DSPIC33EV64GM002-E/SP - 16-bit 5V 70 MIPS DSC | Microchip
Référence : DSPIC33EV64GM002-E/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.2 | $42,00 |
| 100 | $3.79 | $379,00 |
| 500 | $3.45 | $1 725,00 |
| 1 000 | $3.12 | $3 120,00 |
DSPIC33EV64GM002-E/SP Présentation
A digital signal controller combines the computational architecture of a digital signal processor with the peripherals and ease of use of a microcontroller. Within the power-management hierarchy of embedded control, the dsPIC33EV family sits between general-purpose MCUs and dedicated DSPs, offering a DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator, dual operand fetch) alongside robust 5V I/O that survives the electrical noise of industrial and automotive environments.
Key features include the 5V operating range that eliminates level-shifting to sensors and power stages, motor-control PWM peripherals with dead-time insertion, SENT and LIN interfaces compliant with automotive networking requirements, on-chip op amps and comparators for current sensing, and watchdog/low-voltage-detect safety features. The -E extended temperature grade supports -40C to +125C operation.
Architecturally, the dsPIC33EV64GM002 pairs a 16-bit modified Harvard core with a dedicated DSP multiply-accumulate unit, hardware division, and a flexible clock system supporting internal FRC and external crystal sources. Programming and debugging use the standard ICSP interface via PGEC/PGED pins, compatible with Microchip MPLAB X IDE and ICD/PICkit tooling.
Typical applications include appliance motor control (BLDC, PMSM, ACIM), automotive sensor and actuator modules, industrial power supplies and battery chargers, and digital power conversion where 5V noise immunity and DSP-class math are required.
Design consideration: the SPDIP package eases prototyping and low-volume assembly, but decouple VDD pins (10 and 19) with 0.1uF ceramics close to the pins, and route PGEC/PGED pairs away from PWM lines to preserve debug reliability.
This page synthesizes datasheet-derived specifications, same-family drop-in alternatives, and practical design guidance not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour DSPIC33EV64GM002-E/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EV64GM002-E/SP (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Operating Temperature, Programming Interface, Functional Safety Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EV64GM002-I/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.1 / unité
Voir la fiche technique →DSPIC33EV32GM002-I/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.35 / unité
Voir la fiche technique →DSPIC33EV128GM002-I/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.86 / unité
Voir la fiche technique →DSPIC33EV256GM002-E/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.4 / unité
Voir la fiche technique →DSPIC33EV256GM002-I/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV64GM002-E/SP Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33E DSC |
| Maximum Operating Speed | 70 MIPS |
| Program Memory (Flash) | 64 KB |
| SRAM | 8 KB |
| Operating Voltage Range | 3.0 V to 5.5 V |
| Température de fonctionnement | -40C to +125C (Extended, -E) |
| Boîtier | 28-pin SPDIP (SP) |
| Type de montage | Through Hole |
| Nombre de broches | 28 |
| DSP Engine | 17x17-bit multiplier, 40-bit accumulator |
| Peripheral Interfaces | SENT, LIN, UART, SPI, I2C, PWM |
| Analog Peripherals | ADC, comparators, on-chip op amp |
| Programming Interface | ICSP (2-wire PGEC/PGED) |
| Statut RoHS | Compliant |
| Developer Tools | MPLAB X IDE, ICD, PICkit |
Configuration des broches de DSPIC33EV64GM002-E/SP
| Broche 1 | MCLR — Master clear reset / programming voltage input |
| Broche 2 | AN0 — Analog input 0 / VREF+ |
| Broche 3 | AN1 — Analog input 1 / VREF- |
| Broche 4 | PGED1 — Programming data / general purpose I/O |
| Broche 5 | PGEC1 — Programming clock / general purpose I/O |
| Broche 6 | AN2 — Analog input 2 / general purpose I/O |
| Broche 7 | AN3 — Analog input 3 / general purpose I/O |
| Broche 8 | OSC1 — Crystal oscillator input / external clock (CLKI) |
| Broche 9 | OSC2 — Crystal oscillator output / clock output (CLKO) |
| Broche 10 | VDD — Positive power supply (3.0V to 5.5V) |
| Broche 11 | VSS — Ground reference |
| Broche 12 | SOSCI — Secondary oscillator input / I/O |
| Broche 13 | SOSCO — Secondary oscillator output / I/O |
| Broche 14 | PGED3 — Alternate programming data / general purpose I/O |
| Broche 15 | PGEC3 — Alternate programming clock / general purpose I/O |
| Broche 16 | U1RX — UART1 receive / general purpose I/O |
| Broche 17 | U1TX — UART1 transmit / general purpose I/O |
| Broche 18 | VSS — Ground reference |
| Broche 19 | VDD — Positive power supply (3.0V to 5.5V) |
| Broche 20 | SDA1 — I2C1 data / general purpose I/O |
| Broche 21 | SCL1 — I2C1 clock / general purpose I/O |
| Broche 22 | INT0 — External interrupt 0 / general purpose I/O |
| Broche 23 | AN4 — Analog input 4 / general purpose I/O |
| Broche 24 | AN5 — Analog input 5 / general purpose I/O |
| Broche 25 | PWM1L — Motor control PWM output 1 low / I/O |
| Broche 26 | PWM1H — Motor control PWM output 1 high / I/O |
| Broche 27 | PGED2 — Alternate programming data / general purpose I/O |
| Broche 28 | AVSS — Analog ground reference |
Applications typiques
DSPIC33EV64GM002-E/SP convient pour 6 applications: Appliance Motor Control, Automotive Sensor and Control Units, Industrial Power Supplies and Battery Chargers, Embedded Prototyping and Education, Industrial Sensing and Data Acquisition, HVAC and Compressor Control.
Appliance Motor Control
The DSPIC33EV64GM002-E/SP is purpose-built for appliance motor control such as BLDC, PMSM, and AC induction drives in washing machines, refrigerators, and HVAC blowers. Its complementary PWM peripheral generates the switching pattern for three-phase inverters with hardware dead-time insertion, eliminating software timing risk, while the 70 MIPS DSP core executes field-oriented control loops at multi-kHz rates. The 5V I/O directly interfaces with gate drivers and current-sense amplifiers without level translation, and the -40C to +125C extended grade tolerates sealed, high-temperature enclosures. On-chip op amps digitize phase currents with minimal external components, reducing bill-of-material cost in cost-sensitive appliance designs.
Recommandé
Automotive Sensor and Control Units
For automotive sensor, touch, and control modules, the DSPIC33EV64GM002-E/SP combines a SAE J2716-compliant SENT peripheral and LIN protocol support with a 5V noise-tolerant core rated -40C to +125C. SENT interfaces directly with modern position, pressure, and flow sensors, while LIN connects the module to body-control networks at low cost. The extended temperature grade and robust EMI characteristics address the vibration, thermal cycling, and electrical noise typical of under-hood and cabin electronics. The 64 KB Flash accommodates diagnostic routines and calibration tables, and the ICSP interface enables in-field reprogramming during end-of-line test via the standard PGEC/PGED pins on the SPDIP footprint.
Recommandé
Industrial Power Supplies and Battery Chargers
Digital power conversion tasks - PFC stages, LLC resonant converters, and multi-chemistry battery chargers - benefit from the DSPIC33EV64GM002-E/SP's deterministic 70 MIPS core and ADC-triggered-by-PWM sampling architecture. Current-loop bandwidths of tens of kHz are achievable because ADC conversions synchronize to PWM period boundaries, feeding the DSP multiply-accumulate unit with minimal latency. The 5V operating range interfaces cleanly with feedback optocouplers, TL431 references, and gate-driver logic. On-chip comparators provide cycle-by-cycle overcurrent protection independent of software, a critical safety layer. The SPDIP package accelerates power-board prototyping before committing to a surface-mount production layout.
Recommandé
Embedded Prototyping and Education
The 28-pin SPDIP through-hole package makes the DSPIC33EV64GM002-E/SP ideal for breadboard prototyping, university laboratories, and hobbyist DSP projects. It sockets into standard 0.1-inch DIP footprints, survives repeated insertion cycles, and supports hand soldering. Students gain exposure to real DSP concepts - fixed-point multiply-accumulate, PWM generation, ADC synchronization - using low-cost PICkit programmers and free MPLAB X IDE. The 5V logic level is forgiving for beginners and directly compatible with legacy 5V peripherals such as LCD character modules and sensor boards. The same silicon is available in surface-mount packages, providing a seamless migration path from prototype to production board.
Recommandé
Industrial Sensing and Data Acquisition
The DSPIC33EV64GM002-E/SP serves as a compact acquisition node for industrial sensor front-ends. Its 12-bit ADC samples potentiometers, RTDs, and 4-20 mA loops via the on-chip op amp and comparator block, while the DSP engine performs digital filtering (IIR/FIR) and fixed-point scaling in real time. The 5V supply interfaces directly with industrial I/O standards and legacy transducers, and the -40C to +125C range permits mounting near motors, heaters, and switchgear. UART and SPI links forward processed data to PLCs or gateways, and the 64 KB Flash retains calibration tables and communication stacks. Watchdog and low-voltage-detect features protect data integrity in noisy plants.
Recommandé
HVAC and Compressor Control
Commercial HVAC systems and refrigeration compressors demand variable-speed motor drives with safety shutdown paths - a match for the DSPIC33EV64GM002-E/SP's complementary PWM with fault input, hardware dead-time control, and autonomous comparator overcurrent protection. The 70 MIPS core sustains sensorless back-EMF and single-shunt FOC algorithms, while the extended -40C to +125C temperature rating withstands rooftop unit enclosures. The 5V I/O tier tolerates the switching transients of inverter-driven compressors better than 3.3V controllers, reducing external protection circuitry. LIN connectivity supports building-management integration, and the SPDIP variant enables serviceable control boards using socketed processors for field replacement.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EV64GM002-E/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EV64GM002-I/SP | DSPIC33EV32GM002-I/SP | DSPIC33EV128GM002-I/SP | DSPIC33EV256GM002-E/SP | DSPIC33EV256GM002-I/SP |
|---|---|---|---|---|---|---|
| Package | 28-pin SPDIP (SP) | 28-pin SPDIP (SP) - same | 28-pin SPDIP (SP) - same | 28-pin SPDIP (SP) - same | 28-pin SPDIP (SP) - same | 28-pin SPDIP (SP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 64 KB | 32 KB | 128 KB | 256 KB | 256 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V | 3.0 V to 5.5 V |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Peripherals | PWM, SENT, LIN, ADC, op amp | PWM, SENT, LIN, ADC, op amp - identical | PWM, SENT, LIN, ADC, op amp - identical | PWM, SENT, LIN, ADC, op amp - identical | PWM, SENT, LIN, ADC, op amp - identical | PWM, SENT, LIN, ADC, op amp - identical |
Principaux différenciateurs
- Extended temperature headroom to +125C (vs DSPIC33EV128GM002-I/SP)
- Balanced memory for FOC applications (vs DSPIC33EV32GM002-I/SP)
- Cost-optimized memory point (vs DSPIC33EV256GM002-E/SP)
Notes de conception
Decouple both VDD pins (10 and 19) with 0.1uF ceramic capacitors placed within 5 mm of each pin, plus one bulk 10uF capacitor near the socket. In SPDIP socketed prototypes, socket contact resistance adds supply noise; keep the bulk capacitor on the board side of the socket. Connect AVSS (pin 28) to a clean analog ground return, separate from PWM return currents, to preserve ADC accuracy.
The -E grade is required for ambient temperatures above +85C; substituting the -I grade in a +105C enclosure voids the temperature rating even though the pinout and firmware are identical. Also note MCLR (pin 1) needs a 10k pull-up to VDD for reliable power-on reset, and PGEC/PGED pins selected as programming channels must not be loaded with strong pull-downs that could confuse the ICSP programmer during debug sessions.
When migrating from the SPDIP prototype to a surface-mount SOIC (/SO) production package, the same pinout map applies, so firmware is unchanged. Route the motor-control PWM outputs (pins 25-26) as short, paired traces to gate drivers and place a ground guard between PWM traces and the analog inputs (pins 2-7) to prevent switching transients from coupling into ADC samples. Estimated: keeping PWM-to-analog spacing above 2 mm typically reduces sample glitching at 4-8 kHz PWM frequencies.
Informations de conformité
RoHS compliant and lead-free per standard Microchip commercial grading for the -E/SP ordering code; detailed REACH and conflict-minerals statements available from Microchip product compliance documentation.
