DSPIC33FJ32GS610-50I/PF - 16-bit DSC 50MIPS 32KB Flash | Microchip
Référence : DSPIC33FJ32GS610-50I/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.78 | $7,78 |
| 10 | $7.1 | $71,00 |
| 100 | $6.45 | $645,00 |
| 500 | $5.9 | $2 950,00 |
| 1 000 | $5.45 | $5 450,00 |
DSPIC33FJ32GS610-50I/PF Présentation
A digital signal controller combines the computational core of a 16-bit microcontroller with DSP-class math acceleration on a single die. In the power-conversion hierarchy, the DSC sits above a plain MCU (which lacks fast multiply-accumulate hardware) and below a standalone DSP (which typically lacks integrated power peripherals), making the dsPIC33F family a single-chip control solution for switch-mode power supplies and motor drives.
Key features include the 16-bit dsPIC33F core running at 50 MIPS, 32KB (32K x 8) of Flash program memory, and the GS-series digital power peripherals: a high-speed 10-bit ADC with simultaneous multi-channel sampling and high-resolution PWM modules purpose-built for switching converter control loops.
The GS variant of the dsPIC33F family differs from the GP (general purpose) and MC (motor control) variants by integrating the SMPS-oriented ADC/PWM combination. This allows a proportional-integral control loop to sample multiple converter currents and voltages, compute the error, and update the PWM duty cycle within a single switching period at hundreds of kilohertz - the classic digital power architecture used in PFC stages, LLC resonant converters, and digital battery chargers.
Typical applications include interleaved power factor correction (Microchip publishes an Interleaved PFC reference design for this family producing up to 350W from universal AC input), digital SMPS and DC-DC converters, solar micro-inverters, and digital lighting ballasts.
A key design consideration is supply discipline: the controller requires a 3.0V to 3.6V rail, so decouple each VDD/VDDCORE pair with 0.1uF ceramics and follow Microchip's layout guidance for the analog ADC supply to preserve conversion accuracy in noisy converter environments.
This page synthesizes distributor pricing from 11 sources, drop-in alternatives within the same 100-pin footprint, and digital power design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ32GS610-50I/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ32GS610-50I/PF (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Operating Temperature, Core, Packaging.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ64GS610-50I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ128GS610-50I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ32GS610-50I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.45 / unité
Voir la fiche technique →DSPIC33FJ256GP510-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.98 / unité
Voir la fiche technique →DSPIC33FJ256MC510T-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.65 / unité
Voir la fiche technique →DSPIC33FJ32GS610-50I/PF Valeurs maximales et caractéristiques électriques
| Core | dsPIC33F, 16-bit |
| Product Type | Digital Signal Controller (DSC) |
| Maximum Processing Speed | 50 MIPS |
| Program Memory Size | 32 KB (32K x 8) Flash |
| Supply Voltage Range | 3 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (Industrial, I-temp) |
| Boîtier | 100-TQFP (14x14 mm), /PF suffix |
| Type de montage | Surface Mount |
| Nombre de broches | 100 |
| Packaging | Tube |
| Factory Pack Quantity | 40 |
| Processor Series | dsPIC33F |
| Statut RoHS | Compliant (RoHS details per Microchip) |
| ADC Resolution | 10-bit (SMPS high-speed ADC) |
| Typical Applications | Digital SMPS, PFC, power conversion |
Guide de configuration des broches du DSPIC33FJ32GS610-50I/PF 100-tqfp (14x14 mm), /pf suffix
Configuration des broches du DSPIC33FJ32GS610-50I/PF (boîtier 100-tqfp (14x14 mm), /pf suffix). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33FJ32GS610-50I/PF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33FJ32GS610-50I/PF convient pour 6 applications: Interleaved Power Factor Correction (PFC), Digital Switch-Mode Power Supplies (SMPS), Solar Micro-Inverters and DC-AC Conversion, Digital Lighting Ballasts and LED Drivers, Battery Chargers and DC-DC Charging Converters, Embedded Control and Data Acquisition Systems.
Interleaved Power Factor Correction (PFC)
The DSPIC33FJ32GS610-50I/PF fits interleaved PFC precisely because Microchip built the GS-series ADC/PWM pair for this topology - the manufacturer's own Interleaved PFC reference design for the SMPS dsPIC33F family operates from universal AC input and produces a single high-voltage DC output up to 350W of power. The high-speed 10-bit ADC simultaneously samples each phase inductor current and the DC bus, while the high-resolution PWM generators drive interleaved switching phases with programmable phase offsets that cancel input ripple current. At 50 MIPS, the dsPIC core executes average-current-mode compensator math every switching cycle, delivering near-unity power factor and tight bus regulation. Place the controller on an isolated sensing front end and verify ADC grounding against switch-node noise.
Recommandé
Digital Switch-Mode Power Supplies (SMPS)
Digital SMPS control is the core design target of the dsPIC33FJ32GS610: the GS-series integrates a high-speed 10-bit ADC capable of triggering conversions synchronized to the PWM period and high-resolution PWM peripherals that accept duty-cycle updates from the control loop within the same cycle. Running at 50 MIPS with a 32KB control program, the device implements voltage-mode, current-mode, or multi-loop control for buck, boost, flyback, and LLC converters. The digital approach provides adaptive compensation over load and temperature, programmable soft-start, and fault sequencing impossible with fixed analog controllers. Key design consideration: keep the analog ADC supply pins on a quiet ground island and use the device's synchronous sampling to avoid switching-noise corruption of current-feedback signals.
Recommandé
Solar Micro-Inverters and DC-AC Conversion
Micro-inverters demand simultaneous MPPT control, grid-synchronized DC-AC inversion, and safety compliance on a single controller - a workload the DSPIC33FJ32GS610 handles with its 50 MIPS DSP engine and SMPS peripherals. The high-speed 10-bit ADC samples PV voltage/current for maximum-power-point tracking and grid voltage/waveform feedback, while high-resolution PWM outputs drive the power stages with sine-weighted modulation at switching frequencies where small magnetics are practical. The 32KB Flash holds MPPT, PLL grid-synchronization, and protection firmware with room to spare. Because the part runs from a 3V to 3.6V rail, generate the controller supply from an auxiliary bias winding, and implement anti-islanding in software per grid-code requirements with watchdog supervision.
Recommandé
Digital Lighting Ballasts and LED Drivers
High-intensity discharge (HID) ballasts and high-power LED drivers need precise current regulation, lamp-strike sequencing, and power factor correction - all firmware tasks on the DSPIC33FJ32GS610. The SMPS ADC samples LED string or lamp current at rates that keep control-loop phase margin at typical 100-400 kHz switching frequencies, and the high-resolution PWM adjusts duty and frequency for resonant ignition sequences required by HID lamps. Running at 50 MIPS, the controller overlays dimming curves, thermal fold-back, and fault logging that analog ballast ICs cannot provide. Industrial temperature rating of -40C to +85C suits luminaire enclosures where ambient temperatures are elevated; derate the converter design so junction temperature stays within limits at maximum fixture temperature.
Recommandé
Battery Chargers and DC-DC Charging Converters
Smart battery chargers require multi-stage charging profiles (CC, CV, float), coulomb-style current management, and safety cutoffs - readily implemented on the DSPIC33FJ32GS610's 32KB Flash with its SMPS ADC and PWM peripherals. The high-speed 10-bit ADC monitors battery voltage, charge current, and board temperature through its simultaneous-sampling capability, enabling the 50 MIPS core to close the current loop each switching cycle while executing charge-state logic in parallel. Digital control adapts the charge curve to battery chemistry (Li-ion, lead-acid, NiMH) without hardware changes, and PWM fault inputs provide cycle-by-cycle current limiting. Design note: implement independent hardware over-voltage protection external to the controller so a firmware fault cannot overcharge the pack.
Recommandé
Embedded Control and Data Acquisition Systems
Beyond power conversion, the 100-pin DSPIC33FJ32GS610 serves as a compact DSP-grade embedded controller where sensor signal processing and rich I/O matter: the 100-pin TQFP exposes ample GPIO, multiple serial interfaces, and the 16-bit DSP core's MAC hardware for filtering and spectral analysis at 50 MIPS. Typical deployments include industrial data loggers, acoustic/vibration analyzers, and smart sensors that condition analog inputs through the ADC before on-chip DSP post-processing, all within -40C to +85C industrial environments. The Explorer 16/32 Development Board supports this device family via Plug-In Modules for rapid prototyping. 32KB Flash constrains algorithm size, so use fixed-point libraries and, if code grows, migrate to the pin-compatible 64KB or 128KB GS610 variants without PCB changes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ32GS610-50I/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ64GS610-50I/PF | DSPIC33FJ128GS610-50I/PF | DSPIC33FJ256GP510-I/PF | DSPIC33FJ256MC510T-I/PF |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Processing Speed | dsPIC33F 16-bit, 50 MIPS | dsPIC33F 16-bit, 50 MIPS | dsPIC33F 16-bit, 50 MIPS | dsPIC33F 16-bit, 50 MIPS | dsPIC33F 16-bit, 50 MIPS |
| Program Memory (Flash) | 32 KB | 64 KB | 128 KB | 256 KB | 256 KB |
| Peripheral Family / Target | GS - SMPS (high-speed ADC + high-resolution PWM) | GS - SMPS (same) | GS - SMPS (same) | GP - general purpose peripherals | MC - motor control peripherals |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (I-grade) | -40C to +85C (I-grade) |
Principaux différenciateurs
- SMPS-optimized peripheral set (high-speed 10-bit ADC + high-resolution PWM) (vs DSPIC33FJ256GP510-I/PF)
- Pin-compatible Flash upgrade path within the same footprint (vs DSPIC33FJ128GS610-50I/PF)
- 50 MIPS DSP core at industrial temperature for single-chip digital power (vs DSPIC33FJ256MC510T-I/PF)
Notes de conception
The DSPIC33FJ32GS610-50I/PF requires a tight 3V to 3.6V rail. Power it from a dedicated 3.3V LDO or point-of-load buck, not from a 5V logic rail, and never exceed 3.6V on any VDD pin. Place 0.1uF ceramic decoupling at every VDD/VSS pair plus one bulk 10uF per supply group. In digital power designs the controller usually shares a PCB with a switching stage - derive the controller supply from a quiet bias winding or an LDO fed after the switch node to prevent conducted ripple from resetting the core.
Star-ground the analog domain: the GS-series high-speed 10-bit ADC accuracy in SMPS control depends on clean reference and analog grounds. Keep switch nodes, gate-driver loops, and PWM output traces away from ADC input traces, and route current-sense signals differentially where possible. Use the PWM-synchronized ADC trigger so sampling occurs away from switching-edge noise. Follow Microchip's Interleaved PFC reference design layout for proven placement of sense networks around the 100-pin TQFP.
Do not assume cross-family pin compatibility: the GS610 (100-pin) and GS608 (80-pin) share peripherals but not footprints - verify package code /PF vs /PT before layout freeze. Respect the -40C to +85C industrial rating; the -I suffix does not grant automotive or 125C capability. Confirm Flash sizing before firmware freeze: 32KB accommodates standard PFC/SMPS control code, but adding communication stacks or GUI support may require migrating to the pin-compatible DSPIC33FJ64GS610 or DSPIC33FJ128GS610.
Estimated: at 50 MIPS with a fast internal clock, all 100 GPIO can toggle in the tens-of-ns range; series-terminate long PWM traces (22-33 ohm) feeding gate drivers to reduce ring-back into the ADC front end, and keep the crystal/oscillator traces under 15 mm with guard ground. Use the device configuration register settings to enable slew-rate control on non-timing-critical outputs adjacent to analog inputs.
Informations de conformité
RoHS compliance per digchips datasheet listing ('RoHS: Details') and Microchip product data. REACH, lead-free plating detail, halogen-free status, and conflict minerals reporting not stated in provided data - request certificates from Microchip or distributor.
