EP2A40F1020I9 - APEX II FPGA, 1.5M Gates, 1020-BGA | Altera
Référence : EP2A40F1020I9 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2680 | $26 800,00 |
| 100 | $2495 | $249 500,00 |
| 500 | $2300 | $1 150 000,00 |
| 1 000 | $2105 | $2 105 000,00 |
EP2A40F1020I9 Présentation
An FPGA (field-programmable gate array) is a type of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable routing, and I/O cells on a single silicon die. The hierarchy extends: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. FPGAs differ from CPLDs (complex programmable logic devices) in that FPGAs use distributed RAM-based LUTs and richer interconnect fabric, enabling higher logic density at the cost of volatile configuration storage (typically SRAM-based, requiring external boot PROM). APEX II devices specifically add embedded system blocks (ESBs) and support for high-speed differential I/O standards, positioning the family for ASIC-prototyping, telecom line-card, and DSP-front-end applications.
Key features of the EP2A40F1020I9 include 1.5M system gates, 38,400 logic cells, embedded system blocks for distributed memory and FIFO operation, multi-level high-speed interconnect with up to 366 MHz internal performance, support for multiple I/O standards including LVDS, PCI, and GTL+, and in-system programmability through an IEEE 1149.1 JTAG interface or passive serial/parallel configuration modes. The 1020-pin FC-FBGA package delivers high pin count for wide parallel interfaces and dense memory buses.
The APEX II architecture combines a four-input LUT-based logic element with embedded system blocks, allowing each ESB to be configured as dual-port RAM, single-port RAM, ROM, or FIFO with up to 4 Kbits per block. The interconnect hierarchy uses DirectDrive technology for predictable timing closure across the full device.
Typical applications include ASIC prototyping and emulation, high-speed telecommunications line cards with multi-channel SERDES interfaces, DSP co-processing front-ends for software-defined radio, complex state machines for industrial automation, and high-density glue-logic replacement. The industrial temperature grade extends the device's reach into outdoor telecom, military, and aerospace platforms.
When designing with this device, plan for an external configuration PROM (such as an EPC2 or EPC16) because APEX II SRAM-based FPGAs lose their bitstream on power-down. Decoupling must follow Altera's AN 74 application-note guidelines for 1020-pin FC-FBGA layouts, with bulk and high-frequency ceramic capacitors placed within 100 mils of every power pin.
This page synthesizes distributor pricing, drop-in same-brand alternatives from the APEX II family, and practical design notes that augment the manufacturer's datasheet and Pin Information tables.
Alternatives de remplacement direct pour EP2A40F1020I9 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40F1020I9 (même facteur de forme et même empreinte) — différant par Package, Process Technology, System Gates, Operating Temperature, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40F1020I8N
✅ Remplacement direct✓ En stock
$125.4 / unité
Voir la fiche technique →EP2A40F1020I8
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP2A40F1020I7N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP2A40F1020I7
✅ Remplacement direct✓ En stock
$110 / unité
Voir la fiche technique →EP2A40F1020C9N
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP2A40F1020C9
✅ Remplacement direct✓ En stock
$160 / unité
Voir la fiche technique →EP2A40F1020C8N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2A40F1020I9 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Series | EP2A |
| System Gates | 1.5 M |
| Logic Cells | 38,400 |
| Maximum Operating Frequency | 366 MHz |
| Process Technology | 0.15 µm |
| Core Voltage | 1.5 V |
| Boîtier | 1020-pin FC-FBGA |
| Nombre de broches | 1020 |
| Temperature Grade | Industrial (I9) |
| Logic Element Type | 4-input LUT |
| Embedded Memory | ESBs (dual-port RAM / ROM / FIFO) |
| Configuration Method | JTAG / passive serial / passive parallel |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de EP2A40F1020I9
| Broche A1 | I/O — User I/O - bank assignment per datasheet ball map |
| Broche B1 | I/O — User I/O - bank assignment per datasheet ball map |
| Broche A2 | I/O — User I/O - bank assignment per datasheet ball map |
| Broche B2 | I/O — User I/O - bank assignment per datasheet ball map |
| Broche A3 | VCCINT — 1.5 V core supply |
| Broche B3 | VCCIO1 — I/O bank 1 reference voltage |
| Broche A4 | I/O — User I/O - bank 1 |
| Broche B4 | I/O — User I/O - bank 1 |
| Broche GND1 | GND — Ground reference for bank 1 |
| Broche TCK | TCK — JTAG test clock input |
| Broche TMS | TMS — JTAG test mode select |
| Broche TDI | TDI — JTAG test data input |
| Broche TDO | TDO — JTAG test data output |
| Broche nCONFIG | nCONFIG — Configuration control (active-low) |
| Broche nSTATUS | nSTATUS — Configuration status (active-low) |
| Broche DCLK | DCLK — Configuration clock input |
| Broche DATA0 | DATA0 — Configuration data input (LSB) |
| Broche MSEL0 | MSEL0 — Configuration mode select bit 0 |
| Broche MSEL1 | MSEL1 — Configuration mode select bit 1 |
| Broche VCCPD | VCCPD — Pre-driver I/O supply |
Applications typiques
EP2A40F1020I9 convient pour 6 applications: ASIC Prototyping and Emulation, Telecommunications Line-Card Glue Logic, Software-Defined Radio (SDR) Front-End, Industrial Automation and Motion Control, High-Density Glue Logic Replacement, Medical Imaging Pre-Processing Pipeline.
ASIC Prototyping and Emulation
The EP2A40F1020I9's 1.5M system gates and 38,400 logic cells provide sufficient capacity to prototype multi-million-gate ASIC designs before mask production. The 1020-pin FC-FBGA package exposes hundreds of user I/O pins, allowing direct mapping of ASIC boundary-scan chains, DDR memory interfaces, and multi-bus glue logic. APEX II's ESBs deliver up to 4 Kbits of dual-port RAM per block, enabling engineers to model realistic memory hierarchies without external SRAM. Industrial temperature grade (I9, -40 °C to +100 °C) lets prototype boards run in accelerated-stress chambers and field environments. Designers benefit from Quartus II development flow with full timing-driven place-and-route, plus JTAG-based readback for verifying internal node states during ASIC bring-up.
Recommandé
Telecommunications Line-Card Glue Logic
Telecom line cards require dense, deterministic glue logic to bridge framers, SERDES devices, network processors, and backplane transceivers. The EP2A40F1020I9's 366 MHz internal performance and multi-bank I/O structure allow simultaneous support for LVDS backplane links, PCI bus bridges, and GTL+ memory interfaces. APEX II's embedded system blocks (ESBs) implement deep FIFOs and look-up-table-based CAMs that replace discrete FIFO chips, saving board area. Industrial temperature grade ensures reliable operation in outdoor cabinet and central-office environments. Designers can integrate framing, encapsulation, and traffic-management functions that previously required an ASIC, accelerating time-to-market for new line-card revisions.
Recommandé
Software-Defined Radio (SDR) Front-End
Software-defined radio designs demand high-speed DSP pipelines that operate on wide bus widths and require deterministic latency. The EP2A40F1020I9's 38,400 logic cells and 366 MHz fabric can implement multi-channel FIR filters, digital down-converters, and FFT engines alongside the host DSP. APEX II ESBs configured as dual-port RAM hold rotating coefficient tables and sample buffers. LVDS-capable I/O banks interface directly to high-speed ADCs and DACs, while the 1020-pin FC-FBGA package supplies the wide buses SDR designs require. Industrial temperature grade supports tactical and outdoor-deployed SDR platforms, including military radio and public-safety communications.
Recommandé
Industrial Automation and Motion Control
Industrial automation systems require deterministic state machines, encoder interfaces, and multi-axis motion controllers that operate reliably across wide temperature ranges. The EP2A40F1020I9's industrial temperature grade (-40 °C to +100 °C) and high gate count allow integration of PLC-style logic, quadrature-decoder blocks, and PWM generators on a single FPGA. APEX II's ESBs implement parameter tables for servo-loop tuning, while the 1020-pin FC-FBGA package provides sufficient I/O for multi-axis encoder fan-in. PCI and LVDS I/O standards interface to industrial PCs and EtherCAT-style fieldbus controllers. The 1.5V core minimizes on-board power dissipation in enclosed cabinets.
Recommandé
High-Density Glue Logic Replacement
When a board design outgrows discrete 74-series logic and small CPLDs, the EP2A40F1020I9 provides a single-chip consolidation platform. Its 38,400 logic cells can replace dozens of PAL/GAL devices while adding multi-bank LVDS/PCI/GTL+ interface compatibility. APEX II ESBs implement on-chip FIFOs and lookup tables that previously required dedicated bridge chips. The 1020-pin FC-FBGA package supports wide parallel buses (32/64-bit) without bus multiplexing. Industrial temperature grade extends the device's reach into military/aerospace and outdoor embedded systems where commercial-grade parts would fail.
Recommandé
Medical Imaging Pre-Processing Pipeline
Ultrasound, CT, and MRI front-end boards use FPGAs to pre-process high-bandwidth analog signals before they reach the host processor. The EP2A40F1020I9's 366 MHz fabric and dual-port ESB memory implement beamforming, image reconstruction kernels, and data-acquisition pipelines operating in real time. LVDS I/O banks interface directly to high-channel-count ADCs while the 1020-pin FC-FBGA package exposes enough I/O for 64-bit parallel data paths. Industrial temperature grade supports portable and bedside imaging equipment. Designers can update diagnostic algorithms by reloading the SRAM bitstream, enabling field-upgradeable medical devices without board rework.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40F1020I9 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40F1020I8N | EP2A40F1020I8 | EP2A40F1020I7N | EP2A40F1020C9N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-pin FC-FBGA | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| System Gates | 1.5 M | 1.5 M - same | 1.5 M - same | 1.5 M - same | 1.5 M - same |
| Logic Cells | 38,400 | 38,400 - same | 38,400 - same | 38,400 - same | 38,400 - same |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| Speed/Temperature Grade | I9 (industrial, fastest) | I8 (industrial, slightly slower) | I8 (industrial, slightly slower) | I7 (industrial, slower) | C9 (commercial 0-85 °C, fastest) |
| Lifecycle Status | Obsolete (EOL by Altera/Intel) | Obsolete - same | Obsolete - same | Obsolete - same | Obsolete - same |
Principaux différenciateurs
- Fastest speed grade in the APEX II EP2A40 1020-FBGA family (vs EP2A40F1020I8N)
- Industrial temperature grade extends deployment envelope (vs EP2A40F1020C9N)
- Highest pin count in the APEX II family for wide-bus designs (vs EP2A40B724I9)
- Compatible with legacy Quartus II and SOPC Builder tool flows (vs Cyclone V (modern Altera/Intel device))
Notes de conception
APEX II EP2A40 devices require three independent rails: VCCINT (1.5 V core), VCCIO (per-bank I/O voltage, typically 2.5 V/3.3 V), and VCCPD (pre-driver supply). Designers should follow Altera's AN 74 application note for decoupling - use 0.1 µF ceramic capacitors within 100 mils of every power pin and 10-47 µF bulk tantalum or polymer caps per rail. Power-on sequencing should ensure VCCINT rises before VCCPD to avoid latch-up. Estimated: total quiescent current for an EP2A40 at 366 MHz is approximately 1.5-2 A on VCCINT and 0.5 A on VCCIO, depending on I/O utilization.
The 1020-pin FC-FBGA package has a 1.0 mm ball pitch with flip-chip die attach. PCB design must use microvia (laser-drilled) stack-ups, with at least 4-6 routing layers between BGA and outer planes. BGA escape routing on the top layer uses 4 mil traces/spacing. Match all differential pairs to 100 Ω differential impedance for LVDS. Use Altera's reference-symbol library to ensure the PCB footprint (including solder-mask-defined vs non-solder-mask-defined pads) matches the flip-chip ball metallurgy.
Because the EP2A40F1020I9 is SRAM-volatile, omitting the boot PROM or mis-programming the MSEL[1:0] configuration-mode pins results in a 'dead' board at first power-up. Always verify MSEL strapping before PCB fab. Additionally, do not apply I/O voltages (VCCIO) before VCCINT is stable - the device can source excessive current into undriven I/O buffers. For unused I/O pins, set them to inputs with weak pull-ups in the Quartus II pin planner to avoid floating-input oscillations.
Estimated: at 366 MHz with 100% logic utilization, the EP2A40F1020I9 dissipates approximately 4-6 W. The 1020-pin FC-FBGA has a θJA of approximately 8-12 °C/W with a 1 oz copper 4-layer board and adequate airflow. The I9 industrial grade allows junction temperatures up to 100 °C, so worst-case ambient must remain below ~85 °C for continuous operation. Add thermal vias under the BGA thermal pad and consider a heatsink for fully utilized industrial designs.
LVDS and GTL+ signals on the EP2A40F1020I9 require controlled-impedance routing with matched trace lengths within the bank's tolerance (typically ±10 mil for clock pairs, ±25 mil for data pairs). Use the IBIS model from Altera's website for pre-layout signal-integrity simulation. Series-termination resistors (33-68 Ω) are recommended on critical clocks and high-speed single-ended I/O to dampen reflections on long backplane traces.
Informations de conformité
APEX II family predates RoHS transitions; confirm compliance via manufacturer's material declaration or broker certification for each lot. Industrial temperature grade (I9) is NOT AEC-Q100 qualified.