DSPIC33EV128GM004T-E/MLVAO - 16-Bit 60 MIPS DSC, 128KB Flash | Microchip
Référence : DSPIC33EV128GM004T-E/MLVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.9 | $5,90 |
| 10 | $5.35 | $53,50 |
| 100 | $4.75 | $475,00 |
| 500 | $4.3 | $2 150,00 |
| 1 000 | $3.95 | $3 950,00 |
DSPIC33EV128GM004T-E/MLVAO Présentation
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the DSP-centric features of a digital signal processor in a single core. Within the power-management hierarchy, the dsPIC33EV sits between general-purpose MCUs and dedicated DSPs, providing an optimized architecture for real-time control, digital power conversion, and motor control where both math throughput and robust peripherals are required.
Key features include a 16-bit dsPIC DSC core running at up to 60 MIPS with 5V-tolerant operation, 128KB of self-programmable ECC Flash for functional-safety oriented designs, an extended temperature grade (E suffix) supporting operation up to +125C ambient, and automotive-focused qualification (AEC-Q100 per distributor listings) suited to harsh environments.
Technically, the dsPIC33EV core integrates DSP instructions, a hardware multiplier, and a rich peripheral set including CAN and UART/serial connectivity modules, enabling single-chip closed-loop control of motors and digital power stages. The 5V native I/O removes the need for level shifting in many industrial and automotive 12V-derived systems, improving noise immunity versus 3.3V-only controllers.
Typical applications include brushed and brushless DC motor control, digital power supplies and LED drivers, automotive body and convenience modules, and industrial appliances that must operate reliably in noisy, high-temperature environments.
Design consideration: the E-grade part must still be derated at high ambient temperatures; ensure QFN exposed-pad thermal relief on the PCB (solid ground-plane copper pour with thermal vias) to keep junction temperature within limits at 60 MIPS operation.
This page synthesizes distributor inventory data, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC33EV128GM004T-E/MLVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EV128GM004T-E/MLVAO (même facteur de forme et même empreinte) — différant par Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EV128GM004-E/MLVAO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EV256GM004
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV64GM004
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV32GM004
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128GP504-E/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.28 / unité
Voir la fiche technique →DSPIC33EV128GM004T-E/MLVAO Valeurs maximales et caractéristiques électriques
| Core | dsPIC33EV 16-bit DSC |
| Core Speed | 60 MIPS / 60 MHz |
| Program Memory Size | 128KB (43K x 24) Flash |
| Flash ECC | ECC Flash |
| Operating Voltage | 5 V |
| Boîtier | 44-QFN (8x8 mm), Exposed Pad |
| Type de montage | Surface Mount |
| Temperature Grade | E (extended, up to +125C) |
| Qualification | Automotive, AEC-Q100 (per distributor listing) |
| Family | dsPIC 33EV, Functional Safety (FuSa) capable |
| Product Type | Digital Signal Controller (DSC) |
| I/O Voltage Class | 5V native I/O |
| Packaging Suffix | T (Tape & Reel), VAO (packing code) |
Guide de configuration des broches du DSPIC33EV128GM004T-E/MLVAO 44-qfn (8x8 mm), exposed pad
Configuration des broches du DSPIC33EV128GM004T-E/MLVAO (boîtier 44-qfn (8x8 mm), exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EV128GM004T-E/MLVAO.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EV128GM004T-E/MLVAO convient pour 6 applications: Brushless DC Motor Control, Digital Power Supplies, Automotive Body and Convenience Modules, Industrial Appliances, LED Lighting and Drivers, Functional Safety and Industrial Sensing.
Brushless DC Motor Control
The DSPIC33EV128GM004T-E/MLVAO fits BLDC motor control because its 16-bit 60 MIPS dsPIC core executes field-oriented control (FOC) loops fast enough for commutation at tens of kHz PWM frequencies, while native 5V I/O directly drives gate-driver inputs in noisy 12V/24V automotive and industrial systems. Its 128KB ECC Flash holds full FOC stacks with headroom for diagnostic code, and the E-grade +125C rating suits under-hood and sealed industrial enclosures. In a typical topology the DSC reads Hall or encoder feedback, computes current-loop corrections each PWM cycle, and outputs complementary PWM pairs to a three-phase inverter; using the ECC Flash protects control code against bit flips in high-EMI motor environments, a quantifiable reliability benefit over non-ECC flash MCUs.
Recommandé
Digital Power Supplies
For digitally controlled AC-DC and DC-DC converters, the DSPIC33EV128GM004T-E/MLVAO is appropriate because its 60 MIPS core and DSP multiply-accumulate support close voltage and current loops inside switching periods of 100 kHz-class converters, while 5V-tolerant I/O interfaces cleanly with feedback dividers and PWM controllers common in industrial power stages. The 128KB ECC Flash stores compensator coefficients plus PMBus/UART communication stacks with margin for firmware updates. Placed as the supervisory and loop controller, it generates PWM with programmable dead-time, samples output via ADC, and adjusts duty cycle each cycle; the ECC protection on program memory provides a measurable dependability advantage in power systems where a corrupted instruction could cause a fault, and the extended-temperature E grade allows mounting near hot primary-side components.
Recommandé
Automotive Body and Convenience Modules
The DSPIC33EV128GM004T-E/MLVAO suits automotive body electronics - window lifts, wiper control, lighting modules - because Microchip explicitly targets the dsPIC33EV family at automotive AEC-Q100 environments and the E-grade package endures -40C to +125C ambient. Native 5V operation tolerates load-dump-adjacent transients better than 3.3V controllers, and the 44-QFN (8x8) footprint fits compact module PCBs. Within a module, the DSC reads switch and position inputs, drives relay or H-bridge outputs through PWM, and communicates on LIN/CAN-type networks through its serial connectivity; the 128KB ECC Flash accommodates both application logic and UDS-style diagnostic layers simultaneously, so no external memory is needed - reducing BOM count and improving mean time between failures relative to two-chip alternatives.
Recommandé
Industrial Appliances
Harsh-environment appliances - dishwashers, cooktops, washing machines - benefit from the DSPIC33EV128GM004T-E/MLVAO's combination of 5V noise immunity, extended temperature rating, and 60 MIPS DSP throughput for sensor-heavy control algorithms. Microchip's own positioning highlights appliances as a primary dsPIC33EV use case. The controller runs pump/motor commutation, monitors temperature sensors, and manages user-interface scanning concurrently on one chip; the 128KB ECC Flash retains code integrity despite the strong EMI that motor windings and switching relays generate inside appliance chassis. Because the part tolerates +125C ambient, it can sit near heating elements without local cooling, a placement flexibility that 85C-grade MCUs cannot offer, and the QFN exposed pad simplifies thermal management on high-volume single-sided heatsinking.
Recommandé
LED Lighting and Drivers
Digitally controlled LED drivers use the DSPIC33EV128GM004T-E/MLVAO to implement constant-current loops, dimming curves, and fault protection in a single 44-QFN device. The 60 MIPS core closes feedback loops around 100 kHz-class power stages, while 5V I/O directly interfaces optocoupler and sense networks typical of isolated drivers. High-bay and street-luminaires benefit from the E grade's +125C capability because driver enclosures run hot, and the 128KB ECC Flash supports DALI/DMX-style communication stacks plus adaptive dimming algorithms with margin. The DSC generates PWM or analog-dim control, samples current via the ADC, and throttles duty cycle within microseconds of an over-current event; the ECC flash measurably reduces the risk of field misbehavior in lightning-adjacent outdoor luminaires where radiated transients are routine.
Recommandé
Functional Safety and Industrial Sensing
Distributor listings identify the dsPIC33EV family as Functional Safety (FuSa) capable, making the DSPIC33EV128GM004T-E/MLVAO a fit for industrial sensing nodes and safety-adjacent controllers where memory integrity matters. The 128KB ECC Flash detects and corrects single-bit memory errors - a quantifiable improvement over uncorrected flash - supporting diagnostics in safety-oriented designs. In a typical node the DSC samples analog sensors through the ADC, applies DSP filtering, evaluates threshold logic, and reports status over serial links, all at 5V logic levels that resist factory-floor EMI. The E-grade temperature rating permits mounting in sealed outdoor or machine-interior enclosures up to +125C, and the 44-QFN (8x8) package keeps the electronics compact enough for retrofit sensor housings without external memory or supervision ICs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EV128GM004T-E/MLVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EV128GM004-E/MLVAO | DSPIC33EV256GM004 | DSPIC33EV64GM004 | DSPIC33EP128GP504 |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), Exposed Pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN - same body |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33EV 16-bit, 60 MIPS | dsPIC33EV 16-bit, 60 MIPS | dsPIC33EV 16-bit, 60 MIPS | dsPIC33EV 16-bit, 60 MIPS | dsPIC33EP 16-bit, up to 60 MIPS |
| Program Flash | 128KB ECC (43K x 24) | 128KB ECC | 256KB ECC (+100%) | 64KB ECC (-50%) | 128KB |
| Operating Voltage Class | 5 V | 5 V | 5 V | 5 V | 3.3 V class |
| Automotive Qualification | Automotive, AEC-Q100 (per distributor listing) | Same family qualification | Automotive family | Automotive family | General-purpose (non-automotive) |
Principaux différenciateurs
- 5V native operation with extended temperature (vs DSPIC33EP128GP504)
- ECC Flash for functional safety (vs DSPIC33EV64GM004)
- Memory-scalability without PCB change (vs DSPIC33EV256GM004)
Notes de conception
Solder the 44-QFN exposed thermal pad to a solid ground pour with a 5x5 via array (0.3 mm vias) to spread core heat at 60 MIPS operation. Estimated: at 5V and tens of mA core current, dissipation stays well under 0.5W, which a 2x2 cm copper area can absorb even near the +125C E-grade ambient limit. Without the exposed-pad connection, the QFN leads become the only heat path and junction temperature can exceed ratings in enclosed automotive or appliance housings - this is the single most common reliability failure for ML-package dsPIC designs.
Decouple each VDD pin with 0.1 uF ceramic capacitors placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the supply entry; provide a separate filtered AVDD feed through an RC (for example 10 ohm + 1 uF) from the digital rail for ADC accuracy. The 5V rail should tolerate automotive transients through upstream TVS and a series inductor. Estimated decoupling values follow standard Microchip dsPIC layout guidance in the family reference manual; verify against the current datasheet before release.
Do not confuse packing variants: DSPIC33EV128GM004T-E/MLVAO (tape & reel) and DSPIC33EV128GM004-E/MLVAO (cut tape/tray) are the same silicon, so BOMs can alternate freely - but the Site MPN DSPIC33EV128GM004-E/P8 uses a different package and is NOT pin-compatible. When crossing to same-footprint memory variants (64/256 KB), recompile with the correct linker script and confirm configuration-bit defaults, as family members can differ in oscillator-start behavior. Finally, confirm RoHS/AEC-Q100 certificates for the exact VAO packing code during sourcing, since broker stock varies in traceability.
Informations de conformité
Distributor listings (Jotrin, Mouser) categorize the part under Microchip's automotive AEC-Q100 dsPIC33EV line. RoHS/REACH/lead-free status not stated in verified snippets and must be confirmed on the Microchip product page.
