EFM32TG210F16-QFN32 - 32MHz Cortex-M3 16KB MCU | Silicon Labs
Référence : EFM32TG210F16-QFN32 ✓ ActifEFM32TG210F16-QFN32 Présentation
A microcontroller is a programmable system-on-chip that integrates a processor core, memory, peripherals, and communication interfaces into one package. The EFM32TG series belongs to the MCU and embedded-processor hierarchy and combines ARM Cortex-M3 processing with energy-saving modes, autonomous peripheral operation, and fast wake-up behavior. These features distinguish it from conventional higher-power microcontroller platforms designed primarily for continuous operation.
Verified distributor information identifies the EFM32TG210F16-QFN32 as an ARM Cortex-M3 Tiny Gecko MCU with 32-bit processing, 32 MHz operation, 16 KB flash organized as 16K x 8, and a 32-QFN 6 x 6 mm package. Silicon Labs materials also describe EFM32TG devices as low-power devices with energy-saving modes and autonomous peripherals. The available distributor listing indicates AES and operational-amplifier functionality, but exact peripheral counts and detailed electrical limits are not provided in the supplied data.
The EFM32TG210F16-QFN32 is intended for applications where low power, compactness, and integrated control are more important than maximum flash capacity. Its 32 MHz Cortex-M3 core supports general embedded control, while the Tiny Gecko low-power platform supports battery-operated equipment. The 16 KB flash memory is modest compared with larger general-purpose MCUs, so firmware should be evaluated for image size and update requirements before design commitment.
Typical uses include low-power sensor nodes, compact industrial controllers, battery-powered measurement equipment, consumer accessories, and embedded control modules. For designs requiring more program storage, the EFM32TG210F32-QFN32 family member provides 32 KB flash according to the manufacturer page and should be checked for footprint, memory, and peripheral compatibility. The device should also be reviewed against the application’s supply-voltage, temperature, and qualification requirements.
Designers should place the decoupling network close to the device supply pins, keep analog and digital return-current paths controlled, and confirm the exposed-pad connection and thermal strategy against the package drawing. The QFN package is compact but not leaded, so assembly capability and soldering profile should be reviewed before production release. Use the manufacturer datasheet and reference design guidance for final pin, layout, and peripheral configuration decisions.
This page combines verified manufacturer and distributor information, a transparent alternative comparison, and practical design guidance intended to help engineers evaluate fit, footprint, memory, low-power behavior, and sourcing constraints before selecting the EFM32TG210F16-QFN32.
Alternatives de remplacement direct pour EFM32TG210F16-QFN32 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EFM32TG210F16-QFN32 (même facteur de forme et même empreinte) — différant par Package, Core, RoHS Status, Series.
EFM32TG210F32-QFN32
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32TG210F8-QFN32T
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EFM32G210F128-QFN32
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32G200F32-QFN32
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EFM32TG210F16-QFN32 Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M3, 32-bit RISC |
| Series | EFM32 Tiny Gecko |
| Maximum CPU Frequency | 32 MHz |
| Flash Memory | 16 KB (16K x 8) |
| Tension d'alimentation | 2.5 V to 3.3 V |
| Boîtier | 32-QFN (6 x 6 mm) |
| Type de montage | Surface Mount |
| Low-Power Stop Mode Current | 0.6 uA typical, family-level specification |
| Run Mode Current | 150 uA/MHz, family-level specification |
| Processor Performance | Up to 1.25 Dhrystone MIPS/MHz |
| Memory Protection | Memory Protection Unit supporting up to 8 memory segments |
| Wake-Up Interrupt Controller | Yes |
| Security Features | AES listed by Mouser |
| Analog Feature | Operational amplifier listed by Mouser |
| Energy-Saving Modes | Low-power modes with fast wake-up |
Guide de configuration des broches du EFM32TG210F16-QFN32 32-qfn (6 x 6 mm)
Configuration des broches du EFM32TG210F16-QFN32 (boîtier 32-qfn (6 x 6 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EFM32TG210F16-QFN32.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EFM32TG210F16-QFN32 convient pour 6 applications: Battery-Powered Sensor Nodes, Industrial Control Modules, Battery-Powered Measurement Equipment, Low-Power Consumer Accessories, Compact Data Acquisition Devices, Embedded System Controllers.
Battery-Powered Sensor Nodes
The EFM32TG210F16-QFN32 fits compact sensor nodes that periodically wake to process measurements and then return to a low-power state. Its 32 MHz ARM Cortex-M3 core provides ample control capability, while the EFM32TG family’s stated 0.6 uA Stop-mode current supports low standby demand. The 16 KB flash limit requires disciplined firmware sizing, especially when radio configuration, data filtering, and diagnostics share the same memory. Developers should calculate average consumption from sensor duty cycle, wake frequency, operating voltage, and regulator quiescent current rather than relying only on the minimum Stop-mode figure.
Recommandé
Industrial Control Modules
The EFM32TG210F16-QFN32 can serve as the compact controller in an industrial module requiring deterministic 32-bit processing and low standby power. Its 16 KB flash is appropriate for a focused control task, provided the firmware remains within that budget and avoids unnecessary middleware. The 32-QFN 6 x 6 mm footprint supports dense assemblies, although exposed-pad soldering and thermal verification are essential in production. Firmware should use the manufacturer’s low-power guidance and validate peripheral behavior across the required supply and temperature conditions before deployment.
Recommandé
Battery-Powered Measurement Equipment
The EFM32TG210F16-QFN32 is appropriate for portable measurement equipment that combines sensor conditioning, control, and data processing on a single low-power MCU. The 32 MHz ARM Cortex-M3 core supports responsive control tasks, and the family’s fast wake-up behavior helps minimize the energy penalty of periodic measurements. Because the verified data lists AES and operational-amplifier functionality, designers should evaluate those blocks against the exact analog and security requirements rather than assume dedicated signal-chain performance. A 16 KB firmware budget should include acquisition routines, calibration data, communications, and update logic.
Recommandé
Low-Power Consumer Accessories
The EFM32TG210F16-QFN32 can implement control, user-interface state, and communication management in compact consumer accessories where standby energy matters. Its Cortex-M3 architecture simplifies 32-bit embedded development, and the Tiny Gecko low-power platform allows the processor to sleep between user events. The 16 KB flash capacity favors simple products with tightly controlled firmware, while the QFN-32 package supports miniaturized boards. Designers should verify package assembly capability, exposed-pad layout, and the accuracy of any low-power current claims under the final accessory workload.
Recommandé
Compact Data Acquisition Devices
The EFM32TG210F16-QFN32 fits compact data-acquisition products that gather sensor information and perform local control without requiring a high-performance application processor. Its 32 MHz Cortex-M3 core can execute sampling sequencing, filtering, and communication tasks, while the integrated analog and security features listed by Mouser may reduce external component requirements. Engineers must verify the operational amplifier’s actual input range, bandwidth, noise, and stability because those values are absent from the supplied listing. Firmware memory must also be estimated against the 16 KB flash capacity before sensor algorithms are committed.
Recommandé
Embedded System Controllers
The EFM32TG210F16-QFN32 works as a dedicated embedded system controller for power sequencing, peripheral supervision, and local logic where a full application processor would be excessive. Its 32-bit architecture supports structured firmware and interrupts, while the low-power platform is beneficial in continuously powered systems that spend substantial time idle. The compact QFN-32 package reduces board area but requires careful exposed-pad layout and assembly planning. Because the supplied evidence does not provide detailed peripheral mappings or pin assignments, engineers should validate each required interface against the manufacturer datasheet before release.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EFM32TG210F16-QFN32 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EFM32TG210F32-QFN32 | EFM32TG210F8-QFN32T | EFM32G210F128-QFN32 | EFM32G200F32-QFN32 |
|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 32-QFN (6 x 6 mm) | 32-QFN (6 x 6 mm) | 32-QFN (6 x 6 mm) | 32-QFN (6 x 6 mm) | 32-QFN (6 x 6 mm) |
| Flash Memory | 16 KB (16K x 8) | 32 KB | 8 KB | 128 KB | 32 KB |
| Series | Tiny Gecko | Tiny Gecko | Tiny Gecko | EFM32 G-series | EFM32 G-series |
Principaux différenciateurs
- Lower flash footprint for focused firmware (vs EFM32TG210F32-QFN32)
- Higher memory than the smallest Tiny Gecko candidate (vs EFM32TG210F8-QFN32T)
- Compact verified Cortex-M3 implementation (vs EFM32G210F128-QFN32)
- Mouser-listed AES and operational-amplifier integration (vs EFM32G200F32-QFN32)
Notes de conception
Use the manufacturer’s EFM32TG210 package drawing and reference layout as the authority for the 32-QFN land pattern, exposed-pad connection, and component tolerances. Place the required input and bulk bypass capacitors close to their associated supply pins and route high-current return paths through the power and ground planes rather than through thin signal traces. Validate the final board with assembly inspection because the compact 6 x 6 mm QFN package can develop solder-joint defects when the exposed pad is not properly soldered.
Budget the 2.5 V to 3.3 V operating range against the system rail, regulator tolerance, startup sequence, and peripheral load. The EFM32TG family’s 0.6 uA Stop-mode figure is a family-level low-power value and should not be treated as the total board current. Measure the assembled product across active, sleep, and wake transitions. If battery life is important, include regulator quiescent current, sensor current, pull-up leakage, and wake-frequency overhead in the calculation.
Do not select a same-package candidate solely because its package name matches. EFM32TG210F32 has twice the flash of the target, EFM32TG210F8 has half, and the EFM32G-series candidates can differ in peripheral and memory organization. Review the complete pin table, memory map, peripheral functions, clock configuration, package drawing, and errata before treating any listed alternative as a drop-in production replacement.
Keep analog and communication routing away from noisy switching nodes and maintain a continuous ground reference beneath signal paths. If the listed operational-amplifier function is used, follow the datasheet’s input, output, bypass, and stability requirements rather than generic op-amp layout assumptions. Decoupling placement should prioritize minimizing loop area at the device pins, while the exposed pad should use the recommended via pattern for both electrical and assembly reliability.
Informations de conformité
The supplied manufacturer and distributor excerpts do not provide explicit compliance declarations for this ordering code. Compliance must be confirmed using the current Silicon Labs product page, material declaration, or quality documentation.
