DSPIC33EP128GS702T-I/2N - 16-bit 70 MIPS DSC 128KB Flash | Microchip
Référence : DSPIC33EP128GS702T-I/2N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.95 | $495,00 |
| 500 | $4.45 | $2 225,00 |
| 1 000 | $4.02 | $4 020,00 |
DSPIC33EP128GS702T-I/2N Présentation
A digital signal controller (DSC) combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller, sitting within the broader hierarchy of semiconductor devices as: DSC -> digital signal processor/microcontroller hybrid -> embedded processor -> integrated circuit. The dsPIC33EP GS-series from Microchip is specifically architected for digital power conversion.
Key features include a 16-bit modified Harvard architecture core clocked at 70 MIPS, dedicated DSP engine with 40-bit accumulators and single-cycle MAC, high-resolution PWM modules suited to switch-mode power supplies, 20 general-purpose I/O pins, and support for 3V to 3.6V operation. The device is part of Microchip's Functional Safety (FuSa) supported family.
The GS-series integrates SMPS-optimized peripherals supporting common multi-loop digital switch-mode power supplies, including AC/DC and DC/DC converter control loops with fast ADC triggering and complementary PWM outputs.
Typical applications include digital AC/DC power supplies, solar inverters and MPPT converters, LED drivers, battery chargers, and uninterruptible power supplies.
Design consideration: the 3.0V to 3.6V supply range requires a regulated 3.3V rail; the UQFN package's exposed pad should be soldered to a ground pour for thermal and signal integrity. Dual-partition FLASH architecture supports live firmware updates for field upgrades.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP128GS702T-I/2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP128GS702T-I/2N (même facteur de forme et même empreinte) — différant par Package, Program Memory Size, Program Memory Type, RAM Size, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP128GS702-I/2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP128GS702T-E/2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CK32MC102T-I/2N
✅ Remplacement direct✓ En stock
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Voir la fiche technique →DSPIC33EP128GS702T-I/2N Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33EP modified Harvard |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 128KB (43K x 24) FLASH |
| RAM Size | 8KB (8K x 8) |
| Operating Voltage Range | 3 V to 3.6 V |
| I/O Pins | 20 |
| Boîtier | 28-UQFN (6x6 mm) |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T) |
| Temperature Grade | Industrial (-40C to +85C), I suffix |
| Product Family | dsPIC33EP GS-series (SMPS & Digital Power Conversion) |
| Functional Safety Support | Yes (FuSa) |
| Timers | 7 |
| External Interrupts | 4 |
| Serial I/O Channels | 4 |
| Program Memory Type | FLASH, dual-partition capable |
Configuration des broches de DSPIC33EP128GS702T-I/2N
| Broche 1 | MCLR — Master clear reset (active low), programming voltage input |
| Broche 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference / change notification / port B |
| Broche 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference / change notification / port B |
| Broche 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select 1 / port B |
| Broche 5 | AN3/INDX/CN5/RB3 — Analog input 3 / QEI index / port B |
| Broche 6 | PGEC3/AN4/QEA/RB4 — Debug clock channel 3 / analog input 4 / QEI A input / port B |
| Broche 7 | PGED3/AN5/QEB/RB5 — Debug data channel 3 / analog input 5 / QEI B input / port B |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1/CLKI/CN6/RA2 — Oscillator input / external clock input / port A |
| Broche 10 | OSC2/CLKO/CN7/PGEC7/RA3 — Oscillator output / clock output / debug clock channel 7 / port A |
| Broche 11 | VDD — Positive supply (3.0V to 3.6V) |
| Broche 12 | SOSCI/CN8/RB6 — Secondary oscillator input / port B |
| Broche 13 | SOSCO/T1CK/CN9/RB7 — Secondary oscillator output / Timer1 clock / port B |
| Broche 14 | T2CK/IC1/RB8 — Timer2 external clock / input capture 1 / port B |
| Broche 15 | IC2/CTED1/RB9 — Input capture 2 / CTMU edge detect 1 / port B |
| Broche 16 | OC1/RB14 — Output compare 1 / port B |
| Broche 17 | OC2/CTED2/RB13 — Output compare 2 / CTMU edge detect 2 / port B |
| Broche 18 | RP15/RB15 — Remappable peripheral pin 15 / port B |
| Broche 19 | PGEC1/AN6/RP16/RB10 — Debug clock channel 1 / analog input 6 / remappable pin 16 / port B |
| Broche 20 | PGED1/AN7/RP17/RB11 — Debug data channel 1 / analog input 7 / remappable pin 17 / port B |
| Broche 21 | PGEC2/AN8/RP18/RB12 — Debug clock channel 2 / analog input 8 / remappable pin 18 / port B |
| Broche 22 | PGED2/AN9/RP19/RB13 — Debug data channel 2 / analog input 9 / remappable pin 19 / port B |
| Broche 23 | SDA1/RP20/RB5 — I2C1 data / remappable pin 20 / port B |
| Broche 24 | SCL1/RP21/RB4 — I2C1 clock / remappable pin 21 / port B |
| Broche 25 | AVSS — Analog ground |
| Broche 26 | AVDD — Analog supply (3.0V to 3.6V) |
| Broche 27 | VSS — Ground reference |
| Broche 28 | VDD — Positive supply (3.0V to 3.6V) |
Applications typiques
DSPIC33EP128GS702T-I/2N convient pour 6 applications: Digital AC/DC Power Supplies, Solar Inverters and MPPT Converters, Battery Chargers and BMS Front-End Control, Digital LED Drivers for Lighting, Uninterruptible Power Supplies (UPS), Industrial Motor Control and Embedded Sensing.
Digital AC/DC Power Supplies
The DSPIC33EP128GS702T-I/2N is purpose-designed by Microchip for multi-loop digital switch-mode power supply control. Its 70 MIPS 16-bit DSP core with single-cycle MAC closes current and voltage loops at switching frequencies of 100 kHz and above with deterministic latency, while the high-resolution PWM peripherals generate complementary outputs with nanosecond-adjustable duty cycles for phase-shifted and LLC topologies. The 8KB RAM supports control-law state plus compensation networks, and fast ADC triggering synchronized to the PWM period samples inductor current precisely at midpoint, minimizing switching-noise artifacts. Unlike analog controllers, firmware-based control enables adaptive dead-time, soft-start shaping, and telemetry over serial links.
Recommandé
Solar Inverters and MPPT Converters
Solar micro-inverters and MPPT converters require simultaneous maximum-power-point tracking and grid-synchronized output generation - a workload matched to the DSPIC33EP128GS702T-I/2N's dual capability of DSP math (for MPPT algorithms such as incremental conductance) and precise PWM generation (for DC/DC and DC/AC stages). The 70 MIPS core executes these loops with headroom, the 20 I/O pins interface relays, sensors, and communication, and the 128KB FLASH with dual-partition architecture permits field firmware updates on installed units - critical for long-lifetime solar products. The industrial -40C to +85C rating covers rooftop and outdoor enclosure environments.
Recommandé
Battery Chargers and BMS Front-End Control
Multi-chemistry battery chargers benefit from the DSPIC33EP128GS702T-I/2N's firmware-defined charging profiles: CC/CV phases, taper termination, and temperature-compensated thresholds are implemented in software rather than fixed analog circuitry. The 70 MIPS core runs charge-state machines and protection routines with margin, while PWM outputs drive buck or buck-boost power stages at duty resolutions suitable for accurate current regulation. The 4 serial channels provide SMBus/I2C-style pack communication, and 4 external interrupt lines handle fault and detection events with fast response. The 3.0V to 3.6V supply simplifies rail generation from a small auxiliary regulator.
Recommandé
Digital LED Drivers for Lighting
Professional LED luminaires and constant-current drivers use the DSPIC33EP128GS702T-I/2N for closed-loop current regulation, dimming (PWM or analog via DAC/PWM-filtered output), and protection against open/short faults. The high-resolution PWM achieves flicker-free dimming curves down to very low duty cycles, and the DSP core handles light-curve compensation and thermal derating logic concurrently. 128KB FLASH accommodates multi-profile firmware supporting several luminaire SKUs from one PCB, reducing inventory cost. The 6x6 mm UQFN fits compact driver housings, and the industrial temperature range suits enclosed fixtures with elevated internal temperatures.
Recommandé
Uninterruptible Power Supplies (UPS)
Line-interactive and double-conversion UPS systems require coordinated control of a rectifier/PFC stage, battery converter, and inverter stage - multi-loop control that the DSPIC33EP128GS702T-I/2N handles with its 70 MIPS DSP core and multiple PWM modules. Fast ADC sampling synchronized to PWM keeps current loops stable across mode transitions (line, battery, bypass), and the 4 serial channels support host communication and status reporting. Dual-partition FLASH enables redundant-boot firmware, improving availability in a product where reliability is the core promise. The FuSa (Functional Safety) family support assists designers of safety-relevant power infrastructure.
Recommandé
Industrial Motor Control and Embedded Sensing
Beyond power conversion, the DSPIC33EP128GS702T-I/2N serves as a compact embedded controller for sensor aggregation, small motor drives, and industrial subassemblies where DSP math (filters, FFTs) plus deterministic control is needed. The 70 MIPS core executes FIR/IIR filtering on ADC streams, 7 timers support multi-channel timing, and 20 I/O pins drive indicators, switches, and communication transceivers. The 6x6 mm UQFN packages this capability into space-constrained PCB areas, and the dsPIC33EP ecosystem provides mature toolchain (MPLAB X, XC16 compiler) support for long-term product maintenance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP128GS702T-I/2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP128GS702-I/2N | DSPIC33EP128GS702T-E/2N | DSPIC33EP128GS702T-I/MM | DSPIC33CK32MC102T-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-QFN-S (5x5 mm) - different footprint | 28-UQFN (6x6 mm) - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | 16-bit dsPIC33EP, 70 MIPS | 16-bit dsPIC33EP, 70 MIPS | 16-bit dsPIC33EP, 70 MIPS | 16-bit dsPIC33EP, 70 MIPS | 16-bit dsPIC33CK, 70 MIPS-class |
| Program Memory (FLASH) | 128KB (43K x 24) | 128KB (43K x 24) | 128KB (43K x 24) | 128KB (43K x 24) | 32KB |
| Temperature Grade | Industrial (-40C to +85C, I suffix) | Industrial (-40C to +85C) | Extended (E suffix) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Packaging / Feed | Tape & Reel (T suffix) | Tray (no T suffix) | Tape & Reel | Tape & Reel | Tape & Reel |
| Family Generation | dsPIC33EP GS (SMPS/digital power) | dsPIC33EP GS - identical | dsPIC33EP GS - identical | dsPIC33EP GS - identical | dsPIC33CK (next generation) |
Principaux différenciateurs
- Largest GS702 memory option for multi-loop control (vs DSPIC33CK32MC102T-I/2N)
- Industrial-grade availability with identical footprint (vs DSPIC33EP128GS702T-E/2N)
- Compact 6x6 mm UQFN versus 5x5 QFN-S variant (vs DSPIC33EP128GS702T-I/MM)
Notes de conception
Supply the DSPIC33EP128GS702T-I/2N from a regulated 3.3V rail within the specified 3.0V to 3.6V window; both VDD pairs (pins 11 and 28) and AVDD (pin 26) must be tied to the same rail. Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus one bulk 4.7uF to 10uF capacitor near the device. Keep AVDD on a filtered or ferrite-isolated 3.3V branch to preserve ADC accuracy in power-conversion control loops.
The 28-UQFN (6x6) has an exposed thermal pad that must be soldered to a grounded copper pour; a typical stencil of ~50-70% coverage with 4-5 via pairs to the ground plane gives reliable reflow and improves thermal dissipation for 70 MIPS operation. The 0.65 mm terminal pitch is hand-touchable only with a hot-air rework station - plan for automated assembly or order the /SO SOIC variant for prototype boards.
Do not confuse package suffixes when ordering: /2N = 28-UQFN 6x6, /MM = 28-QFN-S 5x5, /SO = 28-SOIC - footprints are NOT interchangeable and a wrong-suffix order renders the part unsolderable on your board. Also, the T suffix means tape-and-reel only; for hand placement or small prototypes order the non-T (tray) version DSPIC33EP128GS702-I/2N. Verify the temperature suffix (I vs E) matches your environment's worst-case ambient.
Informations de conformité
Compliance status was not stated in the provided verified web data. Modern Microchip dsPIC33EP devices are typically RoHS-compliant, but confirm on the Microchip product page before procurement.
