DSPIC33FJ128GP706A-I/PT - 16-bit DSC 40 MIPS 128KB Flash | Microchip
Référence : DSPIC33FJ128GP706A-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.42 | $9,42 |
| 10 | $8.55 | $85,50 |
| 100 | $8.91 | $891,00 |
| 500 | $8.25 | $4 125,00 |
| 1 000 | $7.86 | $7 860,00 |
DSPIC33FJ128GP706A-I/PT Présentation
A digital signal controller combines the compute characteristics of a microcontroller (MCU) with DSP capability. It sits within the power-management and embedded-control hierarchy as a 16-bit DSC, positioned between general-purpose microcontrollers such as the PIC24 family and dedicated DSP processors. DSCs execute both control-loop C code and math-heavy signal processing (FIR filters, PID, transforms) in a single device, which is why they dominate motor control and digital-power designs.
Key features include the 16-bit dsPIC33F CPU core with DSP engine operating from DC to 40 MIPS, industrial temperature operation from -40C to +85C, and 3.3V CMOS technology. The GP (General Purpose) peripheral set provides UART, SPI, and I2C communication, multiple 16-bit timers, an input-capture/output-compare module, and high-performance analog-to-digital conversion suitable for mixed-signal embedded systems.
Architecturally, the dsPIC33F core uses a modified Harvard layout with a 16-bit data path and DSP-class addressing modes including modulo and bit-reversed addressing. Seamless migration options exist to PIC24F, PIC24H MCUs, and dsPIC30F DSCs in similar packages, and the device supports In-Circuit Serial Programming (ICSP) through any matched PGECx/PGEDx pin pair.
Typical applications include industrial control and embedded automation, motor control, metering, and IoT or low-power board designs where a single controller handles both real-time control and signal processing.
A key design consideration: the 40 MIPS rating requires 3.0-3.6V; at lower VDD the maximum MIPS derates, so speed-critical designs should fix VDD at 3.3V and verify oscillator configuration (PLL) at startup.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ128GP706A-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ128GP706A-I/PT (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, Package, Programming Interface, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ128GP706A-E/PT
✅ Remplacement direct✓ En stock
$5.9 / unité
Voir la fiche technique →DSPIC33FJ128GP706A-H/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ128GP706A-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ128GP706-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ128MC706A-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.2 / unité
Voir la fiche technique →DSPIC33FJ128GP706A-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33F |
| Maximum Clock / Performance | 40 MIPS (40 MIPS at 3.0-3.6V, -40C to +85C) |
| Program Memory (Flash) | 128 KB (128K x 8) |
| SRAM | 16 KB |
| Supply Voltage (VDD) | 3.0 V to 3.6 V (3.3 V nominal) |
| Température de fonctionnement | -40C to +85C (Industrial, I suffix) |
| Boîtier | 64-pin TQFP (PT), 10 x 10 mm, 0.5 mm pitch |
| Type de montage | Surface Mount |
| Technology | CMOS |
| Communication Interfaces | UART, SPI, I2C |
| Programming Interface | ICSP via PGECx/PGEDx pin pairs |
| Product Family | dsPIC33FJ General Purpose (GP) DSC |
| Migration Path | PIC24F, PIC24H, dsPIC30F in similar packages |
| Statut RoHS | Compliant |
| Packaging Option | Tray |
| Development Support | Explorer 16/32 Development Board (PIM) |
Guide de configuration des broches du DSPIC33FJ128GP706A-I/PT 64-pin tqfp (pt), 10 x 10 mm, 0.5 mm pitch
Configuration des broches du DSPIC33FJ128GP706A-I/PT (boîtier 64-pin tqfp (pt), 10 x 10 mm, 0.5 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33FJ128GP706A-I/PT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33FJ128GP706A-I/PT convient pour 6 applications: Industrial Control and Embedded Automation, Motor Control, Energy Metering, IoT Sensor Nodes and Edge Devices, Digital Audio and Signal Processing, Development and Prototyping.
Industrial Control and Embedded Automation
The DSPIC33FJ128GP706A-I/PT fits industrial control nodes where deterministic 16-bit execution at up to 40 MIPS handles both the control loop and communication stacks simultaneously. Its industrial -40C to +85C rating matches factory-floor ambient conditions, and the 128KB Flash accommodates protocol stacks alongside application logic without external memory. The UART, SPI, and I2C interfaces connect PLC I/O, sensors, and HMIs directly. Using a single DSC instead of an MCU-plus-DSP two-chip solution reduces board area and BOM cost, while ICSP programming through matched PGECx/PGEDx pairs enables field firmware updates without removing the device from the PCB.
Recommandé
Motor Control
Motor drives need fast PWM generation, current sampling, and closed-loop math every few microseconds, which the 40 MIPS dsPIC33F core and DSP multiply-accumulate engine deliver. The GP706A input-capture and output-compare modules support rotor-position decoding and PWM generation for brushless DC and induction motor drives in the mid-performance range. Its 3.3V CMOS I/O interfaces gate drivers such as the MIC4104 or IR2110 class parts without level shifting. When the design demands the enhanced motor-control PWM peripheral set (center-aligned, complementary outputs with dead time), the pin-compatible DSPIC33FJ128MC706A swaps in on the same 64-TQFP footprint with no PCB change.
Recommandé
Energy Metering
Metering front ends require simultaneous sampling of voltage and current channels plus real-time RMS and power computation; the dsPIC33F ADC and DSP engine handle both. The 16KB RAM retains waveform buffers for harmonic analysis while the 128KB Flash stores calibration tables and metrology firmware. Operation from -40C to +85C covers outdoor meter enclosures, and the 3.0-3.6V supply range tolerates regulated auxiliary supply variation. UART connectivity forwards meter data to communication modules (RF, PLC, or GSM), and the ICSP interface supports firmware field upgrades during meter calibration and re-certification, an important lifecycle requirement for deployed metering fleets.
Recommandé
IoT Sensor Nodes and Edge Devices
IoT edge nodes benefit from the DSC's ability to preprocess sensor signals locally (filtering, FFT feature extraction) before transmission, cutting radio duty cycle and network traffic. The 16KB RAM supports ring buffers for streaming sensor data while 128KB Flash hosts both the signal-processing code and the communication stack. SPI and I2C interfaces connect MEMS sensors and radio modules natively at 3.3V, eliminating level-shift circuitry. The 64-TQFP's 0.5mm pitch suits cost-driven two-layer or four-layer boards. For battery-powered nodes, configure the clock for lower-MIPS operation at reduced VDD within the specified range to trade throughput for power.
Recommandé
Digital Audio and Signal Processing
The GP (General Purpose) dsPIC33F family is well suited to real-time audio and general DSP tasks such as active filters, codecs support, and control-heavy signal chains. The core's DSP multiply-accumulate instructions and modulo/bit-reversed addressing accelerate FIR and IIR filtering at 40 MIPS, enough for multi-channel audio processing at moderate sample rates. The 128KB Flash holds filter coefficient tables and application firmware; the 16KB RAM sustains audio buffers with headroom. SPI interfaces connect audio codecs and external DACs/ADCs at 3.3V. Designers should budget MIPS carefully, as simultaneous control and DSP loading reduces available real-time margin at the 40 MIPS ceiling.
Recommandé
Development and Prototyping
The Explorer 16/32 Development Board officially supports the dsPIC33F family via Processor Plug-In Modules (PIMs), letting teams prototype the DSPIC33FJ128GP706A-I/PT with full debugger access before committing to custom hardware. Because the device exposes multiple PGECx/PGEDx ICSP pairs, prototype harnesses can route any matched pair for programming and debugging; NSDSP tools are also confirmed compatible. Seamless migration to PIC24F, PIC24H, and dsPIC30F devices in similar packages means a prototype can validate firmware on this exact die and later pin-compatibility-swap variants (temperature grades or MC peripherals) without layout changes, compressing development schedules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ128GP706A-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ128GP706A-E/PT | DSPIC33FJ128GP706A-H/PT | DSPIC33FJ128GP706-I/PT | DSPIC33FJ128MC706A-I/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm, 0.5 mm pitch) | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Performance | 40 MIPS (3.0-3.6V) | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Temperature Range | -40C to +85C (Industrial) | Extended (up to +125C) | Higher grade than -I | -40C to +85C | -40C to +85C |
| Silicon Revision | A revision (errata corrected) | A revision | A revision | Original (documented errata) | A revision (MC family) |
| Peripheral Focus | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (enhanced PWM) |
Principaux différenciateurs
- A-revision silicon corrects family errata (vs DSPIC33FJ128GP706-I/PT)
- Extended-temperature drop-in option (vs DSPIC33FJ128GP706A-E/PT)
- GP peripheral balance over MC specialization (vs DSPIC33FJ128MC706A-I/PT)
Notes de conception
The DSPIC33FJ128GP706A-I/PT achieves its full 40 MIPS rating only with VDD between 3.0V and 3.6V per Microchip operating-range data. Power the part from a clean 3.3V LDO (e.g., an MCP1700-class or equivalent low-noise regulator) and decouple every VDD/VDDCORE pair with 100nF ceramic capacitors placed within 2mm of the pins, plus bulk 10uF near the board entry. At lower VDD the allowed MIPS derates, so a design using a 3.0V rail must confirm it does not rely on the full 40 MIPS ceiling.
The 64-TQFP 0.5mm pitch requires controlled solder paste stencil thickness (typically 100-127um) to avoid bridging on adjacent leads. Connect all VSS and VSS pins as required by the datasheet - leaving grounded pins floating during ICSP is a common failure cause. Use a solid ground plane on layer 2 and route the crystal or internal-oscillator PLL area away from switching loads. Provide ICSP test points on any PGECx/PGEDx matched pair so production programming does not require bed-of-nails access to fine-pitch pins.
Two pitfalls recur with this device family. First, ICSP clock and data must come from the SAME PGECx/PGEDx pair - mixing PGEC2 with PGED3 will fail programming (per the NSDSP support summary). Second, do not confuse the non-A and A silicon revisions: the DSPIC33FJ128GP706 (non-A) carries documented errata corrected in the A revision; always order A-suffix parts for new designs and verify marking on incoming stock. Also confirm the exact temperature suffix (-I vs -E vs -H) matches your ambient requirement, since packages are externally identical.
Informations de conformité
RoHS compliant and tray-packed per distributor listings (onlinecomponents.com, LCSC). REACH, halogen-free, and conflict-minerals status not stated in provided data.
