DSPIC33EP128MC502-H/SP - 16-bit 60 MIPS Motor Control DSC | Microchip
Référence : DSPIC33EP128MC502-H/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.2 | $42,00 |
| 100 | $3.75 | $375,00 |
| 500 | $3.4 | $1 700,00 |
| 1 000 | $3.05 | $3 050,00 |
DSPIC33EP128MC502-H/SP Présentation
A digital signal controller combines the compute capability of a DSP with the peripheral integration and ease of use of a microcontroller. In the embedded hierarchy, the dsPIC33E family sits above general-purpose PIC16/PIC18 MCUs and beside 32-bit MCUs, targeting control loops that need multiply-accumulate DSP instructions, such as field-oriented motor control and digital power conversion.
Key features include the high-speed PWM module purpose-built for motor control, an ADC configurable as 10-bit at 1.1 Msps with four sample-and-hold circuits or 12-bit at 500 ksps with one sample-and-hold, and up to three on-chip op amps/comparators with direct connection to the ADC. These integrated analog blocks eliminate external amplifiers in current-sense feedback paths.
Architecturally, the device executes a modified Harvard 16-bit instruction set with DSP engine (40-bit accumulators, single-cycle MAC) and supports In-Circuit Serial Programming (ICSP) and In-Circuit Debugging with two program and two complex data breakpoints, plus IEEE 1149.2-compatible (JTAG) boundary scan. Multiple PGECx/PGEDx pin pairs allow flexible debugger hookup.
Typical applications include brushless DC and PMSM motor drives, digital power supplies, automotive actuators, and industrial automation nodes where a 28-pin through-hole footprint eases prototyping and low-volume assembly.
Design consideration: use any PGEC/PGED pair as a matched set for ICSP (for example PGEC2 with ICSPCLK paired to PGED2 for ICSPDAT) and connect all VDD/VSS pins during programming.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP128MC502-H/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP128MC502-H/SP (même facteur de forme et même empreinte) — différant par Package, Core, Core Architecture, RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP128MC502-I/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.55 / unité
Voir la fiche technique →DSPIC33EP128MC502-E/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC502-H/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.95 / unité
Voir la fiche technique →DSPIC33EP64MC502-H/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128MC202-H/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128MC502-H/SP Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E 16-bit DSC |
| CPU Speed | 60 MIPS (60 MHz) |
| Program Memory Size | 128KB (43K x 24) Flash |
| RAM Size | 16KB |
| Boîtier | 28-SPDIP (0.300 in, 7.62 mm) |
| Type de montage | Through Hole |
| ADC Resolution | 10-bit (1.1 Msps, 4 S&H) or 12-bit (500 ksps, 1 S&H) |
| Analog Inputs | 6 (on 28-pin devices) |
| Op Amps / Comparators | Up to 3, direct ADC connection |
| PWM | High-Speed PWM module for motor control |
| Debug / Programming | ICSP, In-Circuit Debug, 2 program + 2 data breakpoints |
| Boundary Scan | IEEE 1149.2 compatible (JTAG) |
| Qualification | AEC-Q100 (Automotive) |
| Series | dsPIC 33EP |
Guide de configuration des broches du DSPIC33EP128MC502-H/SP 28-spdip (0.300 in, 7.62 mm)
Configuration des broches du DSPIC33EP128MC502-H/SP (boîtier 28-spdip (0.300 in, 7.62 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP128MC502-H/SP.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP128MC502-H/SP convient pour 6 applications: BLDC / PMSM Motor Control, Digital Power Supplies, Automotive Actuators and Body Electronics, Industrial Automation and Sensing Nodes, Embedded Audio and Signal Processing, Test, Measurement, and Prototyping.
BLDC / PMSM Motor Control
The DSPIC33EP128MC502-H/SP fits brushless DC and permanent-magnet synchronous motor drives because its 60 MIPS DSP core executes field-oriented control loops with single-cycle MAC instructions while the high-speed PWM module generates complementary gate signals with hardware dead-time insertion. The 10-bit 1.1 Msps ADC with four sample-and-hold circuits samples phase currents at the PWM center, and up to three on-chip op amps condition low-side shunt signals directly, eliminating external amplifiers. The result is a complete single-chip FOC drive for fans, pumps, and servo motors in a 28-pin footprint.
Recommandé
Digital Power Supplies
In digital SMPS and PFC stages, this DSC closes current- and voltage-loop feedback at switching frequencies where its 500 ksps 12-bit ADC mode and deterministic 60 MIPS instruction timing matter. The high-speed PWM supports complementary outputs and dead-time control suited to half-bridge and LLC topologies, while on-chip comparators provide fast cycle-by-cycle overcurrent protection independent of the CPU. Firmware-defined control laws let one hardware design serve multiple output voltages, and the 128KB Flash leaves room for compensation tables, telemetry, and bootloader code.
Recommandé
Automotive Actuators and Body Electronics
AEC-Q100 qualification makes the DSPIC33EP128MC502-H/SP suitable for automotive motor loads such as throttle actuators, HVAC dampers, pumps, and window lifts. The 60 MIPS core runs sensorless control algorithms across the automotive temperature range, six ADC channels read position potentiometers and current shunts, and CRC/JTAG boundary-scan support aids manufacturing test. The through-hole SPDIP package also supports low-volume, serviceable automotive subassemblies where solderability inspection and hand rework remain practical requirements.
Recommandé
Industrial Automation and Sensing Nodes
Factory nodes benefit from the combination of DSP math for filtering (FFT, FIR) and rich serial peripherals for Modbus/CAN-style field connectivity. The 128KB Flash accommodates protocol stacks plus the application, and the 16KB RAM buffers sensor arrays. In a prototyping or pilot-line environment, the 28-pin SPDIP through-hole package plugs directly into breadboards and socketed industrial carrier boards, shortening iteration time; the same board then migrates to the SOIC or QFN sibling for production volume with identical firmware.
Recommandé
Embedded Audio and Signal Processing
The dsPIC33E DSP engine, with 40-bit accumulators and single-cycle multiply-accumulate, performs real-time filtering and spectral analysis at 60 MIPS, enough bandwidth for audio preprocessing, tone detection, and active-noise-control tasks. The 12-bit 500 ksps ADC digitizes microphone or sensor inputs while the on-chip op amps provide gain staging without external components. The 128KB program space stores coefficient tables and multiple algorithm profiles, and the through-hole package simplifies bench prototyping of DSP algorithms before surface-mount production release.
Recommandé
Test, Measurement, and Prototyping
Bench instruments and lab prototypes use this DSC for sequence control, data logging, and simple DSP analysis. JTAG boundary scan (IEEE 1149.2 compatible) supports board-level test, and in-circuit debugging with two program and two complex data breakpoints accelerates firmware development under MPLAB X. The SPDIP package is socket-friendly: parts can be swapped without hot-air rework, which is why it remains a favorite for university labs, evaluation boards, and low-volume instruments. Multiple PGEC/PGED pairs allow flexible programming header placement on carrier boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP128MC502-H/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP128MC502-I/SP | DSPIC33EP128MC502-E/SP | DSPIC33EP256MC502-H/SP | DSPIC33EP64MC502-H/SP | DSPIC33EP128MC202-H/SP |
|---|---|---|---|---|---|---|
| Package | 28-SPDIP | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 128KB (43K x 24) | 128KB | 128KB | 256KB | 64KB | 128KB |
| Motor-Control Peripherals | High-Speed PWM, MC-family ADC/OpAmps | Identical | Identical | Identical | Identical | Reduced (GP-ish peripheral set) |
| Temperature Grade | /H (extended range ordering) | /I industrial | /E extended | /H (same as target) | /H (same as target) | /H (same as target) |
Principaux différenciateurs
- Integrated analog saves external components (vs DSPIC33EP128MC202-H/SP)
- Double the program memory at same footprint (vs DSPIC33EP64MC502-H/SP)
- Automotive qualification (vs Generic hobbyist MCU alternatives)
- Through-hole prototyping advantage (vs DSPIC33EP128MC502-H/MM (QFN))
Notes de conception
ICSP programming requires a matched PGEC/PGED pair: if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2 - never mix pairs. Per the dsPIC33EP documentation, all VDD and VSS pins must be connected during programming and debugging. Route the programming header (5 pins: MCLR, VDD, GND, PGECx, PGEDx) on every production PCB even when field programming is not planned, or you will lose in-circuit debugging capability.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within a few millimeters of the pin, plus one bulk 4.7-10 uF capacitor per board. Motor-control designs switching high PWM currents should separate the analog supply path (AVDD) from noisy digital rails with an RC or ferrite filter so the 1.1 Msps ADC achieves its specified accuracy; keep current-shunt kelvin routing dedicated to the op-amp/ADC input pins.
Although this is a through-hole SPDIP part, keep oscillator traces short and place the high-speed PWM gate-driver returns away from the analog front end to limit ground bounce on ADC readings. If you plan a later migration to the SOIC or QFN sibling (DSPIC33EP128MC204T-I/MV), design a dual-footprint carrier and keep crystal/ICSP nets identical so the same firmware and layout migrate without redesign.
When using the on-chip op amps for current-sense feedback, source impedance on the non-inverting input should be kept low and symmetric to minimize offset from input bias currents; add a small RC anti-alias filter ahead of the ADC when operating in the 12-bit 500 ksps mode if the source has wideband noise. Estimated: a 1 kohm / 1 nF filter sets a 159 kHz pole, well above typical FOC current-loop bandwidths.
Informations de conformité
AEC-Q100 automotive qualification stated in DigiKey and Hotenda distributor listings. RoHS/REACH status not stated in the provided verified data.
