DSPIC33EP128MC506T-I/MR - 70 MIPS 16-bit DSC, 128KB Flash | Microchip
Référence : DSPIC33EP128MC506T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.85 | $7,85 |
| 10 | $7.06 | $70,60 |
| 100 | $6.1 | $610,00 |
| 500 | $5.55 | $2 775,00 |
| 1 000 | $4.9 | $4 900,00 |
DSPIC33EP128MC506T-I/MR Présentation
A digital signal controller combines the compute throughput of a digital signal processor with the peripheral integration and deterministic control of a microcontroller. In the power-management IC hierarchy, the dsPIC33E family sits above basic MCUs and below full DSPs, targeting real-time control loops where fast multiply-accumulate operations meet motor commutation and power-conversion tasks.
Key features include an operating speed up to 70 MIPS at 3.3V, on-chip operational amplifiers, high-resolution PWM (MCPWM) peripherals for motor control, analog comparators, a CAN 2.0B controller, and a Reconfigurable Peripheral Tile (PTG) for custom sequencing. The integrated DSP engine supports single-cycle MAC and hardware division for control-law execution.
Architecturally, the dsPIC33EP core pairs a 16-bit modified Harvard pipeline with DSP addressing modes and a zero-overhead DO/REPEAT loop mechanism. Flash program memory with ECC and 16KB SRAM supports real-time field-oriented control firmware. The E-series silicon is fabricated in Microchip's flash process with industrial temperature support.
Typical applications include precision motor control (BLDC, PMSM, ACIM), digital power supplies (PFC, LLC), solar inverters, and industrial automation nodes requiring CAN networking. The MCPWM and on-chip op-amps reduce external analog BOM cost.
Design tip: budget the 3.3V regulator for core current spikes at 70 MIPS and keep VDD/VSS decoupling tight on the exposed-pad QFN-64 for analog peripheral accuracy.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP128MC506T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP128MC506T-I/MR (même facteur de forme et même empreinte) — différant par Package, Core, RAM, Operating Temperature, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP128MC506T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC506T-E/MR
✅ Remplacement direct✓ En stock
$5.08 / unité
Voir la fiche technique →DSPIC33EP256MC506T-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.65 / unité
Voir la fiche technique →DSPIC33EP64MC506T-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33EP128MC506T-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33EP DSC core |
| Maximum CPU Speed | 70 MIPs (60 MHz per Mouser listing, up to 70 MIPS core) |
| Program Memory (Flash) | 128 KB (43K x 24) |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage | 3 V to 3.6 V (3.3 V nominal) |
| Boîtier | 64-VQFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Temperature Grade | I grade (-40C to +85C) |
| Motor Control PWM | Yes (MCPWM) |
| On-chip Op-Amps | Yes |
| Comparators | Yes |
| CAN | Yes (CAN 2.0B) |
| Reconfigurable Peripheral Tile (PTG) | Yes |
| Packaging | Tape & Reel (T suffix) |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33EP128MC506T-I/MR
| Broche 1 | VDD — Power supply (3.0V-3.6V) |
| Broche 2 | VSS — Ground reference |
| Broche 3 | AN1/VREF-/RA1 — Analog input 1 / negative voltage reference |
| Broche 4 | AN0/VREF+/RA0 — Analog input 0 / positive voltage reference |
| Broche 5 | PGD3/RP41/RB9 — Debug data channel 3 / remappable I/O |
| Broche 6 | PGC3/RP42/RB10 — Debug clock channel 3 / remappable I/O |
| Broche 7 | AN4/RB2 — Analog input 4 / digital I/O |
| Broche 8 | AN5/RB3 — Analog input 5 / digital I/O |
| Broche 9 | VSS — Ground reference |
| Broche 10 | OSC1/CLKI/RC12 — Primary oscillator input / external clock |
| Broche 11 | OSC2/CLKO/RC15 — Primary oscillator output / clock out |
| Broche 12 | VDD — Power supply |
| Broche 13 | SOSCI/RP43/RC13 — Secondary oscillator input / remappable I/O |
| Broche 14 | SOSCO/T1CK/RP44/RC14 — Secondary oscillator output / Timer1 clock |
| Broche 15 | PGD1/RP45/RB5 — Primary debug data / remappable I/O |
| Broche 16 | PGC1/RP46/RB6 — Primary debug clock / remappable I/O |
| Broche 17 | VSS — Ground reference |
| Broche 18 | MCLR — Master clear reset (active low), programming voltage input |
| Broche 19 | AN11/RP47/RB15 — Analog input 11 / remappable I/O |
| Broche 20 | VSS — Ground reference |
| Broche 21 | AN12/RP48/RB16 — Analog input 12 / remappable I/O |
| Broche 22 | AN13/RP49/RB17 — Analog input 13 / remappable I/O |
| Broche 23 | AN14/RP50/RB18 — Analog input 14 / remappable I/O |
| Broche 24 | AN15/RP51/RB19 — Analog input 15 / remappable I/O |
| Broche 25 | RP52/RB20 — Remappable I/O |
| Broche 26 | RP53/RB21 — Remappable I/O |
| Broche 27 | VDD — Power supply |
| Broche 28 | RP54/RB22 — Remappable I/O |
| Broche 29 | RP55/RB23 — Remappable I/O |
| Broche 30 | AN6/RB24 — Analog input 6 / digital I/O |
| Broche 31 | AN7/RB25 — Analog input 7 / digital I/O |
| Broche 32 | VSS — Ground reference |
| Broche 33 | RP56/RC1 — Remappable I/O |
| Broche 34 | RP57/RC2 — Remappable I/O |
| Broche 35 | RP58/RC3 — Remappable I/O |
| Broche 36 | RP59/RC4 — Remappable I/O |
| Broche 37 | RP60/RC5 — Remappable I/O |
| Broche 38 | VDD — Power supply |
| Broche 39 | RP61/RC6 — Remappable I/O |
| Broche 40 | RP62/RC7 — Remappable I/O |
| Broche 41 | VSS — Ground reference |
| Broche 42 | RP63/RC8 — Remappable I/O |
| Broche 43 | RP64/RC9 — Remappable I/O |
| Broche 44 | AN8/RB26 — Analog input 8 / digital I/O |
| Broche 45 | AN9/RB27 — Analog input 9 / digital I/O |
| Broche 46 | AN10/RB28 — Analog input 10 / digital I/O |
| Broche 47 | VDD — Power supply |
| Broche 48 | RP65/RD0 — Remappable I/O |
| Broche 49 | RP66/RD1 — Remappable I/O |
| Broche 50 | RP67/RD2 — Remappable I/O |
| Broche 51 | RP68/RD3 — Remappable I/O |
| Broche 52 | VSS — Ground reference |
| Broche 53 | RP69/RD4 — Remappable I/O |
| Broche 54 | RP70/RD5 — Remappable I/O |
| Broche 55 | RP71/RD6 — Remappable I/O |
| Broche 56 | RP72/RD7 — Remappable I/O |
| Broche 57 | VDD — Power supply |
| Broche 58 | RP73/RD8 — Remappable I/O |
| Broche 59 | RP74/RD9 — Remappable I/O |
| Broche 60 | RP75/RD10 — Remappable I/O |
| Broche 61 | RP76/RD11 — Remappable I/O |
| Broche 62 | VSS — Ground reference |
| Broche 63 | AN2/C2IN-/RA2 — Analog input 2 / comparator 2 inverting input |
| Broche 64 | AN3/C3IN-/RA3 — Analog input 3 / comparator 3 inverting input |
Applications typiques
DSPIC33EP128MC506T-I/MR convient pour 6 applications: Precision Motor Control (BLDC/PMSM), Digital Power Supplies (PFC/LLC), Solar Inverters and Renewable Energy, Industrial Automation and CAN Networks, Battery-Powered and Portable Equipment, Test, Measurement and Instrumentation.
Precision Motor Control (BLDC/PMSM)
The DSPIC33EP128MC506T-I/MR fits precision motor control because its 70 MIPS DSP core executes field-oriented control (FOC) loops at PWM frequencies of 20 kHz or higher with ample cycle margin, while the MCPWM peripheral provides complementary outputs with programmable dead time. The on-chip operational amplifiers amplify shunt current signals without external op-amps, and the analog comparators support cycle-by-cycle overcurrent limiting, reducing BOM cost and board area. Firmware typically runs a 100 us current loop and a 1 ms speed loop; the DSP engine's single-cycle MAC and hardware division keep both loops deterministic. Place the controller near gate drivers with a solid exposed-pad ground connection to keep analog current-sense accuracy within a few LSBs.
Recommandé
Digital Power Supplies (PFC/LLC)
For digital power conversion such as PFC stages and LLC resonant converters, the DSPIC33EP128MC506T-I/MR offers the high-resolution MCPWM module and fast ADC sampling synchronized to the PWM period, which are the two requirements for tight control of switching converters. The 70 MIPS core allows average-current-mode or peak-current-mode control at 100 kHz-plus switching frequencies with compensator execution each cycle. On-chip comparators provide hardware-based overcurrent shutdown with propagation in the microsecond range, independent of software latency. A design consideration is supply cleanliness: the 3.3V rail should be locally regulated with ferrite and ceramic decoupling so ADC references and the comparator thresholds are not disturbed by switching noise.
Recommandé
Solar Inverters and Renewable Energy
Grid-tied and off-grid solar inverter designs benefit from the DSPIC33EP128MC506T-I/MR's combination of MCPWM generation, CAN 2.0B networking for inverter-to-monitor communication, and DSP throughput for MPPT algorithms running alongside the inverter control loop. The 128KB Flash accommodates MPPT, grid-synchronization (PLL), and protection firmware with room for field-upgradeable code. The industrial -40C to +85C rating matches outdoor combiner-box and inverter enclosure conditions. Designers should dedicate the on-chip op-amps to DC-link current sensing and use the PTG peripheral for autonomous sequencing tasks, freeing the core to concentrate on the time-critical control loop.
Recommandé
Industrial Automation and CAN Networks
In factory automation nodes, the DSPIC33EP128MC506T-I/MR's integrated CAN 2.0B controller connects drives, sensors, and HMIs on industrial fieldbuses without an external CAN controller. The 70 MIPS core handles protocol stacks plus local control tasks, while the 16KB RAM buffers messaging and control state. Peripheral Pin Select (PPS) lets UART, SPI, and other digital peripherals be routed to flexible pins, simplifying PCB routing on the dense 64-pin VQFN. The industrial temperature range and RoHS compliance suit DIN-rail and cabinet-mounted controllers. For environments with higher ambient temperatures, the E-grade DSPIC33EP128MC506T-E/MR is a pin-compatible substitution with no firmware changes.
Recommandé
Battery-Powered and Portable Equipment
The DSPIC33EP128MC506T-I/MR supports battery-powered designs through its power-managed modes, including idle and doze operation that scale core and peripheral clocks to cut consumption while keeping peripherals responsive. A 3.3V single-supply operation simplifies power tree design from a single Li-ion cell through a buck regulator. The 128KB Flash eliminates external program memory, and the integrated op-amps and comparators remove external analog front-end parts, reducing board area on the compact 9x9 mm QFN footprint. Firmware should exploit doze ratios to trade MIPS for runtime in sensing intervals, reserving full 70 MIPS speed for control bursts such as motor commutation.
Recommandé
Test, Measurement and Instrumentation
Bench instruments, data-acquisition front ends, and sensor-conditioning modules use the DSPIC33EP128MC506T-I/MR because its DSP core implements digital filtering (FIR/IIR) directly on sampled data at 70 MIPS, while on-chip op-amps condition sensor signals without extra ICs. The 16KB RAM supports moderate buffering of sample streams, and PPS routing gives designers freedom to place UART and SPI interfaces on optimal VQFN pins for the board stack. The exposed-pad QFN-64 provides a low-inductance ground that benefits analog noise performance. Design consideration: use a clean reference and adequate decoupling at VDD/VSS pairs to preserve ADC and comparator accuracy in measurement roles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP128MC506T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP128MC506T-E/MR | DSPIC33EP256MC506T-E/MR | DSPIC33EP64MC506T-I/MR | DSPIC33EP128MC506T-I/PT |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-TQFP (10x10 mm) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPs | 70 MIPs (derated at high temp per E-grade limits) | 70 MIPs (derated at high temp per E-grade limits) | 70 MIPs | 70 MIPs |
| Flash Program Memory | 128 KB (43K x 24) | 128 KB | 256 KB | 64 KB | 128 KB |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Operating Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Key Peripherals | MCPWM, Op-Amps, Comparators, CAN, PTG | MCPWM, Op-Amps, Comparators, CAN, PTG | MCPWM, Op-Amps, Comparators, CAN, PTG | MCPWM, Op-Amps, Comparators, CAN, PTG | MCPWM, Op-Amps, Comparators, CAN, PTG |
| Automotive Qualification | No (industrial grade) | E-grade; per Microchip USA, AEC-Q100 qualified variant family | E-grade family | No | No |
| Pin Compatibility | 64-pin QFN-EP baseline | Pin-to-pin same | Pin-to-pin same | Pin-to-pin same | Not pin-compatible (TQFP) |
Principaux différenciateurs
- Integrated analog front end reduces BOM (vs DSPIC33EP64MC506T-I/MR)
- Industrial temperature at lowest cost in compatible set (vs DSPIC33EP128MC506T-E/MR)
- 128KB Flash with upgrade headroom via pin-compatible 256KB sibling (vs DSPIC33EP256MC506T-E/MR)
Notes de conception
Budget the 3.3V regulator for the dsPIC33EP core current at 70 MIPS plus I/O load; allow margin for flash write peaks. Estimated: at full-speed operation, core plus peripheral current is typically in the tens-of-milliamps range (exact figure per datasheet DC Characteristics tables - verify against the current datasheet revision). Use a local low-ESR 10uF ceramic plus 0.1uF at each VDD/VSS pair. If an external buck supplies the 3.3V rail, add a ferrite bead between the switching rail and VDD pins to attenuate switching ripple that would otherwise degrade ADC accuracy.
The 64-VQFN 9x9 mm exposed pad is a major ground connection, not just thermal relief. Solder the exposed pad to a ground pour with an array of 4x4 or 5x5 vias to the internal ground plane. Route the MCPWM outputs to gate drivers on short, matched traces and keep current-sense routing (to on-chip op-amp inputs) as a Kelvin connection directly at the shunt resistor. Separate analog ground for VREF routing per Microchip's family reference manual layout guidelines.
Three common pitfalls with dsPIC33EP designs: (1) forgetting the MCLR pull-up (10k to VDD) and programming header connections for PGD1/PGC1 (RB5/RB6 on this package) - without them in-circuit programming fails; (2) leaving Peripheral Pin Select (PPS) unconfigured - most digital peripherals on RPxx pins require explicit RPINR/RPOR register mapping at reset; (3) assuming full 70 MIPS operation at maximum E-grade temperatures - check the speed-vs-temperature derating curves in the datasheet before finalizing clock configuration.
Estimated: for motor-control loads driving many I/O pins at 3.3V, the QFN-64 dissipation is typically well under 0.5W, but the E-grade alternative running at elevated ambient should be checked against theta-JA for the 9x9 mm VQFN with a solid ground-plane-connected exposed pad. With a proper exposed-pad connection, junction temperature margin at 85C ambient is normally comfortable for industrial (I-grade) designs; verify the exact theta-JA value in the current Microchip datasheet revision.
Informations de conformité
RoHS compliant per DigiKey/Mouser distributor listings for dsPIC33EP series. I-grade (industrial) device; AEC-Q100 qualification applies to E-grade/automotive variants per Microchip USA product information.
