EP1AGX35CF484I6 - Arria GX FPGA 33,520 LE 484-FBGA | Intel
Référence : EP1AGX35CF484I6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2 685,00 |
| 100 | $245 | $24 500,00 |
| 500 | $222 | $111 000,00 |
| 1 000 | $198.5 | $198 500,00 |
EP1AGX35CF484I6 Présentation
A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix, sitting in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Arria GX FPGAs add hard IP for multi-gigabit transceivers and embedded memory, providing a cost-optimized middle ground between Cyclone and Stratix families. This combination positions the EP1AGX35CF484I6 between low-cost FPGAs and high-end transceivers in Intel's portfolio.
Key specifications include 33,520 logic elements, 1,348,416 RAM bits, 230 user I/Os, and integrated transceiver channels supporting data rates up to 3.125 Gbps. The device operates from a 1.2V core supply with auxiliary voltages for I/O banks and PLL blocks. The 484-ball FC-FBGA package uses a 1.0 mm ball pitch to balance board-routing density and assembly yield.
The Arria GX architecture pairs a 4-input LUT-based logic fabric with dedicated hardware multipliers, embedded memory blocks (M512/M4K/M-RAM tiers), and physical coding sublayer (PCS) blocks paired with each transceiver channel. Configuration is stored in SRAM cells requiring an external boot PROM or JTAG downloader, and partial reconfiguration is supported for live system updates.
Typical applications include PCIe x1/x4 endpoint cards, video broadcast equipment, Serial RapidIO bridges, and telecommunications backplane aggregation. Designers also use the part in test and measurement front-ends where deterministic latency and high serial bandwidth converge.
When designing with the EP1AGX35CF484I6, allocate at least 4 layers for the PCB with continuous ground planes under the BGA, and route high-speed serial lanes with controlled 100-ohm differential impedance. Decoupling must follow Intel's Pin Connection Guidelines for Arria GX, with bulk capacitance placed within 100 mils of each power pin.
This page synthesizes distributor inventory, pricing tiers, drop-in replacement analysis, and practical board-design guidance not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1AGX35CF484I6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX35CF484I6 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Embedded Memory, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX35CF484C6N
✅ Remplacement direct✓ En stock
$118 / unité
Voir la fiche technique →EP1AGX35CF484C6
✅ Remplacement direct✓ En stock
$295 / unité
Voir la fiche technique →EP1AGX35CF484C4N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1AGX20CF484I6N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP1AGX20CF484I6
✅ Remplacement direct✓ En stock
$108 / unité
Voir la fiche technique →EP1AGX20CF484C7N
✅ Remplacement direct✓ En stock
$95 / unité
Voir la fiche technique →EP1AGX35CF484I6 Valeurs maximales et caractéristiques électriques
| Family | Arria GX |
| Logic Elements | 33,520 |
| Logic Array Blocks (LABs) | 1,676 |
| Embedded Memory Bits | 1,348,416 |
| Maximum User I/Os | 230 |
| Transceiver Channels | 4 (up to 3.125 Gbps) |
| Core Voltage | 1.2 V |
| Boîtier | 484-ball FC-FBGA |
| Ball Pitch | 1.0 mm |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Type de montage | Surface Mount |
| Configuration Method | SRAM + JTAG/External PROM |
Guide de configuration des broches du EP1AGX35CF484I6 484-ball fc-fbga
Configuration des broches du EP1AGX35CF484I6 (boîtier 484-ball fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX35CF484I6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX35CF484I6 convient pour 6 applications: PCIe Gen1 Endpoint Card, Video Broadcast Equipment, Serial RapidIO Bridge, Telecom Backplane Aggregation, Test and Measurement Front-End, Industrial Control and Factory Automation.
PCIe Gen1 Endpoint Card
The EP1AGX35CF484I6's four integrated 3.125 Gbps transceivers and 33,520 logic elements make it a strong fit for PCIe Gen1 (2.5 Gbps) endpoint applications such as data-acquisition cards, industrial I/O expansion, and low-cost frame-grabber interfaces. The transceiver's hard PCS block implements PCIe physical-layer encoding/decoding without consuming fabric logic, leaving the 33,520 LEs available for application-layer protocol stacks, DMA engines, and user register interfaces. A typical reference design consumes roughly 15,000 LEs for the PCIe hard IP wrapper, leaving sufficient headroom for the application layer. The 1.0 mm pitch 484-ball FC-FBGA package also supports standard PCIe card edge-finger spacing and four-layer FR-4 stack-ups.
Recommandé
Video Broadcast Equipment
Broadcast video systems such as SDI routers, format converters, and multiviewers benefit from the EP1AGX35CF484I6's combination of 1,348,416 RAM bits for line/frame buffers, 230 user I/Os for parallel video buses, and serial transceivers for SMPTE 424M/425M SDI transport. The Arria GX architecture supports deterministic latency pipelines suitable for uncompressed HD-SDI processing, where each pixel clock cycle must be accounted for. The embedded M512/M4K memory blocks serve as cost-effective line buffers without external SRAM, simplifying board layout. Designers use roughly 60-70% of available LEs for color-space conversion and scaling engines at 1080p60 throughput.
Recommandé
Serial RapidIO Bridge
Serial RapidIO (sRIO) interconnects in wireless base stations and DSP farm backplanes commonly use the EP1AGX35CF484I6 as a switch-fabric bridge. Its transceivers deliver the 1.25/2.5/3.125 Gbaud data rates required by sRIO physical-layer specification 1.3/2.1, while the fabric implements the logical-layer transport and congestion-management logic. Compared to a discrete SERDES plus ASIC solution, the integrated transceiver saves roughly $20-30 per channel and reduces board area. The industrial temperature grade ensures operation in outdoor base-station cabinets. Power consumption is approximately 4-5W at full transceiver utilization, manageable with the FC-FBGA thermal pad.
Recommandé
Telecom Backplane Aggregation
Telecommunications equipment requiring multi-protocol aggregation (E1/T1, Ethernet, sRIO, custom LVDS) deploys the EP1AGX35CF484I6 as a flexible aggregation FPGA. Its 230 user I/Os support parallel telecom backplane buses, while transceivers connect to SFP/SFP+ optical modules for uplink aggregation. The device's JTAG-based configuration chain allows in-system firmware updates across multiple FPGAs in a chassis, simplifying field maintenance. Memory-rich applications (deep packet buffers, timing recovery) consume the 1.3 Mbit embedded RAM plus optional external DDR2/QDRII interfaces via the dedicated memory controllers.
Recommandé
Test and Measurement Front-End
High-speed serial protocol analyzers, logic analyzer probe heads, and bit-error-rate testers (BERT) use the EP1AGX35CF484I6 to provide deterministic-latency capture of multi-gigabit serial streams. The four transceivers handle lane rates up to 3.125 Gbps with sub-100 ns latency, sufficient for 8b/10b-encoded protocols such as PCIe, sRIO, and XAUI. The 33,520 logic elements implement capture buffers, pattern-match engines, and trigger logic, while the 1.3 Mbit embedded RAM serves as rolling capture memory. Industrial temperature rating supports lab-to-field portability.
Recommandé
Industrial Control and Factory Automation
Factory-automation controllers with multi-axis motion and high-speed vision inspection use the EP1AGX35CF484I6 as a real-time processing hub. The four transceivers connect to GigE Vision cameras and EtherCAT slave controllers, while the 230 I/Os interface to motor drivers, encoders, and discrete I/O. The industrial temperature grade (-40C to +100C) handles factory-floor thermal stress without active cooling. The 484-ball FC-FBGA package and 1.2V core voltage simplify thermal design in sealed enclosures. Typical motion-control applications consume approximately 40% of available logic for servo loops and 25% for vision preprocessing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX35CF484I6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX35CF484C6N | EP1AGX35CF484C6 | EP1AGX35CF484C4N | EP1AGX20CF484I6N |
|---|---|---|---|---|---|
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same | 484-ball FC-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 21,580 |
| Embedded RAM Bits | 1,348,416 | 1,348,416 | 1,348,416 | 1,348,416 | 1,229,184 |
| User I/Os | 230 | 230 | 230 | 230 | 230 |
| Transceivers | 4 ch @ 3.125 Gbps | 4 ch @ 3.125 Gbps | 4 ch @ 3.125 Gbps | 4 ch @ 3.125 Gbps | 4 ch @ 3.125 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C6 | C4 | I6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest logic density in the 484-ball Arria GX package variant (vs EP1AGX20CF484I6N)
- Industrial temperature grade for harsh environments (vs EP1AGX35CF484C6N)
- Faster speed grade for higher transceiver performance (vs EP1AGX35CF484C4N)
Notes de conception
The 484-ball FC-FBGA package uses 1.0 mm ball pitch and requires at least a 4-layer PCB stack-up with continuous ground planes under the BGA. Route signals on the top layer with microvias to inner layers for breakout. Per Intel Arria GX pin connection guidelines, place bulk decoupling capacitors within 100 mils of each power pin, using a mix of 0.1uF, 1uF, and 10uF values to cover the full noise spectrum.
High-speed transceiver lanes must be routed as 100-ohm differential pairs with matched length (within 5 mils intra-pair and 50 mils inter-pair). Keep TX and RX pairs separated by at least 3W (where W is the dielectric thickness between trace and reference plane) to minimize crosstalk. Series AC-coupling capacitors (typically 100 nF) are required on each transmit lane; place them as close to the transmit ball as physically possible.
The EP1AGX35CF484I6 requires multiple voltage rails: VCCINT (1.2V core), VCCIO (1.5/1.8/2.5/3.3V per bank), VCCA_PLL (1.2V analog for PLLs), VCCA (2.5V for transceiver analog), and VCCP (1.2V for transceiver digital). Per the Arria GX datasheet, use a sequenced power-up scheme with VCCINT ramping before VCCIO; failure to sequence correctly can latch up the device. Estimated total power is 4-5W at full transceiver utilization and 200 MHz fabric clock.
Configuration mode selection (JTAG, Active Serial, Passive Serial, Fast Passive Parallel) must match the external boot memory interface; mismatched MSEL pin settings result in silent boot failure. For multi-device JTAG chains, ensure the chain order in the Quartus II programmer matches the physical TCK/TMS chain order. Unused transceiver channels should be tied to valid voltage levels per the datasheet, not left floating, to avoid unwanted power consumption.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-minerals compliance status was not explicitly stated in the verified web data. Industrial temperature grade is per JEDEC JESD22-A104. AEC-Q100 is not applicable for FPGAs. Confirm specific compliance certifications with the distributor before use in restricted markets.