EP2A40F1020I9N - APEX II 1.5M Gates FPGA | Intel (Altera) | BGA-1020
Référence : EP2A40F1020I9N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $245 | $2 450,00 |
| 100 | $210 | $21 000,00 |
| 500 | $185 | $92 500,00 |
| 1 000 | $165 | $165 000,00 |
EP2A40F1020I9N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic IC belonging to the broader category of programmable logic devices (PLDs). Within the taxonomy it sits under: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. APEX II devices combine look-up table (LUT)-based logic elements, embedded system blocks (ESBs) for memory and dedicated arithmetic, and a high-speed interconnect, enabling single-chip implementations of complex datapaths, bus interfaces, and DSP functions that previously required multiple ASICs or discrete logic.
Key features of the EP2A40F1020I9N include 735 bidirectional I/O lines, support for multiple I/O standards including 1 Gbps True-LVDS, LVPECL, pseudo-current mode logic (PCML), and HyperTransport signaling, plus on-chip memory and PLL-based clock management. The embedded system blocks provide True-Dual-Port RAM, single-port RAM, ROM, and CAM (Content-Addressable Memory) at densities up to 491,520 RAM bits depending on configuration.
Typical applications include high-speed telecom and datacom line cards, multi-protocol bridge/router designs, DSP co-processing front-ends, video/image processing pipelines, and ASIC prototyping. The 1 Gbps serial I/O capability makes it well suited for backplane and chip-to-chip interconnect in switch fabrics and serializer/deserializer (SERDES) companion designs, while the large logic capacity supports wide datapath implementations such as Forward Error Correction (FEC) engines.
Designers should plan thermal management carefully because the FC-FBGA package requires a heatsink or forced-air cooling at sustained high toggle rates; signal-integrity work on 735 user I/Os is also mandatory. Configuration is performed via Altera/Intel serial (Passive Serial) or parallel (Passive Parallel Asynchronous / Synchronous) modes using an EPC configuration device or a microprocessor, with JTAG (IEEE 1149.1) available for boundary-scan and in-system programming.
This page synthesizes distributor pricing, drop-in APEX II family alternatives, and practical design notes that go beyond the manufacturer datasheet to accelerate your evaluation and BOM decisions.
Alternatives de remplacement direct pour EP2A40F1020I9N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40F1020I9N (même facteur de forme et même empreinte) — différant par Package, System Gates, Process Technology, Operating Temperature, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40F1020I8N
✅ Remplacement direct✓ En stock
$125.4 / unité
Voir la fiche technique →EP2A40F1020I7N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP2A40F1020C9N
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP2A40F1020C8N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2A40F1020C7N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP2A40F1020I9N Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Device Logic Elements / Cells | 38,400 cells |
| System Gates | 1,500,000 (1.5 M) |
| Maximum Operating Frequency | 366 MHz |
| Process Technology | 0.15 um CMOS, up to 8 metal layers |
| Core Supply Voltage | 1.5 V |
| User I/O Count | 735 bidirectional I/O |
| Boîtier | 1020-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Operating Temperature Grade | Industrial (I9 suffix: -40C to +100C per Altera APEX II convention) |
| High-Speed I/O Standards | True-LVDS (up to 1 Gbps), LVPECL, PCML, HyperTransport |
| Configuration Modes | Passive Serial, Passive Parallel Asynchronous/Synchronous, JTAG |
| Type de montage | Surface Mount (BGA) |
| Statut du cycle de vie | Obsolete (per distributor listings / Altera APEX II family EOL) |
Guide de configuration des broches du EP2A40F1020I9N 1020-pin fc-fbga (flip-chip fineline bga)
Configuration des broches du EP2A40F1020I9N (boîtier 1020-pin fc-fbga (flip-chip fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40F1020I9N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40F1020I9N convient pour 6 applications: Telecom Line Card / Multi-Protocol Router, DSP Co-Processor / FEC Engine, ASIC Prototyping and Emulation, High-Speed Serial Backplane Bridge, Video and Image Processing Pipeline, Industrial Control and Test Instrumentation.
Telecom Line Card / Multi-Protocol Router
The EP2A40F1020I9N's 1.5M system gates and 735 user I/Os make it ideal for high-density telecom line cards that must terminate T1/E1, T3/E3, and Ethernet traffic simultaneously. Its embedded system blocks (ESBs) provide True-Dual-Port RAM at line rate, while the dedicated 1 Gbps True-LVDS channels handle chip-to-chip links to SERDES framer ICs. Placed on the line-interface card as the central packet processor, it integrates routing tables, QoS queues, and traffic shaping logic that previously required multiple ASICs, and it dissipates roughly 4-6 W at full utilization requiring a heatsink.
Recommandé
DSP Co-Processor / FEC Engine
The APEX II Embedded System Blocks and 366 MHz internal clock frequency enable the EP2A40F1020I9N to act as a Forward Error Correction (FEC) engine or DSP co-processor alongside a host ASIC or DSP. Its 38,400 logic cells implement Reed-Solomon, Viterbi, or Turbo decoder datapaths while ESB-based dual-port RAM serves as the sliding-window buffer. Used between the framer and the host processor, the device delivers line-rate FEC for OC-192/STM-64 links and integrates directly with the 1 Gbps True-LVDS fabric without an external bus bridge.
Recommandé
ASIC Prototyping and Emulation
With 1.5M system gates, 735 user I/Os, and JTAG-based in-system reconfiguration, the EP2A40F1020I9N is widely used as an ASIC prototyping and pre-silicon emulation platform. Its density is sufficient to map mid-complexity ASICs (gate-array to standard-cell designs of 500K-1M usable gates) at near-real-time clock speeds, exposing design bugs months before silicon is available. The device plugs into a logic-analyzer header, runs at 200-300 MHz under typical emulation loads, and supports multi-FPGA partitioning via its high-speed LVDS channels.
Recommandé
High-Speed Serial Backplane Bridge
The EP2A40F1020I9N's 1 Gbps True-LVDS, LVPECL, and HyperTransport I/O support allow it to bridge legacy parallel buses to high-speed serial backplanes used in ATCA, MicroTCA, and proprietary switch-fabric backplanes. Its ESBs implement the elastic store and clock-domain crossing required for asynchronous serial links, while the high pin count accommodates dozens of parallel LVCMOS data lines plus dedicated serial channels. Placed at each slot's mezzanine connector, the device aggregates up to 16-32 parallel lanes into 4-8 serial links at 1 Gbps each.
Recommandé
Video and Image Processing Pipeline
With 38,400 logic cells and True-Dual-Port RAM in ESBs, the EP2A40F1020I9N implements real-time video processing pipelines including deinterlacing, scaling, color-space conversion, and MPEG-2/H.264 pre-processing. Its 735 I/Os directly drive video DACs, ADCs, and encoder chips without external bus muxing, and the 366 MHz fabric clock keeps pace with 1080p60 pixel rates (~148.5 MHz pixel clock) while leaving timing margin. The device typically dissipates 5-8 W during 1080p processing and requires a heatsink plus 200 LFM airflow.
Recommandé
Industrial Control and Test Instrumentation
The industrial temperature grade (I9 suffix, -40C to +100C) and dense I/O of the EP2A40F1020I9N make it suitable for industrial controllers, automated test equipment (ATE), and protocol analyzers. It implements custom test pattern generators, parallel bus protocol decoders (PCI, VME, RapidIO), and timing-critical state machines in a single chip, replacing racks of discrete logic. The FC-FBGA-1020 package withstands industrial shock and vibration when properly socketed or soldered to a 4-layer FR4 board with adequate ground stitching.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40F1020I9N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40F1020I8N | EP2A40F1020I7N | EP2A40F1020C9N | EP2A40F1020C8N | EP2A40F1020C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-FBGA-1020 | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| Speed Grade | I9 (fastest industrial) | I8 | I7 | C9 (commercial) | C8 (commercial) | C7 (commercial) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial | Commercial |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| User I/O Count | 735 | 735 | 735 | 735 | 735 | 735 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Fastest APEX II industrial speed grade (vs EP2A40F1020I8N)
- Industrial temperature range -40C to +100C (vs EP2A40F1020C9N)
- Largest density in the APEX II family (vs EP2A25F672I9N)
Notes de conception
Estimated: At typical toggle rates of 60-80% and 1.5 V core, the EP2A40F1020I9N dissipates roughly 4-8 W in a FC-FBGA-1020 package. The flip-chip BGA exposes the die directly to the PCB, so thermal management relies on a heatsink mounted to the lid (or direct-attached cold plate) plus thermal vias under the central power/ground ball array. Without 200 LFM airflow and a 1 square inch copper pour under the die, junction temperature can exceed 100C and trigger thermal protection shutdown.
The 1020-ball FC-FBGA uses a 1.0 mm ball pitch with staggered rows. Design the PCB with microvia-in-pad or stacked-via construction to route signals out from inner rows; trace escape uses 4-5 mil traces and 4-5 mil spacing. Provide a continuous ground plane on layer 2 stitched with the BGA ground balls via 8-mil stitching vias placed on a 200-mil grid to control return paths for the 1 Gbps True-LVDS channels.
Configure the EP2A40F1020I9N's 1 Gbps True-LVDS channels with 100-ohm differential impedance on the PCB (stripline or microstrip), matched-length within 5 mils for the P and N traces, and AC-coupling capacitors in the 100 nF range near the transmit side. Use IBIS-AMI simulation with the Altera-provided APEX II IBIS models to validate eye mask margins before committing to the layout; HyperTransport links require additional emphasis and pre-emphasis tuning via the configuration bitstream.
Do not confuse APEX II (EP2A prefix) with APEX 20K (EP20K prefix) - they are different families with different configuration bitstream formats, JTAG IDs, and silicon architectures, so the wrong EPC configuration device or Quartus project will fail to configure. The I9 temperature grade applies to Altera's industrial range; double-check that the application actually requires -40C operation before paying the industrial premium. Finally, configuration time for a 1.5 M-gate bitstream approaches 200 ms in Passive Serial mode, so budget system startup time accordingly.
The EP2A40F1020I9N requires a 1.5 V core supply with a peak transient of 3-4 A during configuration, plus 3.3 V for I/O banks and an auxiliary VCC_PLL supply for the PLLs. Decouple each power pin with a 0.1 uF X7R ceramic placed within 100 mils, plus a 10 uF bulk capacitor per bank. Use a star-ground layout to keep analog PLL ground return paths isolated from noisy digital return paths; the APEX II datasheet recommends an isolated PLL ground island connected to the main ground at a single point.
Informations de conformité
Compliance data not present in the verified web results - the APEX II family pre-dates widespread RoHS reporting on Altera datasheets. Lead-free status is unknown; assume legacy SnPb BGA balls unless the specific variant suffix indicates Pb-free.
