DSPIC33FJ32GS406T-50I/MR - 50MIPS 16-bit DSC 32KB Flash | Microchip
Référence : DSPIC33FJ32GS406T-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.9 | $490,00 |
| 500 | $4.41 | $2 205,00 |
| 1 000 | $3.95 | $3 950,00 |
DSPIC33FJ32GS406T-50I/MR Présentation
A digital signal controller combines the deterministic control of a microcontroller with the math throughput of a DSP. Within the power-management hierarchy, the DSC sits above a generic MCU for switched-mode power conversion: it executes Proportional-Integral-Derivative and predictive control loops at switching frequencies that a standard 8-bit or 16-bit MCU struggles to sustain, while retaining peripherals, Flash self-programming, and low cost.
Key features include a 16-bit dsPIC33F CPU core with DSP engine (barrel shifter, 40-bit accumulators, single-cycle MAC), high-speed PWM peripherals purpose-built for switch-mode power supplies, high-speed 10-bit ADCs with simultaneous sampling of multiple channels, and analog comparators that close control loops on-chip. The GS family is explicitly marketed by Microchip for digital power applications such as interleaved power factor correction, where a reference design achieves 350 W from a universal AC input.
Technical depth: the dsPIC33F core supports C compiler targeting with hardware multiply-accumulate, modulo and bit-reversed addressing for FFT-type work, and a flexible clocking scheme with an internal fast RC oscillator and PLL. Flash program memory is 8-bit-wide organized as 32K x 8 per distributor listings, and the device runs at 3.3V supply per Hotenda product data. The industrial (I) temperature option supports -40C to +85C operation.
Typical applications include digital switched-mode power supplies (AC-DC, DC-DC), interleaved PFC front ends, battery chargers, LED drivers, solar micro-inverters, and uninterruptible power supplies, where on-chip high-speed PWM plus fast ADC sampling eliminates external analog control circuitry.
Design consideration: budget the VQFN exposed pad as the primary thermal and ground path - a solid ground plane with multiple thermal vias under the pad is strongly recommended for high-switching-frequency designs to control EMI and junction temperature.
This page synthesizes distributor pricing cross-references, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ32GS406T-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ32GS406T-50I/MR (même facteur de forme et même empreinte) — différant par Package, Special Peripherals, Packaging, Core, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ32GS406-50I/MR
✅ Remplacement direct✓ En stock
$4.44 / unité
Voir la fiche technique →DSPIC33FJ32GS406T-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ32GS406T-50E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ64GS406T-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.38 / unité
Voir la fiche technique →DSPIC33FJ64GS406-50I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.45 / unité
Voir la fiche technique →DSPIC33FJ32GS406T-50I/MR Valeurs maximales et caractéristiques électriques
| Core | dsPIC33F 16-bit |
| Product Type | Digital Signal Controller (DSC) |
| Performance | 50 MIPS |
| Program Memory Size | 32KB (32K x 8) Flash |
| RAM Size | 4K x 8 |
| Largeur du bus de données | 16 bit |
| Tension d'alimentation | 3.3 V |
| Boîtier | 64-VQFN (MR), 9x9 mm, Exposed Pad |
| Terminal Count | 64 |
| Type de montage | Surface Mount |
| Temperature Grade | I (Industrial) |
| Packaging | Tape & Reel (T suffix) |
| Factory Pack Quantity | 40 |
| Program Memory Type | FLASH |
| Special Peripherals | High-Speed PWM, High-Speed ADC, Comparators |
| Statut RoHS | Compliant |
| Plage de température de fonctionnement | -40C to +85C |
Guide de configuration des broches du DSPIC33FJ32GS406T-50I/MR 64-vqfn (mr), 9x9 mm, exposed pad
Configuration des broches du DSPIC33FJ32GS406T-50I/MR (boîtier 64-vqfn (mr), 9x9 mm, exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33FJ32GS406T-50I/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33FJ32GS406T-50I/MR convient pour 6 applications: Digital Switch-Mode Power Supplies (SMPS), Interleaved Power Factor Correction (PFC), Battery Chargers, LED Lighting Drivers, Solar Micro-Inverters, Uninterruptible Power Supplies (UPS).
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33FJ32GS406T-50I/MR is purpose-built for digitally controlled AC-DC and DC-DC converters. Its 50 MIPS 16-bit core executes voltage- and current-loop control algorithms at switching frequencies of hundreds of kilohertz, while the dedicated high-speed PWM peripheral provides edge- and center-aligned outputs with fine duty-cycle resolution. The high-speed ADC samples inductor current and output voltage synchronously with the PWM cycle, and on-chip comparators enable cycle-by-cycle overcurrent protection without CPU intervention. Replacing analog compensation with firmware control lets one PCB platform serve multiple output specifications through software. The 32KB Flash accommodates full control plus housekeeping and communication code in cost-sensitive power designs.
Recommandé
Interleaved Power Factor Correction (PFC)
Interleaved PFC is the flagship reference application for the GS family: Microchip publishes an Interleaved PFC reference design based on SMPS dsPIC DSCs that accepts universal AC input and produces a single high-voltage DC output up to 350W. The DSPIC33FJ32GS406T-50I/MR suits this topology because its high-speed PWM can drive two interleaved boost phases with controlled phase offset, its fast ADC samples each phase current in the same switching period, and the 16-bit DSP engine (single-cycle MAC, 40-bit accumulators) sustains the average-current-mode control loop. Digital implementation also enables phase shutdown at light load, improving efficiency across the load range versus fixed analog control.
Recommandé
Battery Chargers
Multi-chemistry battery chargers benefit from the GS406 combination of precision ADC sampling, PWM-based charging stages, and firmware-defined charge profiles (CC/CV, trickle, termination). The 50 MIPS core executes coulomb counting and state-machine logic while the high-speed PWM regulates the buck or buck-boost power stage; on-chip comparators provide hardware overcurrent cutoff independent of software. The 32KB Flash holds profile tables for Li-ion, lead-acid, and NiMH chemistries on one hardware platform. The 64-VQFN package supplies enough remappable I/O for charger telemetry, LED indication, and communication interfaces such as SMBus, reducing total bill-of-materials count in consumer and industrial charger designs.
Recommandé
LED Lighting Drivers
High-power LED drivers use the DSPIC33FJ32GS406T-50I/MR to close fast current loops around buck, boost, or SEPIC stages. The high-speed PWM with fine resolution eliminates low-frequency ripple that would otherwise cause visible flicker, and the 10-bit high-speed ADC enables average-current-mode control with per-cycle protection. Firmware dimming schemes - PWM dimming, analog dimming via filtered PWM/DAC output, and DALI or DMX-style protocols - run alongside the power loop on the 50 MIPS core. The 3.3V supply and industrial -40C to +85C rating fit both commercial luminaire and outdoor lighting environments, while the exposed-pad VQFN conducts switching-loss heat into the PCB ground plane.
Recommandé
Solar Micro-Inverters
Micro-inverters attach one inverter per PV panel and demand MPPT tracking, grid-synchronous DC-AC conversion, and safety compliance in a sealed, high-temperature enclosure. The GS406 handles MPPT with its fast ADC sampling panel voltage/current, drives the power stage through the high-speed PWM, and computes grid synchronization on the DSP engine. The 32KB Flash supports MPPT, grid-monitoring, and anti-islanding firmware, and the extended-temperature sibling (50E suffix) covers +125C ambients for harsh rooftop environments. Digital control enables per-panel optimization and remote firmware updates, key advantages over analog micro-inverter control in residential and commercial solar deployments.
Recommandé
Uninterruptible Power Supplies (UPS)
Line-interactive and online UPS designs use the DSPIC33FJ32GS406T-50I/MR to control the inverter, rectifier, and transfer switch from a single controller. The 50 MIPS core sustains sinusoidal inverter regulation using the DSP MAC engine, the high-speed PWM drives full-bridge stages with dead-time control, and the high-speed ADC monitors battery voltage, bus voltage, and output waveform simultaneously. On-chip comparators implement hardware fault trip zones for overload and short-circuit events. The 64-pin VQFN provides enough remappable I/O for front-panel, communication (USB/CAN-class interfaces via remap), and relay transfer control, consolidating what previously required a DSC plus a supervisory MCU.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ32GS406T-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ32GS406-50I/MR | DSPIC33FJ32GS406T-I/MR | DSPIC33FJ32GS406T-50E/MR | DSPIC33FJ64GS406T-50I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) Exposed Pad | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Core Performance | 50 MIPS, 16-bit | 50 MIPS, 16-bit | 50 MIPS, 16-bit | 50 MIPS, 16-bit | 50 MIPS, 16-bit |
| Flash Program Memory | 32KB (32K x 8) | 32KB | 32KB | 32KB | 64KB |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +125C (E grade) | -40C to +85C |
| Supply Format | Tape & Reel (T) | Tube (factory pack 40) | Tape & Reel | Tape & Reel | Tape & Reel |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Digital Power Peripherals | High-Speed PWM, ADC, Comparators | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
Principaux différenciateurs
- SMPS-optimized peripheral set (vs DSPIC33FJ32GP304-I/ML)
- Tape & Reel production delivery (vs DSPIC33FJ32GS406-50I/MR)
- Extended-temperature headroom available in-family (vs DSPIC33FJ32GS406T-50E/MR)
- Memory headroom upgrade path (vs DSPIC33FJ64GS406T-50I/MR)
Notes de conception
The exposed pad of the 64-VQFN (MR) package is the primary ground and thermal path. Connect it to a solid ground plane through an array of thermal vias (typically 4x4 or denser, filled/plugged where possible). Do not rely on perimeter pins alone for grounding - SMPS switching currents through the PWM drivers return through this pad, and a poor pad connection shows up as ground bounce on ADC readings and erratic comparator trips during layout bring-up.
The GS406 combines nanosecond-class PWM edges with a high-speed ADC on the same die, so keep ADC sense traces away from PWM gate-drive traces and route each ADC input with its own return path. Decouple each VDD/AVDD pin with 100 nF ceramics placed within 2 mm of the pin, plus bulk capacitance near the package. Star or plane the analog supply (AVDD) separately from digital VDD with a ferrite or RC filter to preserve ADC accuracy in digital power loops.
Many GS406 pins are remappable via Peripheral Pin Select - do not assume a pin function from a schematic of a sibling GS part; re-verify the PSS assignment against the family datasheet pin diagrams for this exact device. Also confirm the temperature suffix at ordering: the I grade is -40C to +85C, so a sealed outdoor converter with +95C internal ambient must order the -50E/MR extended variant instead, even though the footprint is identical.
Informations de conformité
RoHS compliance indicated by digchip specification data and distributor listings. REACH, halogen-free, and conflict-minerals statements not present in provided data.
