DSPIC33EP64GS505T-I/PT - 70 MIPS 16-bit DSC | Microchip
Référence : DSPIC33EP64GS505T-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.35 | $63,50 |
| 100 | $5.75 | $575,00 |
| 500 | $5.25 | $2 625,00 |
| 1 000 | $4.85 | $4 850,00 |
DSPIC33EP64GS505T-I/PT Présentation
A digital signal controller is a hybrid of a microcontroller (MCU) and a digital signal processor (DSP): it combines the deterministic control, peripherals, and ease of use of an MCU with the high-speed multiply-accumulate (MAC) math capability of a DSP. Within the power-management hierarchy, the DSC sits at the heart of closed-loop control systems, executing the compensation loops that position analog controllers. The dsPIC33EP family belongs to the broader embedded processor taxonomy of 16-bit MCUs -> digital signal controllers -> digital power conversion ICs.
Key differentiating features include the 70 MIPS dsPIC33EP core with DSP instruction support, high-resolution PWM peripherals for switching power stage control, multiple high-speed 12-bit ADC channels for voltage and current sensing, and a dual-partition Flash architecture that allows the 64KB program memory to be split into two bootable partitions for fail-safe field firmware updates.
Architecturally, the dsPIC33EPXXGS50X family supports common multi-loop digital SMPS topologies such as AC-DC power supplies, DC-DC converters, power factor correction (PFC) stages, and battery chargers. The exposed-pad TQFP package provides low thermal resistance to the PCB, helping dissipate heat from continuous 70 MIPS operation. In-circuit debugging and In-Circuit Serial Programming (ICSP) are supported via MPLAB SNAP or ICD tools using two device I/O pins plus the reset line.
Typical applications include digital AC-DC and DC-DC power supplies, server and telecom power, LED drivers, solar micro-inverters, battery chargers, and adaptive lighting systems where fast ADC sampling and deterministic PWM control loops are mandatory.
Design consideration: keep the 3.3V supply well decoupled and connect the exposed thermal pad to a ground pour for both thermal dissipation and signal integrity of the high-speed PWM outputs.
This page synthesizes distributor pricing, drop-in alternatives, pinout data, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP64GS505T-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GS505T-I/PT (même facteur de forme et même empreinte) — différant par Package, Core, Operating Temperature, Packaging, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP64GS505T-E/PT
✅ Remplacement direct✓ En stock
$3.38 / unité
Voir la fiche technique →DSPIC33EP64GS505-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS505-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.45 / unité
Voir la fiche technique →DSPIC33EP64GS506T-I/PT
✅ Remplacement direct✓ En stock
$9.8 / unité
Voir la fiche technique →DSPIC33EP128GS505T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS505T-I/PT Valeurs maximales et caractéristiques électriques
| Core Processor | dsPIC33EP 16-bit DSC |
| Maximum Clock Speed | 70 MIPS |
| Program Memory Size | 64KB (64K x 8) Flash |
| Tension d'alimentation | 3.3 V |
| Boîtier | 48-TQFP-EP (7x7 mm) |
| Largeur du bus de données | 16 bit |
| Type de montage | Surface Mount |
| Series | dsPIC33EP (Functional Safety FuSa capable) |
| Target Application Class | SMPS and Digital Power Conversion |
| Program Memory Type | Flash (dual-partition capable) |
| Operating Temperature - I Grade | -40C to +85C (I grade per MPN suffix) |
| Debug/Programming Interface | ICSP / In-Circuit Debug (2-wire + MCLR) |
| Packaging | Tape & Reel (T suffix) |
Configuration des broches de DSPIC33EP64GS505T-I/PT
| Broche 1 | MCLR — Master clear reset / programming voltage input |
| Broche 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference |
| Broche 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference |
| Broche 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select |
| Broche 5 | AN3/INDX/CN5/RB3 — Analog input 3 / quadrature encoder index |
| Broche 6 | AN4/QEA/IC7/CN6/RB4 — Analog input 4 / encoder A / capture 7 |
| Broche 7 | AN5/QEB/IC8/CN7/RB5 — Analog input 5 / encoder B / capture 8 |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1/CLKI/CN30/RA2 — Oscillator crystal input / external clock |
| Broche 10 | OSC2/CLKO/CN31/RA3/PWM1H1 — Oscillator crystal output / clock output |
| Broche 11 | SOSCI/CN1/RB6 — Secondary oscillator input / change notification |
| Broche 12 | SOSCO/T1CK/CN0/RB7 — Secondary oscillator output / Timer1 clock |
| Broche 13 | VDD — Positive supply (3.3V) |
| Broche 14 | PWM1L1/RE0 — PWM1 low-side output 1 |
| Broche 15 | PWM1H1/RE1 — PWM1 high-side output 1 |
| Broche 16 | PWM1L2/RE2 — PWM1 low-side output 2 |
| Broche 17 | PWM1H2/RE3 — PWM1 high-side output 2 |
| Broche 18 | PWM1L3/RE4 — PWM1 low-side output 3 |
| Broche 19 | PWM1H3/RE5 — PWM1 high-side output 3 |
| Broche 20 | PWM1L4/RE6 — PWM1 low-side output 4 |
| Broche 21 | PWM1H4/RE7 — PWM1 high-side output 4 |
| Broche 22 | VSS — Ground reference |
| Broche 23 | RF2/SDI1/UARX1 — SPI data in / UART receive |
| Broche 24 | RF3/SDO1/UATX1 — SPI data out / UART transmit |
| Broche 25 | VDD — Positive supply (3.3V) |
| Broche 26 | RF6/SCK1 — SPI clock output |
| Broche 27 | RF7/SS1 — SPI slave select |
| Broche 28 | RC1/T2CK/IC1 — Timer2 clock / input capture 1 |
| Broche 29 | RC2/OC1 — Output compare 1 |
| Broche 30 | RC3/OC2 — Output compare 2 |
| Broche 31 | RC4/OC3 — Output compare 3 |
| Broche 32 | AN6/RB8 — Analog input 6 |
| Broche 33 | AN7/RB9 — Analog input 7 |
| Broche 34 | VSS — Ground reference |
| Broche 35 | AN8/RB10 — Analog input 8 |
| Broche 36 | AN9/RB11 — Analog input 9 |
| Broche 37 | AN10/RB12 — Analog input 10 |
| Broche 38 | AN11/RB13 — Analog input 11 |
| Broche 39 | AN12/RB14 — Analog input 12 |
| Broche 40 | AN13/RB15 — Analog input 13 |
| Broche 41 | AVSS — Analog ground |
| Broche 42 | AVDD — Analog supply (3.3V) |
| Broche 43 | RG2/SDA2 — I2C data 2 |
| Broche 44 | RG3/SCL2 — I2C clock 2 |
| Broche 45 | RG0/PGD — Programming data (ICSP) |
| Broche 46 | RG1/PGC — Programming clock (ICSP) |
| Broche 47 | RD11/INT0 — External interrupt 0 |
| Broche 48 | VSS/EP — Ground / exposed thermal pad |
Applications typiques
DSPIC33EP64GS505T-I/PT convient pour 6 applications: Digital AC-DC Power Supplies, DC-DC Converters and Point-of-Load Regulation, Power Factor Correction (PFC) Stages, Digital LED Drivers and Adaptive Lighting, Battery Chargers and BMS Front Ends, Solar Micro-Inverters and Renewable Energy Conversion.
Digital AC-DC Power Supplies
The DSPIC33EP64GS505T-I/PT is explicitly designed by Microchip for multi-loop digital AC-DC power supplies. Its 70 MIPS DSP core executes voltage and current compensation loops with single-cycle MAC instructions, while the high-speed ADC samples the output rail and input current fast enough to keep the loop stable across line and load transients. In a typical topology the DSC drives the primary-side PWM stage and a PFC front end simultaneously, replacing multiple analog control chips with one programmable controller. The benefit is adaptive control: firmware can retune loop gains for different output voltages, enabling one hardware platform to serve multiple power ratings. Place the exposed pad on a solid ground pour to keep PWM switching noise out of the ADC front end.
Recommandé
DC-DC Converters and Point-of-Load Regulation
For DC-DC conversion, the DSPIC33EP64GS505T-I/PT combines the deterministic 70 MIPS core with dedicated PWM peripherals to implement buck, boost, buck-boost, and LLC control laws in firmware. The high-speed 12-bit ADC can sample inductor current and output voltage every switching cycle, allowing peak or average current-mode control with cycle-by-cycle current limiting implemented in the DSP loop rather than in analog comparators. The dual-partition Flash architecture supports fail-safe field firmware updates, valuable in telecom rectifiers that must not be powered down for upgrades. Compared to fixed analog controllers, this DSC enables phase management, soft-start shaping, and fault logging, at the cost of firmware development effort and attention to ADC sampling latency in the loop budget.
Recommandé
Power Factor Correction (PFC) Stages
Power factor correction demands precise, fast control of input current shaping, which makes the DSPIC33EP64GS505T-I/PT a natural fit. Running at 70 MIPS, the core computes the PFC control law each switching cycle, using the high-speed ADC to sample the rectified input waveform and inductor current, and the PWM module to drive the boost switch with correct duty cycle. Microchip identifies multi-loop SMPS control, of which PFC is the canonical example, as the core mission of the dsPIC33EPXXGS50X family. Firmware flexibility allows seamless transition between CCM and DCM operation and supports digital harmonic compensation that analog solutions approximate poorly. The industrial -40C to +85C grade suits telecom and server PSU environments where PFC stages run hot and continuously.
Recommandé
Digital LED Drivers and Adaptive Lighting
Advanced LED lighting systems, including stage, architectural, and horticultural lighting, use the DSPIC33EP64GS505T-I/PT to implement digitally controlled constant-current buck or boost LED drivers. The 70 MIPS core supports dimming algorithms well beyond simple PWM chopping - including dithering, color mixing, and thermal fold-back based on ADC temperature readings. The high-resolution PWM output yields smooth low-current dimming without visible flicker, a common complaint with analog LED drivers. Firmware-based control also lets one design span multiple luminaire types by changing only configuration. The 3.3V I/O simplifies interfacing with digital dimming protocols, and the industrial temperature grade covers outdoor driver enclosures. Watch switching-node layout carefully: keep the high di/dt PWM loop small to protect ADC accuracy during dimming transitions.
Recommandé
Battery Chargers and BMS Front Ends
Multi-chemistry battery chargers benefit from the DSPIC33EP64GS505T-I/PT's combination of DSP computation and precision analog control. The 70 MIPS core implements CC/CV charging profiles, taper detection, and termination algorithms in firmware, while the high-speed ADC monitors pack voltage and charge current each cycle for safe operation. Because the charging law lives in software, one hardware design supports Li-ion, lead-acid, and NiMH chemistries, cutting SKU proliferation. The dual-partition Flash enables field updates when new battery profiles or safety rules are required - a regulatory advantage in e-mobility chargers. Microchip lists battery charging among the supported digital power-conversion applications of this family. Ensure the -40C to +85C I-grade envelope matches the charger installation environment, and use the E-grade variant for engine-bay or outdoor enclosures.
Recommandé
Solar Micro-Inverters and Renewable Energy Conversion
Solar micro-inverters require simultaneous MPPT (maximum power point tracking), grid-synchronized current injection, and safety compliance - workloads that map directly onto the DSPIC33EP64GS505T-I/PT. The 70 MIPS DSP core runs the MPPT algorithm and grid current loop, while the high-speed ADC samples panel voltage/current and grid waveforms, and PWM outputs drive the power stages with the timing precision needed for low-THD output. Microchip's positioning of the GS50X family for digital power conversion covers inverter-class topologies. Firmware definability allows adaptation to different grid codes without hardware change, which is critical for global product variants. The industrial temperature range suits rooftop-mounted electronics, though designers should verify junction temperature margins under full solar load with the 7x7 mm TQFP-EP thermal pad well soldered to the PCB ground plane.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GS505T-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP64GS505T-E/PT | DSPIC33EP64GS506T-I/PT | DSPIC33EP128GS505T-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-TQFP-EP (7x7 mm) | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP - same per FFF listing (verify) | 48-TQFP-EP (7x7 mm) - same |
| Core / Performance | dsPIC33EP 16-bit, 70 MIPS | 70 MIPS - identical | 70 MIPS | 70 MIPS - identical |
| Program Memory | 64KB Flash | 64KB Flash | 64KB Flash | 128KB Flash (+100%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Application Focus | SMPS / digital power conversion | SMPS / digital power (high temp) | SMPS / digital power conversion | SMPS / digital power (larger code) |
| Packaging | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
| Lifecycle Status | Active | Active | Active | Active |
Principaux différenciateurs
- Purpose-built digital power peripherals (vs DSPIC33EP64GP503T-I/TL)
- Extended temperature option on identical silicon (vs DSPIC33EP64GS505T-E/PT)
- Fail-safe dual-partition Flash boot (vs Single-partition MCU alternatives)
- Trade-off: 64KB program memory ceiling (vs DSPIC33EP128GS505T-I/PT)
Notes de conception
The 48-TQFP-EP package has an exposed pad on the underside that must be soldered to a PCB ground pour. This pad provides the primary thermal path for the device and also serves as a low-inductance ground return for the fast PWM switching edges. Use a thermal pad copper area with an array of thermal vias (typically 3x3 or 4x4, 0.3 mm drills) to tie into inner ground planes. Skipping the exposed-pad connection is one of the most common layout mistakes with TQFP-EP parts and results in elevated junction temperatures and degraded analog performance.
Decouple each VDD pin with 100 nF ceramic capacitors placed within 2-3 mm of the pin, plus one bulk 4.7-10 uF capacitor near the device. AVDD should be isolated from digital VDD through a ferrite bead with its own local decoupling to preserve ADC accuracy - critical in digital power designs where the ADC feeds the closed-loop compensation. Estimated: total power dissipation of the core at 70 MIPS is on the order of 150-300 mW depending on activity, which the 7x7 mm exposed-pad TQFP dissipates easily with a grounded pad, but verify against the datasheet electrical characteristics for your switching frequency and code profile.
Reserve the ICSP programming pins (PGD/PGC on RG0/RG1 and MCLR) with a 5-pin or 8-pin header in every production layout - Microchip's MPLAB SNAP and ICD tools use two I/O pins plus MCLR for in-circuit debugging and ICSP. Retrofitting programming access after PCB release usually requires bodge wires. Also, when using the dual-partition Flash for field updates, plan the partition map early: bootloading into the inactive partition requires the update firmware to know the swap mechanism, and changing partitioning after production is disruptive to deployed fleets.
In SMPS applications the PWM outputs drive gates through drivers with high di/dt edges. Route PWM traces away from the ADC analog inputs and the crystal circuit, and keep analog sense routing (kELVIN connections to shunt resistors) differential and short. The high-speed ADC in the GS50X family is the feedback element of your control loop, so noise injected into ANx pins appears directly as loop jitter. A ground island under the analog pin group (pins 32-43 area) referenced to AVSS improves sampling consistency.
Informations de conformité
Octopart comparison data lists the dsPIC33EP64GS505 family under Automotive, AEC-Q100, Functional Safety (FuSa) series descriptors for family members; the specific commercial DSPIC33EP64GS505T-I/PT ordering code should be confirmed against the Microchip product page compliance documents. RoHS/lead-free inferred from standard current-production Microchip lead-free assembly.