DSPIC33CH64MP502-I/2N - Dual-Core 16-bit DSC | Microchip
Référence : DSPIC33CH64MP502-I/2N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.1 | $5,10 |
| 10 | $4.65 | $46,50 |
| 100 | $4.1 | $410,00 |
| 500 | $3.75 | $1 875,00 |
| 1 000 | $3.4 | $3 400,00 |
DSPIC33CH64MP502-I/2N Présentation
A Digital Signal Controller merges the computational throughput of a digital signal processor (DSP) with the peripheral integration and deterministic interrupt architecture of a microcontroller (MCU). Within the power-management hierarchy, the DSC sits between general-purpose MCUs and full DSPs, making the dsPIC33CH family a member of the broader embedded processor and motor control semiconductor category.
Key features of the DSPIC33CH64MP502 include its asymmetric dual-core architecture - one master core designed for system supervision and one slave core dedicated to high-performance execution such as control-loop algorithms - plus high-resolution PWM, CAN FD connectivity, and Functional Safety (FuSa) support per Microchip product documentation. The 28-pin UQFN footprint keeps board area under 36 mm2 while retaining analog and communication peripherals.
Technically, the master core handles application logic, communication stacks, and diagnostics, while the slave core runs tightly timed control loops with minimal interrupt latency; the two cores communicate through shared RAM (PRAM) and mailbox registers. This partitioning simplifies firmware complexity in systems that previously required two separate processors. According to the Microchip dsPIC33CH64MP502 datasheet, the family targets high-end embedded control requiring sophisticated algorithms.
Typical applications include digital power supplies, wireless power transfer, server power systems, drone motor control, and automotive sensors, as listed on the Microchip product page. The CAN FD interface and industrial temperature rating support automotive and industrial networked designs.
Design consideration: dual-core partitioning requires allocating slave firmware at build time using Microchip Code Composer-style tooling (MPLAB X); plan the PRAM memory map early to avoid late-stage redesign.
This page synthesizes distributor pricing context, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33CH64MP502-I/2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH64MP502-I/2N (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Functional Safety, Program Flash.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH64MP202-I/2N
✅ Remplacement direct✓ En stock
$3.31 / unité
Voir la fiche technique →DSPIC33CH64MP502-H/2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP203-I/M5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.85 / unité
Voir la fiche technique →DSPIC33CH64MP502-I/2N Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dual-core (master + slave) dsPIC DSC |
| Core Speeds | 180 MIPs, 200 MIPs |
| Program Memory Size | 64 KB Flash |
| Flash + PRAM Total | 88 KB (88K x 8) |
| Tension d'alimentation | 3.3 V (typical) |
| Boîtier | 28-UQFN (6x6 mm), exposed pad |
| Nombre de broches | 28 |
| Connectivity | CAN FD, UART, SPI, I2C |
| PWM | High-Resolution PWM |
| Functional Safety | FuSa supported (per Microchip product page) |
| Température de fonctionnement | -40C to +85C (I grade) |
| Type de montage | Surface Mount |
| Program Memory Width | 24-bit |
| RAM | 20 KWords (per Microchip USA listing for the family) |
Configuration des broches de DSPIC33CH64MP502-I/2N
| Broche 1 | MCLR — Master clear reset input |
| Broche 2 | AN0 — Analog input 0 / port I/O |
| Broche 3 | AN1 — Analog input 1 / port I/O |
| Broche 4 | PGD1 — Programming data / AN2 / RP pin |
| Broche 5 | PGC1 — Programming clock / AN3 / RP pin |
| Broche 6 | AN4 — Analog input 4 / RP pin |
| Broche 7 | VSS — Ground reference |
| Broche 8 | VDD — Positive supply |
| Broche 9 | OSC1 — Oscillator crystal input / clock in |
| Broche 10 | OSC2 — Oscillator crystal output / clock out |
| Broche 11 | AN11 — Analog input 11 / RP pin |
| Broche 12 | AN10 — Analog input 10 / RP pin |
| Broche 13 | AN9 — Analog input 9 / RP pin |
| Broche 14 | AN7 — Analog input 7 / RP pin |
| Broche 15 | AN6 — Analog input 6 / RP pin |
| Broche 16 | AN5 — Analog input 5 / RP pin |
| Broche 17 | VCAP — Internal regulator capacitor connection |
| Broche 18 | VSS — Ground reference |
| Broche 19 | VDD — Positive supply |
| Broche 20 | PWM1H — High-resolution PWM1 high output / RP pin |
| Broche 21 | PWM1L — High-resolution PWM1 low output / RP pin |
| Broche 22 | PWM2H — High-resolution PWM2 high output / RP pin |
| Broche 23 | PWM2L — High-resolution PWM2 low output / RP pin |
| Broche 24 | RP24 — Remappable peripheral pin / port I/O |
| Broche 25 | RP25 — Remappable peripheral pin / port I/O |
| Broche 26 | RP26 — Remappable peripheral pin / port I/O |
| Broche 27 | SDA1 — I2C1 data / RP pin |
| Broche 28 | SCL1 — I2C1 clock / RP pin |
Applications typiques
DSPIC33CH64MP502-I/2N convient pour 6 applications: Digital Power Supplies, Server Power Supplies, Wireless Power Transfer, Drone Motor Control, Automotive Sensors, Industrial Motor Control.
Digital Power Supplies
The DSPIC33CH64MP502-I/2N fits digital power supply designs because its slave core executes the compensation control loop at up to 200 MIPs while the master core manages telemetry, CAN FD/PMBus-style communication, and housekeeping - eliminating a second MCU. The MP5xx high-resolution PWM provides fine duty-cycle resolution for converters switching at hundreds of kilohertz, improving output regulation and transient response. Circuit-wise, the DSC sits in the feedback path driving power-stage MOSFET gate drivers; the asymmetric dual-core split keeps interrupt jitter out of the control loop, a quantifiable benefit in phase-margin stability versus single-core architectures.
Recommandé
Server Power Supplies
In server and telecom rectifier power supplies, the DSPIC33CH64MP502-I/2N is well matched because Microchip explicitly targets the dsPIC33CH family at server power. The slave core runs hot-swap and power-factor-correction loops deterministically at 200 MIPs, while the master core handles digital telemetry to the baseboard management controller over UART or CAN FD. The industrial -40C to +85C rating and FuSa support improve design-in confidence. Placed between current-sense amplifiers and gate drivers, the DSC's high-resolution PWM reduces output ripple and simplifies meeting 80 PLUS-class efficiency targets without external analog compensation networks.
Recommandé
Wireless Power Transfer
Wireless power transmitter and receiver designs benefit from the DSPIC33CH64MP502-I/2N because frequency tracking and foreign-object detection require fast, deterministic control loops plus independent supervisory logic - exactly the asymmetric dual-core split the dsPIC33CH provides. According to Microchip, wireless power is a primary target application for this family. The slave core runs the resonant frequency-tracking algorithm at 200 MIPs with minimal latency, while the master core manages communication and fault logging. The high-resolution PWM generates phase-shifted drive for the H-bridge with fine resolution, improving transfer efficiency across coupling variations.
Recommandé
Drone Motor Control
Drone electronic speed controllers (ESCs) use the DSPIC33CH64MP502-I/2N because sensorless FOC motor control demands both a fast control core and a communication core. The slave core executes field-oriented control at 200 MIPs with the high-resolution PWM driving three-phase bridges, while the master core interfaces to flight controllers over UART or CAN FD and monitors battery and thermal conditions. Microchip lists drones as a target application for the dsPIC33CH family. The compact 28-UQFN 6x6 mm package keeps ESC board area small, and dual-core partitioning yields lower control-loop latency than time-sliced single-core designs.
Recommandé
Automotive Sensors
Automotive sensor modules use the DSPIC33CH64MP502-I/2N because the CAN FD interface supports modern in-vehicle networking bandwidth, and the dsPIC33CH family is cited by Microchip as targeting automotive sensor applications. The master core runs the application and CAN FD stack while the slave core performs signal-conditioning DSP such as filtering and demodulation deterministically. FuSa support assists functional-safety development processes. In a typical signal chain, the DSC reads analog sensor front-ends through its ADC inputs, processes the data on the slave core, and transmits conditioned measurements on the CAN FD bus with low, bounded latency.
Recommandé
Industrial Motor Control
Industrial drives and motion systems leverage the DSPIC33CH64MP502-I/2N's dual-core architecture: the slave core closes the current and speed loops at 200 MIPs, while the master core manages fieldbus communication, safety interlocks, and diagnostics. High-resolution PWM delivers the duty-cycle precision needed for low-torque-ripple sinusoidal drive of PMSM and BLDC motors. The 3.3 V industrial-rated device tolerates typical factory-floor temperature ranges. Placed between current-sense shunt amplifiers and isolated gate drivers, the DSC reduces loop latency versus single-core MCUs, quantifiably improving bandwidth and stability margins in high-dynamic servo applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH64MP502-I/2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH64MP202-I/2N | DSPIC33CH64MP502-H/2N | DSPIC33CH128MP203-I/M5 |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 128 KB |
| Core Architecture | 16-bit dual-core (master + slave) | 16-bit dual-core | 16-bit dual-core | 16-bit dual-core |
| Core Speed | 180 MIPs / 200 MIPs | 180 MIPs / 200 MIPs | Reduced speed grade (-H option) | 180 MIPs / 200 MIPs |
| Peripheral Set | MP5xx with high-resolution PWM | MP2xx base peripheral set | MP5xx - identical | MP2xx base peripheral set |
| CAN FD | Yes | Yes | Yes | Yes |
| Temperature Grade | -I (industrial) | -I (industrial) | -H variant | -I (industrial) |
Principaux différenciateurs
- MP5xx high-resolution PWM peripheral set (vs DSPIC33CH64MP202-I/2N)
- Industrial -I temperature grade with full speed (vs DSPIC33CH64MP502-H/2N)
- Compact 28-pin footprint vs larger family members (vs DSPIC33CH128MP506-I/PT)
Notes de conception
The dsPIC33CH has an internal 1.8 V core regulator; connect a low-ESR ceramic capacitor (typically around 10 uF, value per datasheet) from VCAP to VSS close to the pin, and do not load the VCAP node externally. Decouple each VDD pin with 0.1 uF ceramic plus bulk capacitance near the exposed pad. Verify exact capacitor values against the Microchip dsPIC33CH64MP502 datasheet before release.
The exposed pad of the 28-UQFN (6x6) is the primary ground and thermal path - solder it to a grounded copper pour with an array of thermal vias. The 0.5 mm pitch requires careful stencil design (use ~80% pad aperture reduction) to avoid solder bridging on the fine-pitch lands. Follow Microchip UQFN layout application guidance for footprint dimensions.
Dual-core programming is the most common integration pitfall: the slave core image must be compiled and merged into the master project; forgetting to update the slave image after control-loop changes silently ships stale firmware. Also reserve the PRAM mailbox map early - changing shared-memory layout late breaks both cores' communication. Budget MCLR/PGD/PGC routing for in-circuit debugging on the 28-pin footprint.
Informations de conformité
Compliance statuses were not stated in the provided verified web data; confirm on the Microchip product page or distributor environmental data before export documentation.
