DSPIC33EP512MC504T-E/ML - 60 MIPS 16-bit DSC 512KB Flash | Microchip
Référence : DSPIC33EP512MC504T-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.9 | $590,00 |
| 500 | $5.4 | $2 700,00 |
| 1 000 | $4.95 | $4 950,00 |
DSPIC33EP512MC504T-E/ML Présentation
A digital signal controller combines the compute architecture of a microcontroller with the math acceleration of a DSP. In the power-management hierarchy, a DSC sits above general-purpose MCUs for control-loop-intensive tasks: it executes single-cycle MAC and DSP instructions, making it the standard choice for precision motor control, digital power conversion, and sensor-fusion embedded systems where deterministic interrupt latency and fast control loops are required.
Key features of the DSPIC33EP512MC504 include a 16-bit dsPIC DSC core with DSP engine and barrel shifter, multiple motor-control PWM (MCPWM) modules with complementary outputs and dead-time control, quadrature encoder interface (QEI) inputs, integrated operational amplifiers and comparators, CAN 2.0B, I2C, SPI, and UART/USART serial interfaces, plus DMA channels and a peripheral trigger generator (PTG) for offloading tasks from the CPU core. Operation is from a single 3.3V supply (3.0V to 3.6V range).
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with 24-bit instruction words, allowing simultaneous instruction fetch and data access. The integrated DSP engine supports single-cycle MAC operations with dual data fetches, enabling FOC (field-oriented control) motor algorithms at high loop rates. Flash self-programming supports field firmware updates, and boundary-scan support aids board-level test.
Typical applications include brushless DC and PMSM motor drives for industrial automation, automotive electric pumps and actuators, digital LED lighting and power supplies (power factor correction and LLC control), and sensor-based embedded control in harsh -40C to +125C environments.
Design consideration: supply the exposed thermal pad with a solid ground connection for signal integrity and thermal relief, and budget a 2-layer-decent PCB layout that keeps the MCPWM outputs away from the crystal and analog op-amp inputs; the 3.0V-to-3.6V supply window means 5V-only systems need a regulator and level translation on 5V-tolerant-critical signals.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone, with data verified as of 2026-09-25.
Alternatives de remplacement direct pour DSPIC33EP512MC504T-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512MC504T-E/ML (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, DMA Channels, Packaging.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512MC504T-I/ML
✅ Remplacement direct✓ En stock
$4.65 / unité
Voir la fiche technique →DSPIC33EP512MC504-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC504T-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.32 / unité
Voir la fiche technique →DSPIC33EP128MC504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP32MC504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.65 / unité
Voir la fiche technique →DSPIC33EP512MC504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP512MC504T-E/ML Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC DSC |
| Maximum Clock / Performance | 60 MIPS |
| Program Memory (FLASH) | 512 KB (170K x 24) |
| Data RAM | 48 KB |
| Tension d'alimentation | 3.0 V to 3.6 V (3.3 V nominal) |
| Boîtier | 44-QFN (8x8 mm), exposed pad |
| Température de fonctionnement | -40C to +125C (E grade) |
| Qualification | AEC-Q100 automotive |
| Interfaces | CAN 2.0B, I2C, SPI, UART/USART, IrDA |
| Motor Control Peripherals | MCPWM modules, QEI, comparators, op-amps |
| DMA Channels | 4 channels |
| Programmable I/Os | 35 I/O |
| Core Architecture | Modified Harvard, 24-bit instruction word, barrel shifter, boundary scan |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Statut RoHS | Compliant |
| Series | dsPIC 33EP (dsPIC33EP512MC504) |
Guide de configuration des broches du DSPIC33EP512MC504T-E/ML 44-qfn (8x8 mm), exposed pad
Configuration des broches du DSPIC33EP512MC504T-E/ML (boîtier 44-qfn (8x8 mm), exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP512MC504T-E/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP512MC504T-E/ML convient pour 6 applications: Brushless DC / PMSM Motor Control, Automotive Actuators and Electric Pumps, Digital Power Conversion (PFC and LLC), Industrial Automation and Robotics, Embedded Sensor Systems and IoT Nodes, Power Tools and Appliance Motor Drives.
Brushless DC / PMSM Motor Control
The DSPIC33EP512MC504T-E/ML is purpose-built for field-oriented control (FOC) of BLDC and PMSM motors: its 60 MIPS 16-bit DSP core executes single-cycle MAC instructions, sustaining current-loop rates well above 20 kHz, while the dedicated MCPWM modules generate complementary PWM pairs with hardware dead-time insertion. The integrated quadrature encoder interface (QEI) reads position feedback without CPU overhead, and on-chip op-amps and comparators condition current-shunt signals, reducing external component count. In a typical FOC drive, the DSC closes the current loop from ADC sampling to PWM duty update in a single interrupt service routine, and the 512KB FLASH leaves ample room for field-weakening, thermal derating, and communication stacks. The AEC-Q100 -40C to +125C rating permits underhood and pump-mounted placements.
Recommandé
Automotive Actuators and Electric Pumps
Automotive electric water pumps, fuel pumps, and HVAC actuators demand AEC-Q100 qualified controllers rated across the full -40C to +125C ambient range, exactly matching the E-grade DSPIC33EP512MC504T-E/ML. Its CAN 2.0B module interfaces directly to in-vehicle networks through a transceiver, while the MCPWM blocks drive the motor stage with fault-protection inputs for over-current trip in hardware, meeting functional-safety response-time goals. The 3.0V to 3.6V supply range tolerates automotive 5V rail regulation with margin, and 35 I/O lines accommodate position sensors, limit switches, and LIN/UART diagnostic links. With 512KB FLASH, a single firmware image can support multiple actuator variants, simplifying end-of-line calibration and field updates through flash self-programming.
Recommandé
Digital Power Conversion (PFC and LLC)
The DSPIC33EP512MC504T-E/ML implements digital power-factor-correction and LLC resonant converter control loops at switching frequencies of 100 kHz and beyond. Its 60 MIPS core plus DSP engine computes the control law within a single PWM period, and the MCPWM modules support complementary outputs, programmable dead time, and ADC-trigger synchronization for precise phase-current sampling at the PWM midpoint, minimizing switching-noise-induced measurement error. Integrated comparators provide hardware cycle-by-cycle over-current limiting with microsecond response, independent of firmware latency. The 4-channel DMA offloads ADC result transfer so the CPU loop remains deterministic, and 512KB FLASH accommodates multiple power-stage profiles (e.g., 110 V and 230 V input variants) in one bill of materials.
Recommandé
Industrial Automation and Robotics
In factory automation, the DSPIC33EP512MC504T-E/ML serves as a compact motion controller and intelligent sensor hub. The QEI module decodes incremental encoder feedback for servo positioning, SPI and I2C connect industrial sensors and EEPROM configuration memory, and UART/IrDA links to HMIs or Modbus gateways. The 4-channel DMA and peripheral trigger generator (PTG) automate repetitive sensor-sequencing tasks with minimal CPU intervention, freeing the 60 MIPS core for the control algorithm. With -40C to +85C industrial floor compliance across the family and the E-grade variant extending to +125C for hot enclosures, one PCB design can span multiple environment tiers by swapping only the temperature suffix, protecting layout investment across product variants.
Recommandé
Embedded Sensor Systems and IoT Nodes
The DSPIC33EP512MC504T-E/ML fits high-rate sensing nodes where a general MCU would miss events: the DSP engine performs single-cycle MAC filtering on ADC streams (e.g., vibration or acoustic analysis), while DMA moves samples to the 48KB RAM without CPU stalls. SPI and I2C interfaces connect MEMS sensors, and the PTG sequences conversions autonomously for power-sipping duty-cycled operation. Connectivity options include UART to a wireless module and CAN for industrial IoT backbones. The 512KB FLASH supports on-device signal-processing libraries plus an in-field bootloader, enabling algorithm updates over the network. Its QFN 8x8 mm footprint and 3.3V single-supply operation keep node PCB area and power budget compact for distributed sensing installations.
Recommandé
Power Tools and Appliance Motor Drives
Cordless power tools and premium appliances require compact, high-torque motor drives that survive mechanical shock and elevated enclosure temperatures. The DSPIC33EP512MC504T-E/ML integrates everything a single-shunt sensorless BLDC drive needs: on-chip op-amps amplify the shunt signal, comparators provide hardware over-current trips, and the MCPWM modules produce trapezoidal or FOC commutation with dead time - all in one 8x8 mm QFN that saves BOM cost versus discrete analog control. The 60 MIPS core executes sensorless observers (sliding-mode or back-EMF estimators) in real time, and the +125C E-grade rating tolerates thermally stressed motor-adjacent placement. Flash self-programming allows factory tuning tables and firmware variants to be merged on a single controller SKU.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512MC504T-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512MC504T-I/ML | DSPIC33EP512MC504-E/ML | DSPIC33EP256MC504T-I/TL | DSPIC33EP128MC504-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same footprint | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (FLASH) | 512 KB (170K x 24) | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 48 KB | 48 KB | 48 KB | 48 KB | 16 KB |
| Performance | 60 MIPS (16-bit dsPIC core) | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Range | -40C to +125C (E, AEC-Q100) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
| Motor Control Peripherals | MCPWM, QEI, op-amps, comparators | MCPWM, QEI - identical | MCPWM, QEI - identical | MCPWM, QEI - identical | MCPWM, QEI - identical |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principaux différenciateurs
- Automotive E-grade temperature rating (vs DSPIC33EP512MC504T-I/ML)
- Maximum family FLASH density (vs DSPIC33EP256MC504T-I/TL)
- Integrated motor-control analog (vs DSPIC33EP512GP504)
Notes de conception
The 44-QFN exposed pad on the DSPIC33EP512MC504T-E/ML must be soldered to a ground plane array of vias; it is the primary ground return and thermal path. For hand-assembly prototypes, ensure the pad reflows properly - a floating exposed pad causes intermittent ground and noisy ADC readings on the integrated op-amps. Place 0.1uF decoupling capacitors within 2 mm of each VDD pin pair and one 4.7uF-10uF bulk capacitor near the package.
The device operates from 3.0V to 3.6V only - it is not 5V tolerant on all pins in the same way 5V PIC families are. Power it from a low-noise 3.3V LDO, and level-shift any 5V sensor or CAN/network signals that require it. Keep the analog supply clean by filtering AVDD with an RC or ferrite bead from the digital rail, since the integrated op-amps and ADC accuracy depend directly on AVDD ripple.
When migrating firmware between memory-density family members (512KB/256KB/128KB/32KB MC504 variants), linker scripts and flash page erase routines must be updated - flash row and page sizes differ across the dsPIC33EP family. Also note conflicting distributor RAM figures (24KB vs 48KB): verify against the current Microchip datasheet before sizing buffers. Enable hardware dead-time in MCPWM during early bring-up to avoid motor-stage shoot-through during firmware development.
Informations de conformité
Distributor listings (DigiKey, Hotenda) classify the part as Automotive, AEC-Q100 qualified and RoHS compliant. REACH and halogen-free status not stated in provided data.