DSPIC33EP64GP502-E/SS - 16-bit DSC 60 MIPS 64KB Flash | Microchip
Référence : DSPIC33EP64GP502-E/SS ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.28 | $4,28 |
| 10 | $3.85 | $38,50 |
| 100 | $3.42 | $342,00 |
| 500 | $3.06 | $1 530,00 |
| 1 000 | $2.74 | $2 740,00 |
DSPIC33EP64GP502-E/SS Présentation
A digital signal controller combines the deterministic control of a microcontroller with the math throughput of a DSP. Within the power-management hierarchy of embedded systems, the DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33EP family a common choice where control loops and signal processing coexist in one chip.
Key features include the dsPIC33E 16-bit core with DSP engine (barrel shifter, 40-bit accumulators, single-cycle MAC), high-speed PWM outputs suited to power conversion and motor control, on-chip op-amp and advanced analog peripherals, and multiple serial interfaces. The extended E temperature grade supports industrial environments where standard 0C to +70C parts cannot be trusted.
Architecturally, the device pairs a pipelined 16-bit RISC CPU with a DSP accelerator and 24-bit instruction word Flash, achieving the 60 MIPS rating from an internal PLL-fed clock. Programming and debugging are handled through Microchip MPLAB X IDE with the MPLAB Snap or PICkit in-circuit debuggers, as documented on the Microchip product page.
Typical applications include digital power supplies (PLL, PFC), brushless DC and permanent-magnet motor control, sensor signal conditioning, and general embedded control that benefits from DSP math. The 28-SSOP footprint suits compact, cost-sensitive industrial boards.
For design, decouple all VDD pins with 0.1 uF ceramics, provide the dedicated VCAP connection per the manufacturer datasheet, and budget Flash/RAM headroom since 64 KB/8 KB is fixed on this fixed-memory part.
This page synthesizes distributor availability data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP64GP502-E/SS — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GP502-E/SS (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, Supply Voltage, RAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP64GP502-I/SS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP64GP502T-E/SS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP32GP502-E/SS
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.45 / unité
Voir la fiche technique →DSPIC33EP64GP504-I/SS
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GP502-E/SS Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33E DSC |
| Maximum CPU Speed | 60 MIPS |
| Program Memory | 64 KB (22K x 24) Flash |
| SRAM | 8 KB |
| Tension d'alimentation | 3 V to 3.6 V |
| Boîtier | 28-SSOP |
| Package Body Size | Approx. 10.2 mm x 5.3 mm (SSOP-28) |
| Terminal Pitch | 0.65 mm |
| Température de fonctionnement | -40C to +125C (E grade) |
| Type de montage | Surface Mount |
| Statut du cycle de vie | Active (In Production) |
| Peripherals | High-Speed PWM, Op Amps, Advanced Analog |
| Largeur du bus de données | 16 bit |
| Programming/Debug Interface | ICSP via MPLAB Snap / PICkit (MPLAB X IDE) |
Guide de configuration des broches du DSPIC33EP64GP502-E/SS approx. 10.2 mm x 5.3 mm (ssop-28)
Configuration des broches du DSPIC33EP64GP502-E/SS (boîtier approx. 10.2 mm x 5.3 mm (ssop-28)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP64GP502-E/SS.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP64GP502-E/SS convient pour 6 applications: Digital Power Supplies, Brushless DC Motor Control, Sensor Signal Conditioning, Industrial Embedded Control, Portable and Battery-Powered Instruments, Audio and Signal Processing Nodes.
Digital Power Supplies
The DSPIC33EP64GP502-E/SS fits digitally controlled AC/DC and DC/DC converters because its high-speed PWM module provides the resolution and dead-time control needed for topologies such as LLC, buck, and PFC stages, while the 60 MIPS DSP core closes voltage and current loops with single-cycle MAC operations. In a typical implementation the ADC samples output voltage and inductor current each switching cycle, and the control law (PI or 3P3Z) is executed in the ISR, with PWM duty updated before the next cycle. Running the control loop at the switching frequency with the 16-bit core keeps loop latency deterministic. The extended -40C to +125C E grade supports power stages in industrial cabinets. Trade-off: at 3.3V logic the PWM gate-drive interface usually needs a driver IC between the DSC and power MOSFETs.
Recommandé
Brushless DC Motor Control
For BLDC and PMSM drives, the DSPIC33EP64GP502-E/SS provides complementary PWM outputs with programmable dead time, and its DSP engine executes field-oriented control arithmetic efficiently at 60 MIPS. Sensor inputs from Hall elements or an encoder interface through the input-capture and analog pins, while overcurrent protection can trip the PWM module in hardware for fast fault response. The 64 KB Flash holds FOC, commutation, and communication stacks concurrently; the 8 KB SRAM requires careful buffer sizing but is adequate for single-motor control. The -40C to +125C rating suits motor-mounted electronics exposed to heat soak. Designers should route PWM traces away from analog sense lines and use the hardware fault input rather than software protection. The related MC-family variant offers a motor-control-optimized peripheral mapping when starting a new design.
Recommandé
Sensor Signal Conditioning
The on-chip op amps and advanced analog peripherals let the DSPIC33EP64GP502-E/SS amplify and filter low-level sensor signals - such as thermocouples, pressure bridges, and current shunts - before internal ADC conversion, reducing external component count. The 60 MIPS DSP core then applies digital filtering, calibration, and linearization routines in firmware, which is especially useful for nonlinear sensors like NTC thermistors and RTDs. Results can be transmitted over UART, SPI, or I2C to a host controller. The 28-SSOP package suits dense multi-channel sensor boards, and the -40C to +125C grade covers outdoor and industrial sensing points. Consider dedicating the op amps to gain stages and performing offset correction in firmware at startup. Budget SRAM carefully since filtering windows and DMA buffers share the 8 KB data space.
Recommandé
Industrial Embedded Control
As a general-purpose controller, the DSPIC33EP64GP502-E/SS handles relays, valves, indicators, and serial communication in factory equipment, HVAC boards, and building automation nodes. Sixty MIPS of throughput leaves headroom for a communication stack plus control logic, while the extended -40C to +125C temperature rating removes concerns about enclosure heat rise that would disqualify commercial-grade MCUs. The 64 KB (22K x 24) Flash accommodates protocol stacks and field-upgradeable application code; the 22K instruction-word structure means counting must be done in 24-bit words rather than bytes. ICSP programming through MPLAB Snap supports in-field firmware updates via a header. For EMI-prone environments, enable the internal filtering on communication pins and keep the crystal traces short and guarded.
Recommandé
Portable and Battery-Powered Instruments
Handheld measurement tools and battery instruments benefit from the DSPIC33EP64GP502-E/SS combination of DSP throughput for signal analysis and low-power modes for battery life management. The 3.0V to 3.6V supply directly matches a single lithium-ion cell through a small LDO, and sleep/idle modes allow the 60 MIPS core to be parked between measurements, waking on interrupt from a button, timer, or sensor threshold. The 28-SSOP footprint (about 10.2 mm x 5.3 mm) fits compact PCBs, and surface-mount assembly keeps unit cost low. In a typical design, the ADC samples a transducer in bursts, the DSP core processes FFT or RMS calculations, and results are shown on a segment LCD or sent over UART. Trade-off: the 3.3V-only supply range rules out direct two-cell alkaline operation without a boost converter.
Recommandé
Audio and Signal Processing Nodes
The dsPIC33E DSP engine - single-cycle MAC, 40-bit accumulators, dual fetch, and bit-reversed addressing - makes the DSPIC33EP64GP502-E/SS capable of moderate-rate audio processing tasks such as active filtering, compression limiting, tone generation, and acoustic feedback suppression in industrial communication devices and intercoms. With 60 MIPS available, sample rates in the tens of kHz with several cascaded biquad filters per channel are practical, and the serial interfaces connect to standard audio codecs and DACs over I2S-compatible serial protocols where supported. The extended temperature grade suits automotive-adjacent and outdoor communication hardware. Keep in mind the 8 KB SRAM constrains long delay lines and large filter buffers; allocate the DSP scratch area deliberately and avoid heavy C library calls inside the audio ISR to preserve deterministic timing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GP502-E/SS — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP64GP502-I/SS | DSPIC33EP64GP502T-E/SS | DSPIC33EP32GP502-E/SS | DSPIC33EP64GP504-I/SS |
|---|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | 16-bit dsPIC33E, 60 MIPS | 16-bit, 60 MIPS | 16-bit, 60 MIPS | 16-bit, 60 MIPS | 16-bit, 60 MIPS |
| Flash Program Memory | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 32 KB (11K x 24) | 64 KB+ (larger, verify datasheet) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
Principaux différenciateurs
- Extended temperature range in the same footprint (vs DSPIC33EP64GP502-I/SS)
- Production-ready automated assembly format (vs DSPIC33EP64GP502T-E/SS)
- Full 64 KB Flash at extended temperature (vs DSPIC33EP32GP502-E/SS)
- Trade-off: memory ceiling (vs DSPIC33EP64GP504-I/SS)
Notes de conception
Supply the DSPIC33EP64GP502-E/SS from a clean 3.3V regulator (3.0V-3.6V range). Place a 0.1 uF ceramic capacitor at each VDD pin and at least one bulk capacitor (4.7 uF-10 uF) near the device. The dsPIC33E core requires the dedicated VCAP connection per the manufacturer datasheet - do not load this pin; use only the recommended capacitor value and low-ESR ceramic type. Brown-out behavior should be handled with the internal BOR feature enabled in configuration bits to avoid Flash corruption during supply droop.
Use a solid ground plane and keep the ICSP programming header (MCLR, PGD, PGC, VDD, VSS) routed as short as possible so MPLAB Snap/PICkit debugging remains reliable. Keep the oscillator traces short and guard them with ground. Separate analog and digital return paths where the advanced analog peripherals are used, connecting them at a single point. For the 28-SSOP 0.65 mm pitch, design land patterns per the Microchip package outline drawing rather than generic SSOP-28 footprints to avoid solder bridging in reflow.
The '22K x 24' Flash notation means 22K instruction words of 24 bits, not 22K bytes - size your application against word counts. Configuration-bit settings are stored in Flash and affect oscillators, watchdog, and code protection; verify them after every device swap between the -E and -I grades or family variants. When substituting the GP504 or MC502, peripheral register maps differ - recompile against the correct device support files and re-validate PWM and ADC mapping before production.
For high-speed PWM outputs driving power stages, add small series resistors (10-33 ohm) at the pin to damp ringing, and route PWM away from analog sense lines to prevent switching noise coupling into ADC readings. If using the on-chip op amps, keep feedback loops compact and reference them to a quiet analog ground; sample with the ADC synchronized away from PWM switching edges to minimize kickback noise in your control loop.
Informations de conformité
Retrieved web data does not explicitly state RoHS/REACH/lead-free status. Current Microchip production parts in this family are typically RoHS-compliant, but obtain the official certificate of conformance from Microchip before use in regulated programs.
