EP20K60EFC324-1X - APEX 20KE 60K FPGA, 324-BGA, 196 I/O | Altera
Référence : EP20K60EFC324-1X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2 680,00 |
| 100 | $245 | $24 500,00 |
| 500 | $220 | $110 000,00 |
| 1 000 | $198 | $198 000,00 |
EP20K60EFC324-1X Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric. APEX 20KE devices belong to the broader category of programmable logic devices (PLDs), which sit between standard microcontrollers (fixed-function, sequential execution) and ASICs (custom-mask, high-NRE). Within the system hierarchy, APEX 20KE FPGAs occupy the high-density, high-I/O niche used for bus interfacing, protocol bridging, and parallel DSP pre-processing.
Key features include MultiCore architecture merging Look-Up Table (LUT) logic with embedded system blocks (ESBs) that double as RAM or product-term logic, four phase-locked loops (PLLs) for clock management, support for LVTTL, LVCMOS, PCI, SSTL-2/3, HSTL, and GTL+ I/O standards, and in-system programmability via IEEE 1532 / passive serial / passive parallel modes. The 19x19 mm 324-FBGA package offers a 1.0 mm ball pitch suitable for high-density multi-layer PCBs.
Designed on a 0.22 µm CMOS process with five layers of metal interconnect, the APEX 20KE delivers high logic density and predictable timing closure via the Quartus II design environment. The LUT-based ESBs allow distributed dual-port RAM, FIFO buffers, and content-addressable memory blocks to be inferred directly from HDL.
Typical applications include telecommunications backplane interfacing, ATM cell processing, high-speed data-path glue logic, and PCI bus bridging. The 60K-gate density makes it suitable for mid-range ASIC prototyping and DSP co-processing front-ends. The 1.8 V VCCINT and 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO rails are typical for the generation.
Design consideration: APEX 20KE devices require proper power-up sequencing (VCCINT before VCCIO, or simultaneous with monotonic ramp) and configuration-via-jtag or EPC configuration device; ensure decoupling with 0.1 µF and 10 µF capacitors within 100 mil of every supply pin. The 324-BGA footprint demands 4-layer or higher PCB stack-up for signal-integrity-preserving escape routing.
This page synthesizes distributor pricing, drop-in compatible variants, and practical design guidance not consolidated in the original datasheet.
Alternatives de remplacement direct pour EP20K60EFC324-1X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K60EFC324-1X (même facteur de forme et même empreinte) — différant par Operating Temperature, Package / Case, Total Gates, Series, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K60EFC324-1
✅ Remplacement direct✓ En stock
$76.5 / unité
Voir la fiche technique →EP20K60EFC324-2X
✅ Remplacement direct✓ En stock
$195.5 / unité
Voir la fiche technique →EP20K60EFC324-2
✅ Remplacement direct✓ En stock
$41.75 / unité
Voir la fiche technique →EP20K60EFC324-1X Valeurs maximales et caractéristiques électriques
| Series | APEX 20KE |
| Family | APEX 20K |
| Number of Logic Elements / Cells | 2,560 |
| Total Gates | 60,000 (162,000 max system gates) |
| Total RAM Bits | 32,768 |
| Number of I/O | 196 |
| Number of LABs / CLBs | 2,560 |
| Number of Embedded System Blocks (ESBs) | 16 |
| Number of PLLs | 4 |
| Voltage - Supply (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) |
| Température de fonctionnement | 0 °C to 85 °C (TJ) |
| Internal Frequency (max) | 250 MHz |
| Propagation Delay | 1.72 ns |
| Process Technology | 0.22 µm CMOS, 5-metal |
| Supplier Device Package | 324-FBGA (19x19 mm, 1.0 mm pitch) |
| Type de montage | Surface Mount |
| Speed Grade | -1 |
| Programming Mode | In-system via JTAG / Passive Serial / Passive Parallel |
Configuration des broches de EP20K60EFC324-1X
| Broche A1 | I/O — General-purpose user I/O (bank 1) |
| Broche B1 | I/O — General-purpose user I/O (bank 1) |
| Broche C1 | VCCIO — I/O supply voltage (1.5/1.8/2.5/3.3 V) |
| Broche D1 | I/O — General-purpose user I/O (bank 2) |
| Broche E1 | I/O — General-purpose user I/O (bank 2) |
| Broche F1 | GND — Ground |
| Broche G1 | I/O — General-purpose user I/O (bank 2) |
| Broche H1 | I/O — General-purpose user I/O (bank 2) |
| Broche J1 | VCCINT — Core supply 1.8 V |
| Broche K1 | I/O — General-purpose user I/O (bank 3) |
| Broche L1 | I/O — General-purpose user I/O (bank 3) |
| Broche M1 | GND — Ground |
| Broche N1 | I/O — General-purpose user I/O (bank 3) |
| Broche P1 | I/O — General-purpose user I/O (bank 3) |
| Broche R1 | VCCIO — I/O supply voltage |
| Broche T1 | I/O — General-purpose user I/O (bank 4) |
| Broche U1 | I/O — General-purpose user I/O (bank 4) |
Applications typiques
EP20K60EFC324-1X convient pour 6 applications: Telecommunications Backplane Interface, ATM Cell Processing / SAR, PCI Bus Bridge / Embedded Controller, ASIC Prototyping & Design Verification, High-Speed Data-Path Glue Logic, Industrial Control / Machine Vision Front-End.
Telecommunications Backplane Interface
The EP20K60EFC324-1X is well suited for telecom backplane bridging thanks to its 196 user I/Os (often configured as LVTTL/LVCMOS pairs at 3.3 V VCCIO) and four PLLs that generate the multiple clock domains required for TDM, T1/E1, and bus-converter interfaces. The 60K-gate density absorbs protocol-conversion state machines, FIFO buffering using ESB-based dual-port RAM (32 Kbits total), and serial-to-parallel framing logic on a single device. Compared with discrete TTL glue logic, the APEX 20KE collapses multi-board designs onto one BGA, saving PCB area. Designers typically pair it with an EPC configuration PROM for autonomous power-up; configure via JTAG for bench development. The 250 MHz internal Fmax supports 8-bit @ 100 MHz bus throughput without timing closure issues.
Recommandé
ATM Cell Processing / SAR
The EP20K60EFC324-1X can implement ATM Segmentation And Reassembly (SAR) functions for OC-3 / 155 Mbps class edge switches. The 16 embedded system blocks (ESBs) deliver up to 32 Kbits of dual-port RAM, sufficient for 8-cell buffering per VC and header translation tables. The LUT-based LEs run state machines at 50–80 MHz, while the PLLs generate 33 MHz cell-clock and 155 MHz serial-rate references. Designers typically instantiate UTOPIA-2 interfaces on the LVCMOS I/Os and an external PHY like the PMC5354 connects on the line side. Compared with ASSP SAR chips, the FPGA approach allows flexible AAL1/AAL2/AAL5 multiplexing and traffic shaping updates in firmware, eliminating ASIC respins.
Recommandé
PCI Bus Bridge / Embedded Controller
The EP20K60EFC324-1X implements a 32-bit / 33 MHz PCI target or master bridge using its 196 I/Os split between the PCI bus (5 V tolerant via PCI I/O standard) and the local side (LVTTL to a host CPU or DSP). The 2,560 LEs fit a typical PCI core plus DMA engine plus custom application logic in a single device. PCI compliance requires the device to drive the bus within the 10 ns Tval window, which the -1 speed grade comfortably meets. Compared with discrete PCI interface chips, the FPGA allows custom register-level extensions, hot-plug state machines, and zero-wait-state burst FIFOs (using ESBs) at lower BOM cost. Software sees a standard PCI header for OS driver compatibility.
Recommandé
ASIC Prototyping & Design Verification
For ASIC prototyping, the EP20K60EFC324-1X offers 60K gates of LUT logic in a 324-FBGA that maps cleanly to mid-range ASIC test chips. Engineers can partition a 30K–50K-gate ASIC into one APEX 20KE device with margin for verification logic, JTAG tap insertion, and internal logic-analyzer IP. The 32 Kbits of embedded RAM model small register files and FIFOs that an ASIC would implement as compiled SRAMs. Compared with ASIC fab cycles, this approach yields working silicon in days rather than months. Quartus II provides timing-driven place-and-route that closely emulates ASIC back-end flows, allowing early STA correlation.
Recommandé
High-Speed Data-Path Glue Logic
The EP20K60EFC324-1X acts as a flexible interconnect fabric between DSPs, network processors, and SRAM banks in legacy telecom and military systems. Its LVCMOS/LVTTL I/Os operate at bus rates up to 100 MHz single-data-rate, sufficient for 32-bit datapath bridges, while the PLLs generate independent read/write clocks for dual-port SRAM interfaces. The 2,560 LEs accommodate address-generation units, byte-lane swap logic, and parity engines without external TTL parts. Compared with discrete 74-series glue, the FPGA eliminates fan-out concerns, simplifies ECOs, and provides in-system reconfigurability for protocol updates. Industrial designers rely on it for prototyping before committing to an ASIC.
Recommandé
Industrial Control / Machine Vision Front-End
The EP20K60EFC324-1X serves as a frame-grabber pre-processor in industrial vision systems, ingesting parallel LVDS camera data (after deserialization) and performing pixel-level pipeline operations such as thresholding, look-up-table gamma correction, and Bayer interpolation. The 196 I/Os handle 16-bit wide pixel buses, sync/blank signals, and the host-side control interface; 32 Kbits of ESB RAM implements line-buffers for 1–2 scanlines of buffering at modest resolution. PLLs synthesize the pixel clock and host bus clock from a single crystal. Compared with dedicated image processors, this FPGA-based approach is programmable per camera type, supports runtime exposure updates, and integrates timing generators in the same device. Designers use Quartus II with vendor IP for Bayer-to-RGB conversion.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K60EFC324-1X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K60EFC324-1 | EP20K60EFC324-2X | EP20K60EFC324-2 | EP20K600EFC672-2X |
|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm) | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 672-FBGA - different package |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Series | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE |
| Logic Elements | 2,560 | 2,560 (same die) | 2,560 (same die) | 2,560 (same die) | 23,040 (600K gates) |
| Total Gates (typical) | 60,000 | 60,000 | 60,000 | 60,000 | 600,000 |
| User I/O | 196 | 196 | 196 | 196 | 488 |
| Speed Grade | -1 | -1 | -2 (faster) | -2 (faster) | -2 |
| VCCINT | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Pin-to-Pin Compatible | Reference | Yes (drop-in) | Yes (drop-in, same 324-FBGA) | Yes (drop-in, same 324-FBGA) | No (different 672-FBGA, PCB redesign required) |
Principaux différenciateurs
- Only speed grade with X-suffix commercial lead finish in 324-FBGA (vs EP20K60EFC324-1 (non-X))
- Slower speed grade (-1) but pin-compatible with -2X (vs EP20K60EFC324-2X)
- Lower logic density (60K) at small BGA size (vs EP20K600EFC672-2X)
Notes de conception
Estimated: VCCINT rail at 1.8 V draws up to ~600 mA under full logic utilization (per typical APEX 20KE datasheet figures); VCCIO at 3.3 V can add 100–300 mA depending on I/O toggle rate and loading. Bulk-decouple each rail with a 22 µF tantalum + 4.7 µF ceramic near the device, plus a 0.1 µF X7R cap within 100 mil of every supply pin. Use a soft-start controller or sequenced regulator to keep ramp monotonic — multi-supply APEX 20KE parts can latch if VCCIO precedes VCCINT.
The 324-FBGA at 1.0 mm pitch requires 4-layer PCB minimum with microvia or sub-0.1 mm laser vias for signal escapes. Provide a continuous ground plane under the BGA for return paths; split power planes (VCCINT, VCCIO banks) per bank and stitch with 0402 decoupling at every BGA quadrant corner. Total plane-to-plane keep-out should not exceed 0.5 mm of trace length before stitching.
Three common pitfalls: (1) omitting the EPC configuration PROM or failing to drive MSEL pins correctly for the chosen configuration mode, (2) leaving JTAG TCK floating (use a 1–10 kΩ pull-down or pull-up to prevent spurious configuration), (3) using 5 V inputs while VCCIO is 3.3 V — the APEX 20KE is NOT 5 V tolerant at 3.3 V VCCIO; use level shifters or set VCCIO to 3.3 V and series-resist inputs. Always check Quartus II pinout assignments against the bank-voltage VCCIO pins before board fab.
Route all clock inputs first with controlled-impedance (50 Ω single-ended to GND) and length-matched to within 50 mil of each other. Use the four PLLs to generate internal clocks rather than distributing high-frequency clocks externally. Keep configuration and JTAG signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) away from switching I/O and add 10 kΩ pull-ups on nCONFIG, nCE, and CONF_DONE per Altera reference designs.
Informations de conformité
RoHS compliance inferred from X-suffix (Pb-free plating) per Altera convention. Reach and conflict-minerals compliance assumed for Altera / Intel FPGA products but specific statements were not in the verified web data. Not AEC-Q100 qualified — APEX 20KE is not an automotive-grade family.
