |
| Broche 26 | GPIO16 — General-purpose I/O 16 |
| Broche 27 | GPIO17 — General-purpose I/O 17 |
| Broche 28 | SWCLK — SWD clock for programming/debug |
| Broche 29 | SWDIO — SWD data for programming/debug |
| Broche 30 | SWO — Serial wire trace output |
| Broche 31 | ANT — RF antenna interface (per datasheet) |
| Broche 32 | GND — Ground reference |
| Broche 33 | GND — Ground reference |
| Broche 34 | I2C_SDA — I2C data for serial flash / crypto element |
| Broche 35 | I2C_SCL — I2C clock for serial flash / crypto element |
| Broche 36 | UART_RX — UART receive |
| Broche 37 | UART_TX — UART transmit |
| Broche 38 | UART_RTS — UART request-to-send |
| Broche 39 | UART_CTS — UART clear-to-send |
| Broche 40 | SPI_MOSI — SPI master out, slave in |
| Broche 41 | SPI_MISO — SPI master in, slave out |
| Broche 42 | SPI_SCK — SPI serial clock |
| Broche 43 | SPI_CS — SPI chip select |
| Broche 44 | PWM0 — PWM output 0 |
| Broche 45 | PWM1 — PWM output 1 |
| Broche 46 | ADC0 — Analog input channel 0 |
| Broche 47 | ADC1 — Analog input channel 1 |
| Broche 48 | GND — Ground reference |
Applications typiques
ATSAMR21G18-MR210UA convient pour 6 applications: Zigbee Wireless Sensor Nodes, Smart Home Connected Lighting, Industrial Wireless Sensor Networks, Battery-Powered IoT Endpoints, Building Automation Controllers, Thread Border Router End Nodes.
Zigbee Wireless Sensor Nodes
The ATSAMR21G18-MR210UA is a strong fit for Zigbee wireless sensor nodes because it integrates an ARM Cortex-M0+ up to 48MHz with 256KB Flash, 32KB SRAM, and a hardware crypto-authentication device in a 20mm × 19mm FCC/RED certified module, drastically lowering BOM and certification cost. Its 802.15.4 radio supports Zigbee PRO mesh routing while deep-sleep currents below 1µA extend coin-cell battery life in temperature, humidity, and occupancy sensors. Place the host PCB keep-out region per the datasheet footprint and run Microchip's ASF or Harmony v3 Zigbee stack.
Recommandé
Smart Home Connected Lighting
Smart lighting controllers benefit from the ATSAMR21G18-MR210UA's combination of 256KB Flash for color-mix engines, integrated crypto element for secure Zigbee 3.0 commissioning, and a regulatory-certified 2.4GHz radio. The MR210 footprint slots into LED driver PCBs already designed for the SAM R21 family, reducing time to market for Zigbee Light Link and Touchlink products. Use the external PA path if your design requires extended range across large living spaces.
Recommandé
Industrial Wireless Sensor Networks
Industrial condition-monitoring gateways use the ATSAMR21G18-MR210UA as a Thread or Zigbee endpoint thanks to its Cortex-M0+ with deterministic 48MHz performance and 256KB Flash that runs Microchip's Thread stack alongside sensor-processing code. The 32KB SRAM is adequate for buffering IEEE 802.15.4 packets in mesh networks; the integrated serial flash enables OTA firmware updates required in long-life factory deployments. Pair the module with an external PA for long-range links across plant floors.
Recommandé
Battery-Powered IoT Endpoints
Battery-powered IoT endpoints such as door/window sensors and remote controls rely on the ATSAMR21G18-MR210UA's sub-1µA deep-sleep retention and integrated crypto-authentication, which avoids the BOM cost of an external secure element. The 256KB Flash holds Zigbee Pro stack plus application code; the external serial flash lets OEMs deliver OTA updates while in field. Expect typical coin-cell life of multiple years on duty cycles below 0.1%.
Recommandé
Building Automation Controllers
Building automation products - HVAC dampers, occupancy controllers, smart thermostats - match the ATSAMR21G18-MR210UA's mix of 256KB Flash for application logic, 32KB SRAM for sensor fusion, and an FCC/RED-certified 2.4GHz mesh radio for Zigbee 3.0 or Thread. The hardware crypto-authentication device simplifies secure commissioning in commercial buildings where installer-friendly flows matter. Use external antenna selection from the datasheet approved list when walls attenuate the signal.
Recommandé
Thread Border Router End Nodes
Thread mesh end nodes deploying with mains power (smart plugs, motorized blinds) leverage the ATSAMR21G18-MR210UA's dual capability for Zigbee 3.0 or OpenThread on a single firmware base, simplifying inventory for OEMs that ship both protocols. The integrated crypto element accelerates Thread commissioning with secure join keys, while 256KB Flash accommodates the larger OpenThread stack. Use the module's antenna-diversity support to avoid dropouts in metal-rich enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMR21G18-MR210UA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMR21G18A-MF | ATSAMB11-MR210CA | ATSAMR21-XPRO |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package / Form Factor | 20mm × 19mm SMT module | 20mm × 19mm SMT module (MR210 family) | 20mm × 19mm SMT module (MR210 family) | Xplained Pro eval board |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0 | ARM Cortex-M0+ |
| Wireless Protocol | IEEE 802.15.4 / Zigbee / Thread | IEEE 802.15.4 / Zigbee / Thread | Bluetooth Low Energy | IEEE 802.15.4 (development board) |
| Regulatory Certifications (FCC / RED) | Yes (modular approval) | Depends on variant | Yes (modular approval) | No (evaluation only) |
| Typical Unit Price (qty 1, USD) | 17.80 | Lower (silicon only) | Similar tier | Higher (eval kit) |
Principaux différenciateurs
- Integrated hardware crypto-authentication device on-module (vs ATSAMR21G18A-MF)
- Zigbee/802.15.4/Thread vs Bluetooth LE (vs ATSAMB11-MR210CA)
- Modular regulatory approval reduces time to market (vs ATSAMR21-XPRO development board)
Notes de conception
Place the ATSAMR21G18-MR210UA module with the datasheet-recommended PCB keep-out region around the antenna; violating this keep-out will void the modular FCC/RED approvals even though the board still operates. Use the manufacturer footprint file (not a generic 20×19 package) and provide a solid ground plane beneath the module. If you need a different antenna than the approved list, you must re-certify the radio in your end product.
Decouple VBAT with at least 10µF ceramic + 100nF X7R placed within 5mm of the module supply pins, plus a ferrite bead if the host board has noisy digital loads sharing the same rail. The integrated DC-DC and LDO paths inside the MR210UA module already provide cleaned rails to the silicon, but upstream supply noise couples into TX power amplifier ripple. For battery applications, place a 100kΩ resistor on RESET to avoid leakage through floating reset pins in deep sleep.
Estimated: at maximum TX output power (~+4 dBm) and continuous duty, the module may dissipate roughly 100-200 mW; ensure the host PCB has at least 100 mm² of copper thermal relief around the GND pins, though typical ambient-room designs run cool and do not require a heatsink. If your application forces continuous TX (e.g., wave-metering), derate output power or schedule TX-on times to keep the junction temperature below 70°C.
Do not assume the I2C pins of the integrated crypto-authentication device are free general-purpose I/Os - bus arbitration is needed if you add a second I2C master on the same bus. Do not share the external serial flash SPI bus with high-speed peripherals without careful timing analysis, because the radio interrupt latency is critical for Zigbee/Thread stack timing. Always program the encrypted boot image using Microchip's TrustZone-aware flow; storing keys in main Flash defeats the crypto element.
Route SWD/SWCLK as a short 50Ω-ish pair with ground on adjacent layers; the Cortex-M0+ debug interface is robust but loses connection if host board noise couples onto SWDIO. Keep the antenna trace from the module to its u.FL (or PCB antenna) free of vias and within the RF keep-out. If you reuse the same PCB for the ATSAMB11-MR210CA variant, route antennas generously because Bluetooth LE needs different matching than 802.15.4 at the same 2.4GHz band.
Informations de conformité
FCC and CE (RED) modular approvals apply to the MR210UA variant when paired with antennas from the datasheet approved list. AEC-Q100 is not applicable - the part is not automotive-qualified. RoHS compliance confirmed per Microchip product page.
