EP2AGX125EF29C4G - Arria II GX FPGA 118K LE 780-FBGA | Intel
Référence : EP2AGX125EF29C4G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1450 | $1 450,00 |
| 10 | $1380 | $13 800,00 |
| 100 | $1280 | $128 000,00 |
| 500 | $1190 | $595 000,00 |
| 1 000 | $1100 | $1 100 000,00 |
EP2AGX125EF29C4G Présentation
What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose logic fabric, routing, and I/O cells are configured by the customer after manufacture, allowing custom digital hardware to be implemented without an ASIC tape-out. FPGAs sit within the broader taxonomy of programmable logic (PAL, CPLD, FPGA) and are widely used to accelerate parallel processing, high-speed serial interfaces, and DSP functions. The Arria II GX family specifically targets mid-range applications requiring integrated transceivers, embedded memory, and DSP blocks.
Key features of the EP2AGX125EF29C4G include 8 high-speed transceivers with PMA, PCS, and hard PCIe/Serial RapidIO/GIGE IP cores, dedicated DSP blocks for high-throughput multiplication, and a rich clock network with PLLs. The 'C4' speed grade balances Fmax and power for cost-sensitive designs, while the 'G' suffix indicates Pb-free / RoHS-compliant lead finish.
The 40 nm process and the integrated transceiver hard IP enable low-latency serial I/O, deterministic timing closure, and reduced BOM cost relative to two-chip implementations. Designers benefit from the Quartus II design suite, a mature toolchain supporting Verilog, VHDL, and SystemVerilog with extensive IP libraries.
Typical applications include PCIe Gen1/Gen2 endpoint cards, telecom backplanes with Serial RapidIO, broadcast video processing, wireless baseband pre-processing, and industrial imaging. The combination of 8.3 Mbits of RAM, DSP blocks, and high-speed transceivers makes the part well-suited to data-pipeline designs that need both parallel processing and serial connectivity.
When designing with this device, pay close attention to PCB layout for the MGTP/GTX transceiver channels - controlled-impedance differential routing and tight return-path stitching are critical for 5+ Gbps signaling. Use IBIS-AMI models and Quartus transceiver toolkits during pre-layout simulation. The 780-ball FBGA requires a 1.0 mm or finer pitch PCB and high-density interconnect.
This page synthesizes distributor inventory, drop-in alternatives, and practical design notes for EP2AGX125EF29C4G not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP2AGX125EF29C4G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGX125EF29C4G (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Family, Total RAM Bits, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGX125EF29C5G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1090 / unité
Voir la fiche technique →EP2AGX125EF29C6G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1495 / unité
Voir la fiche technique →EP2AGX125EF29I5G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$861.62 / unité
Voir la fiche technique →EP2AGX125DF25C4G
✅ Remplacement direct✓ En stock
$399.95 / unité
Voir la fiche technique →EP2AGX125DF25C5G
✅ Remplacement direct✓ En stock
$399.5 / unité
Voir la fiche technique →EP2AGX125DF25C6G
✅ Remplacement direct✓ En stock
$1295 / unité
Voir la fiche technique →EP2AGX125EF29C4G Valeurs maximales et caractéristiques électriques
| Family | Arria II GX |
| Logic Elements | 118,143 |
| Number of LABs/CLBs | 4,964 |
| Total RAM Bits | 8,315,904 |
| Number of I/O | 372 |
| Number of Transceivers | 8 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Voltage - Supply | 0.9 V (core) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Boîtier / Format | 780-BBGA, FCBGA (29x29 mm, 1.0 mm pitch) |
| Speed Grade | C4 |
| Process Technology | 40 nm |
| Maximum Operating Frequency | 500 MHz |
| Statut RoHS | Compliant (G suffix = Pb-free) |
Guide de configuration des broches du EP2AGX125EF29C4G 780-bbga, fcbga (29x29 mm, 1.0 mm pitch)
Configuration des broches du EP2AGX125EF29C4G (boîtier 780-bbga, fcbga (29x29 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGX125EF29C4G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGX125EF29C4G convient pour 6 applications: PCI Express Gen2 Endpoint Card, Serial RapidIO Backplane Aggregation, Broadcast Video Processing and Routing, Wireless Baseband Pre-Processing, Industrial Imaging and Machine Vision, Test & Measurement Instrumentation.
PCI Express Gen2 Endpoint Card
The EP2AGX125EF29C4G's hard PCIe Gen1/Gen2 IP cores integrated with 8 multi-gigabit transceivers up to 6.375 Gbps make it a natural fit for PCIe x1/x4/x8 endpoint cards. Designers instantiate the Altera PCIe Compiler in Quartus II, leverage the 8.3 Mbits of on-chip RAM for descriptor and payload buffering, and use the 372 user I/Os to interface to host-side logic. Power consumption at full PCIe Gen2 link utilization is typically 5-8 W, manageable with the 780-FBGA's thermal pad. The hard PCS/PMA blocks eliminate the FPGA soft-IP overhead that competing 28 nm FPGAs require, simplifying timing closure.
Recommandé
Serial RapidIO Backplane Aggregation
Serial RapidIO (SRIO) in telecom and defense backplanes often runs at 3.125 or 5 Gbps per lane, exactly within the EP2AGX125EF29C4G's 6.375 Gbps transceiver envelope. The 8 transceivers can be grouped for 1x, 2x, or 4x SRIO ports, with the FPGA fabric handling packet assembly, routing, and congestion management. The 118K logic elements comfortably accommodate 4x SRIO aggregation plus a RapidIO endpoint stack in VHDL/Verilog. Industrial customers often migrate to the -I4G temperature variant for outdoor installations.
Recommandé
Broadcast Video Processing and Routing
The combination of 240 DSP blocks (18x18 multipliers), 8.3 Mbits embedded RAM, and 8 transceivers up to 6.375 Gbps enables broadcast video routers to handle SDI, HD-SDI, 3G-SDI, and even early-stage 4K signal processing. The EP2AGX125EF29C4G is widely used in mid-range video switchers and format converters where multiple SDI streams are de/embedded, color-space converted, and re-clocked. The FPGA fabric allows custom deinterlacing and scaling IP that ASICs cannot match in flexibility. The 780-FBGA's 1.0 mm pitch keeps the PCB compact, and 372 user I/Os provide ample GPIO for control.
Recommandé
Wireless Baseband Pre-Processing
In wireless base stations and small cells, the EP2AGX125EF29C4G handles the digital front-end tasks between the RF transceiver and the baseband processor: crest factor reduction, digital predistortion, channel filtering, and beamforming weight calculation. The 240 DSP blocks accelerate FIR filtering and FFT operations, while the 8 transceivers interface to CPRI/OBSAI links to the baseband card. Commercial temperature (0C to +85C) is suitable for indoor equipment; for outdoor RRH, the -I4G industrial variant is mandatory.
Recommandé
Industrial Imaging and Machine Vision
High-speed line-scan and area-scan cameras often use the EP2AGX125EF29C4G to aggregate multiple Camera Link, CoaXPress, or GigE Vision streams at rates up to 6.375 Gbps per lane. The FPGA performs real-time image preprocessing - defect detection, exposure correction, and color interpolation - before forwarding the processed pixel data via the transceiver-based output link. The 8.3 Mbits of embedded RAM serves as line buffers, and the 118K logic elements implement Bayer demosaicing and LUT transformations. Industrial PCs host the FPGA-based frame grabber over PCIe.
Recommandé
Test & Measurement Instrumentation
The EP2AGX125EF29C4G is commonly used in high-speed protocol analyzers, BERT (bit-error-rate) testers, and protocol exercisers for protocols like PCIe, SATA, USB 3.0, and 10G Ethernet. The 8 transceivers can simultaneously drive and receive multiple lanes for link training and compliance testing. The 118K logic elements implement pattern generators, error counters, and protocol state machines, while the 8.3 Mbits of RAM store captured traffic for post-processing. Designers appreciate the Quartus II SignalTap logic analyzer for real-time debug visibility.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGX125EF29C4G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGX125EF29C5G | EP2AGX125EF29C6G | EP2AGX125EF29I5G | EP2AGX125DF25C4G | EP2AGX125DF25C5G | EP2AGX125DF25C6G |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (EF29, 1.0 mm pitch) | 780-FBGA (EF29, 1.0 mm pitch) - same | 780-FBGA (EF29, 1.0 mm pitch) - same | 780-FBGA (EF29, 1.0 mm pitch) - same | 484-FBGA (DF25) - different | 484-FBGA (DF25) - different | 484-FBGA (DF25) - different |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 118,143 | 118,143 (same) | 118,143 (same) | 118,143 (same) | 118,143 (same) | 118,143 (same) | 118,143 (same) |
| Number of Transceivers | 8 (up to 6.375 Gbps) | 8 (6.375 Gbps) - same | 8 (6.375 Gbps) - same | 8 (6.375 Gbps) - same | 4 (3.75 Gbps) - -50% | 4 (3.75 Gbps) - -50% | 4 (3.75 Gbps) - -50% |
| User I/O | 372 | 372 - same | 372 - same | 372 - same | 252 - -32% | 252 - -32% | 252 - -32% |
| Speed Grade | C4 | C5 - faster | C6 - fastest | C5 (industrial) | C4 - same | C5 - faster | C6 - fastest |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Total RAM Bits | 8,315,904 | 8,315,904 - same | 8,315,904 - same | 8,315,904 - same | 8,315,904 - same | 8,315,904 - same | 8,315,904 - same |
Principaux différenciateurs
- Highest transceiver count in the 125K-LE Arria II GX family (vs EP2AGX125DF25C4G)
- High-density FBGA with maximum user I/Os (vs EP2AGX125DF25C4G)
- Hard IP for PCIe Gen1/Gen2, Serial RapidIO, and GIGE (vs Xilinx XC7A100T-2FGG676I)
Notes de conception
The 780-ball FineLine FBGA at 1.0 mm pitch requires high-density PCB manufacturing: laser-drilled microvias, HDI stackup, and ENIG or immersion silver surface finish. Use the manufacturer-supplied land pattern and follow Altera's high-speed BGA layout guidelines. The exposed die-attach pad must be soldered to the board thermal pad and connected to a low-impedance ground plane with a thermal via array (typically 5x5 to 7x7 vias under the BGA). Decoupling capacitor placement: 0402 0.1uF ceramics on every VCC/GND pair within 5 mm of the BGA balls; bulk 10uF X7R at the BGA periphery.
Transceiver channel layout is the single most critical aspect of an Arria II GX board. MGTP/CMU pairs must be routed as 100-ohm differential pairs with controlled skew (less than 5 ps mismatch per pair), and the return-path ground stitching vias must be placed at every 200-300 mil along the route. Loss-budget calculation: at 6.375 Gbps, channel loss must be under -8 dB at 3.125 GHz Nyquist. Use Megtron-6 or equivalent low-loss PCB material if the trace length exceeds 6 inches. The Altera Transceiver Toolkit within Quartus II performs pre-emphasis and equalization tuning.
Power-supply design for Arria II GX: the 0.9 V core draws up to 8 A under typical load, requiring a high-current POL regulator (LTC3775, ISL8225M class). Sequencing is critical: 3.3 V VCCIO must come up before or simultaneously with 0.9 V VCC; 1.1 V VCCPD must be within 200 mV of VCC. Smart-Fuse programming current is approximately 300 mA peak. Decoupling: 200-500 uF bulk capacitance on each rail near the BGA, plus 22-100 uF intermediate caps. Use 4-layer minimum PCB stackup with dedicated power planes; 6+ layers recommended for high-density designs.
Common pitfalls when designing with the EP2AGX125EF29C4G: (1) Forgetting the configuration mode pins MSEL[2:0] - they must be tied high/low per the datasheet to select the configuration mode (AS, PS, JTAG, FPP); (2) Ignoring nCONFIG and nSTATUS open-drain behavior - both need external 10k pull-ups to 3.3 V; (3) Designing JTAG chain without considering TMS/TCK/TCK_BUF routing - Altera recommends a dedicated JTAG buffer for chains over 4 inches; (4) Using GPIO banks for 1.5 V I/O standards without verifying VCCIO bank voltage - the 8 I/O banks each have independent VCCIO rails.
Informations de conformité
RoHS-compliant per 'G' suffix in MPN. Not AEC-Q100 qualified - this is a commercial-grade FPGA. For automotive applications, consult the Arria II GX automotive-grade variant or the Cyclone V GT/IV family. Halogen-free status not explicitly confirmed in available data.
