DSPIC33EP64GS808-E/PT - 16-bit DSC 70 MIPS 64KB Flash | Microchip
Référence : DSPIC33EP64GS808-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.62 | $7,62 |
| 10 | $6.95 | $69,50 |
| 100 | $6.4 | $640,00 |
| 500 | $6.1 | $3 050,00 |
| 1 000 | $5.85 | $5 850,00 |
DSPIC33EP64GS808-E/PT Présentation
A digital signal controller combines the compute power of a DSP core with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP, making it the standard choice for closed-loop control of switch-mode power supplies, motor drives, and digital power conversion where deterministic interrupt latency and fast multiply-accumulate operations are required.
Key features of this device include its 70 MIPS core performance, 64KB of self-programmable Flash with dual-partition support for live firmware updates, 8KB of on-chip RAM, a CAN 2.0B module for automotive and industrial networking, and four DMA channels that move peripheral data without CPU intervention. The dsPIC33EP64GS808 belongs to the GS (digital power) family, which integrates high-speed PWM and analog peripherals specifically optimized for switch-mode power supply control.
Architecturally, the dsPIC33EP series uses a modified Harvard bus structure with a 16-bit data path and DSP-style instructions including barrel shifting and single-cycle MAC. Clock operation reaches 60 MHz internal frequency, supporting real-time control loops at switching frequencies typical of PFC and LLC converters.
Typical applications include interleaved power factor correction (Microchip provides a 350W interleaved PFC reference design for this family), automotive body and powertrain modules (leveraging AEC-Q100 qualification and the -40C to +125C extended temperature grade of the E suffix), and industrial motor control with CAN networking.
Design consideration: the 3V to 3.6V supply range requires a regulated 3.3V rail; budget decoupling at all VDD/VDDCORE pins per the Microchip datasheet layout guidelines.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP64GS808-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GS808-E/PT (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, CAN Module, Core Architecture, Functional Safety Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP128GS808-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.9 / unité
Voir la fiche technique →DSPIC33EP256GS808-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP32GS808-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS808-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.78 / unité
Voir la fiche technique →DSPIC33EP64GS808-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS808-E/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC DSC |
| Maximum Performance | 70 MIPS |
| Internal Clock Frequency | 60 MHz |
| Flash Program Memory | 64 KB (64K x 8) |
| RAM | 8 KB |
| Flash Partitions | Dual partition |
| Supply Voltage Range | 3 V to 3.6 V |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 80-TQFP (12x12 mm) |
| CAN Module | Yes, CAN 2.0B |
| DMA Channels | 4 |
| Qualification | AEC-Q100 (Automotive) |
| Series | dsPIC33EP (GS digital power family) |
| Core Technology | CMOS |
| Type de montage | Surface Mount |
| Statut du cycle de vie | In Production (per Microchip) |
| Packaging Type | Tray |
Guide de configuration des broches du DSPIC33EP64GS808-E/PT 80-tqfp (12x12 mm)
Configuration des broches du DSPIC33EP64GS808-E/PT (boîtier 80-tqfp (12x12 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP64GS808-E/PT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP64GS808-E/PT convient pour 6 applications: Interleaved Power Factor Correction (PFC), Automotive Body and Lighting Control, Industrial Motor Control (BLDC/PMSM), Digital Solar Micro-Inverter and DC-DC Conversion, Industrial Networking and CAN Gateways, Uninterruptible Power Supplies (UPS) and Energy Storage.
Interleaved Power Factor Correction (PFC)
The DSPIC33EP64GS808-E/PT is a natural fit for interleaved PFC because Microchip explicitly targets the GS digital-power family at SMPS control and ships a 350W universal-input interleaved PFC reference design for it. The 70 MIPS core executes the average-current-mode control loop with headroom at high switching frequencies, while the dual-partition Flash supports firmware field updates on deployed units. In use, the on-chip fast analog-to-digital conversion samples the inductor current and bus voltage each PWM cycle, and the dedicated high-resolution PWM generates the interleaved phase-shifted gates; the 4-channel DMA moves conversion results without CPU loading. Trade-off: a DSC consumes more design effort than a dedicated analog PFC controller but enables programmable protection, power metering, and communication via the CAN module.
Recommandé
Automotive Body and Lighting Control
The E-suffix DSPIC33EP64GS808-E/PT operates from -40C to +125C and is AEC-Q100 qualified, meeting the environmental requirements of automotive body control modules, LED headlamp drivers, and auxiliary motor control nodes. The integrated CAN 2.0B module connects the node directly to in-vehicle networks without an external CAN controller, and the 70 MIPS DSP core handles adaptive lighting algorithms or BLDC commutation in real time. In deployment, the 80-pin TQFP supplies ample remappable I/O for high-side drivers, diagnostics, and LIN/CAN transceivers, while dual-partition Flash enables OTA-safe firmware updates. Design consideration: the 3V to 3.6V supply must be derived from the automotive 12V rail via a load-dump-rated pre-regulator, and CAN transceiver companion parts complete the network interface.
Recommandé
Industrial Motor Control (BLDC/PMSM)
Brushless DC and permanent-magnet synchronous motor drives benefit from the DSPIC33EP64GS808-E/PT's combination of a 70 MIPS DSP core for field-oriented control math, high-speed PWM with complementary outputs and dead-time control, and fast ADC-triggered current sampling every PWM cycle. The 4-channel DMA offloads sample transfer, keeping loop latency deterministic at the switching frequencies typical of industrial drives. CAN networking allows the drive to integrate into factory automation backbones, while the -40C to +125C range suits enclosed drive cabinets. Compared with a general MCU, the single-cycle MAC and barrel shifter cut FOC computation time materially; the trade-off is that sensorless algorithms require careful use of the GS family's analog peripherals, so Microchip's motor-control libraries should be the starting firmware baseline.
Recommandé
Digital Solar Micro-Inverter and DC-DC Conversion
Grid-tied and off-grid DC-DC stages such as LLC, phase-shifted full-bridge, and boost converters map well onto the DSPIC33EP64GS808-E/PT. Its GS-family high-resolution PWM supports the precise phase relationships and frequency modulation these topologies demand, while the DSP core closes voltage/current loops and implements maximum-power-point-tracking algorithms at 70 MIPS. Dual-partition Flash allows firmware field upgrades in installed converters without a second microcontroller. The 3V to 3.6V rail simplifies supervision circuitry, and four DMA channels keep ADC sampling of input/output sense lines deterministic. A quantified benefit: one DSC replaces separate analog control and housekeeping MCUs, reducing BOM count. Isolation between the controller domain and the power stage must be provided with digital isolators or optocouplers on the PWM outputs.
Recommandé
Industrial Networking and CAN Gateways
With an on-chip CAN 2.0B controller, 70 MIPS of processing, and 64KB of self-programmable Flash, the DSPIC33EP64GS808-E/PT serves as a compact protocol gateway between CAN and UART/SPI/I2C field devices in factory automation and agricultural equipment. The remappable peripheral pins on the 80-TQFP let designers route multiple serial ports to convenient connectors without PCB rework between hardware revisions. The DSP core filters, translates, and buffers messages, and the DMA channels sustain throughput under burst traffic. Extended -40C to +125C operation tolerates unconditioned enclosures, and AEC-Q100 qualification provides reliability margin beyond typical industrial grade. Trade-off versus a dedicated CAN MCU: the dsPIC33EP requires an external CAN transceiver and awareness of CAN bit-timing configuration during firmware bring-up.
Recommandé
Uninterruptible Power Supplies (UPS) and Energy Storage
UPS and battery-energy-storage control requires simultaneous management of inverter PWM, battery charge control, and system supervision - a workload matched to the DSPIC33EP64GS808-E/PT's 70 MIPS DSP core, fast GS-family analog peripherals, and 4-channel DMA. The controller samples battery voltage/current and inverter output each switching cycle, executes sinusoidal PWM generation, and runs state-of-charge estimation on one die, while CAN links the unit to a battery-management system or site controller. Dual-partition Flash enables safe field updates of grid-code compliance firmware. The -40C to +125C extended range suits outdoor cabinets. Note that peak inverter gate-drive current still requires external gate drivers; the DSC supplies logic-level PWM only, and protection response time should be validated against datasheet ADC/PWM latency.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GS808-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP128GS808-E/PT | DSPIC33EP256GS808-E/PT | DSPIC33EP32GS808-E/PT | DSPIC33EP64GS808-E/MR |
|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-QFN - same die, different body |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 128 KB | 256 KB | 32 KB | 64 KB |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| CAN Module | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) | Yes (CAN 2.0B) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Qualification | AEC-Q100 (Automotive) | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Principaux différenciateurs
- Balanced 64KB Flash footprint with dual-partition update support (vs DSPIC33EP32GS808-E/PT)
- Lowest cost within same pinout family for adequate code size (vs DSPIC33EP256GS808-E/PT)
- Extended -40C to +125C automotive-grade range (vs DSPIC33EP64GS808-I/PT)
- Standard solderable TQFP body for inspection and rework (vs DSPIC33EP64GS808-E/MR)
Notes de conception
The DSPIC33EP64GS808-E/PT requires a regulated 3V to 3.6V supply (nominal 3.3V). Place 0.1uF ceramic decoupling capacitors at every VDD pin pair, plus bulk capacitance near the regulator, and follow the GS-family datasheet requirements for VDDCORE capacitance. Estimated: current draw scales with clock activity and I/O loading, so size the 3.3V regulator above the datasheet maximum IDD plus total I/O sink/source current with at least 30% margin, particularly in motor-drive or converter applications with heavy PWM I/O usage.
For the 80-TQFP (12x12 mm), use a fine-pitch land pattern per the Microchip datasheet mechanical drawing and flood the exposed center area with a solid ground plane connected via stitching vias. Route the oscillator traces short and guard them from PWM/switching nets, and keep the ICSP/ICD programming pins (PGEC/PGED) accessible on a header for in-circuit programming and debugging. Route the CAN pins to the transceiver with a stub under 3 cm and place the transceiver close to the pins with a common ground reference to limit reflections on the bus.
Do not exceed the 3.6V absolute supply limit - 5V I/O is not tolerated. When migrating between 32/64/128/256KB GS808 Flash variants, reselect the device in MPLAB X and verify the device ID; Flash-size differences are the only change but the linker memory map differs. On E-grade (-40C to +125C) parts used near +125C, derate IDD and verify junction temperature: Estimated: TJ = TA + Pd x thetaJA, so compute dissipation from datasheet typical currents at 60 MHz before committing to an enclosure without airflow.
In digital power designs the high-resolution PWM edges are the dominant EMI source. Stagger the switching edges of interleaved phases, use the GS family's dead-time and edge-placement control rather than software delays, and add RC snubbers at transformer/motor terminals as needed. Keep the ADC sense routing away from gate-drive traces to avoid coupling into the control loop, and consider spread-spectrum clocking options allowed by the application to reduce conducted emissions below CISPR-class limits.
Informations de conformité
AEC-Q100 automotive qualification and extended -40C to +125C temperature grade confirmed by distributor listings (Hotenda, Jotrin). RoHS and lead-free status per standard Microchip /E suffix product offering; verify on the Microchip product page for certificate copies.