EP2AGX95EF29C4N - Arria II GX FPGA 89K LE 780-FBGA | Intel
Référence : EP2AGX95EF29C4N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1006.84 | $1 006,84 |
| 10 | $970 | $9 700,00 |
| 100 | $920 | $92 000,00 |
| 250 | $890 | $222 500,00 |
| 500 | $855 | $427 500,00 |
EP2AGX95EF29C4N Présentation
A Field Programmable Gate Array (FPGA) is a programmable semiconductor that implements custom digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and high-speed transceivers, all wired by programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices -> programmable logic -> integrated circuits -> semiconductors, and are positioned above fixed-function ASICs in flexibility but below microcontrollers in ease of use, making them the workhorse for hardware-accelerated signal processing, protocol bridging, and prototype-to-production design.
Key features include 8 transceivers at up to 6.375 Gbps, 4 PCI Express hard IP blocks (x1/x4/x8), dedicated DSP blocks for fixed- and floating-point math, and an active serial configuration interface. The 780-FBGA package exposes 372 user I/O pins through 12 I/O banks supporting DDR3, LVDS, and other common interface standards, while 4 PLLs and 28 global clocks provide flexible timing closure for multi-clock domain designs.
The Arria II GX architecture pairs a register-rich logic fabric with hard IP for memory controllers and PCI Express, eliminating soft logic overhead and reducing compile time. Transceivers are grouped into banks with dedicated clock-data-recovery circuitry, allowing the device to interface directly to SFP+, SATA, or backplane SERDES without external PHY ICs in many designs.
Typical applications include high-speed serial protocol bridges (PCI Express Gen1/Gen2 endpoints, SFP+ to ASIC bridges), wireless baseband signal processing, video broadcast and image processing pipelines, and military/aerospace secure communications. The mid-range density targets designs that are too large for CPLDs but do not require the largest Stratix-class devices.
When designing with the EP2AGX95EF29C4N, plan power rail sequencing between 0.9 V core and 1.1/1.5/2.5/3.3 V I/O supplies carefully, and provide a stable reference clock to the transceiver reference inputs to minimize jitter. Use the Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with cross-reference guidance not always available from Intel directly.
Alternatives de remplacement direct pour EP2AGX95EF29C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGX95EF29C4N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Transceivers, Operating Temperature, Number of Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGX95EF29C4G
✅ Remplacement direct✓ En stock
$980 / unité
Voir la fiche technique →EP2AGX95EF29C3N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2AGX95EF29I5N
✅ Remplacement direct✓ En stock
$1320 / unité
Voir la fiche technique →EP2AGX95EF29I3N
✅ Remplacement direct✓ En stock
$1280 / unité
Voir la fiche technique →EP2AGX95EF29C6N
✅ Remplacement direct✓ En stock
$555.1 / unité
Voir la fiche technique →EP2AGX95EF29C5N
✅ Remplacement direct✓ En stock
$990 / unité
Voir la fiche technique →EP2AGX95EF29C4N Valeurs maximales et caractéristiques électriques
| Device Family | Arria II GX |
| Logic Elements | 89,178 |
| Embedded Memory | 6,839,296 bits |
| User I/O Count | 372 |
| Boîtier | 780-ball FCBGA (FBGA-780) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Transceivers | 8 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| PCI Express Hard IP | 4 blocks (Gen1/Gen2) |
| DSP Blocks | Yes (variable-precision) |
| PLLs | 4 |
| Global Clock Networks | 28 |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | C4 |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP2AGX95EF29C4N 780-ball fcbga (fbga-780)
Configuration des broches du EP2AGX95EF29C4N (boîtier 780-ball fcbga (fbga-780)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGX95EF29C4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGX95EF29C4N convient pour 6 applications: PCI Express Gen2 Endpoint Card, SFP+ to ASIC Bridge / Protocol Converter, Wireless Baseband Signal Processing, Video Broadcast and Image Processing Pipeline, Military/Aerospace Secure Communications, Test and Measurement Instrumentation.
PCI Express Gen2 Endpoint Card
The EP2AGX95EF29C4N's 4 PCI Express hard IP blocks (Gen1/Gen2 x1/x4/x8) and 6.375 Gbps transceivers make it well suited for PCIe add-in cards such as frame grabbers, DSP accelerator cards, and storage controllers. Hard IP eliminates soft-logic implementation of the PCIe stack, freeing fabric for application data paths. The 780-FBGA package supports the lane count and reference clock routing required for x8 Gen2 designs.
Recommandé
SFP+ to ASIC Bridge / Protocol Converter
With 8 transceivers at 6.375 Gbps, the EP2AGX95EF29C4N can bridge between SFP+ optical modules and legacy ASIC or FPGA interfaces, supporting 10 Gigabit Ethernet, Fibre Channel, or custom serial protocols. The mid-range 89,178-logic-element fabric provides sufficient LUTs for protocol state machines and data buffering without resorting to larger, more expensive Arria II GX parts. Industrial temperature I5N variants serve outdoor telecom hardware.
Recommandé
Wireless Baseband Signal Processing
The variable-precision DSP blocks and high logic density of the EP2AGX95EF29C4N support baseband processing for LTE, WiMAX, or proprietary wireless links, including channel estimation, FFT/iFFT, and turbo decoding. The 6.839 Mbit of embedded memory holds time-domain samples and constellation data close to the DSP slices, reducing external memory traffic. Transceivers handle the ADC-DAC interface to RF front-end ICs.
Recommandé
Video Broadcast and Image Processing Pipeline
The 89,178 logic elements and embedded DSP blocks of the EP2AGX95EF29C4N enable real-time video processing pipelines such as SDI to HDMI converters, multi-channel scalers, or image preprocessing for machine vision. High-speed LVDS and DDR3 interfaces (via the 12 I/O banks and 372 user I/O) connect to external frame buffers and camera sensors. The 6.375 Gbps transceivers support 3G-SDI and emerging SMPTE standards.
Recommandé
Military/Aerospace Secure Communications
For defense applications, the EP2AGX95EF29C4N offers built-in encryption IP, secure configuration bitstream loading, and 89K logic elements for waveform processing. The 780-FBGA package supports ruggedized board assemblies with underfill. Industrial temperature I-speed grades are often specified for MIL-STD-810 environments. The integrated transceivers simplify Link-16 or proprietary RF data link designs.
Recommandé
Test and Measurement Instrumentation
The EP2AGX95EF29C4N's high-speed transceivers, large memory, and abundant logic are well matched to test equipment such as protocol analyzers, logic analyzer capture cards, and arbitrary waveform generators. The hard PCIe IP allows direct insertion into a host PC backplane, while the 372 user I/O accept multiple probe channels. Quartus II provides built-in IP for Serial RapidIO and JTAG pattern generation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGX95EF29C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGX95EF29C4G | EP2AGX95EF29C3N | EP2AGX95EF29I5N | EP2AGX95EF29I3N | EP2AGX95EF29C6N | EP2AGX95EF29C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 | 89,178 |
| Speed Grade | C4 | C4 | C3 | I5 | I3 | C6 | C5 |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps | 8 @ 6.375 Gbps |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| PCIe Hard IP | 4 blocks | 4 blocks | 4 blocks | 4 blocks | 4 blocks | 4 blocks | 4 blocks |
Principaux différenciateurs
- Mid-range density with high-speed transceivers (vs EP2AGX45DF29C5N (smaller 45K-LE part))
- Commercial C4 speed grade at lower cost than industrial I-grade (vs EP2AGX95EF29I5N)
- Hard PCI Express IP eliminates soft-logic overhead (vs Cross-brand Xilinx Kintex-7 designs)
Notes de conception
The Arria II GX requires multiple power rails: 0.9 V core, 1.1 V PLL, and selectable 1.2/1.5/1.8/2.5/3.3 V I/O supplies per bank. Sequence the core voltage before the I/O supplies to avoid latch-up, and hold the device in reset until all rails are stable. Use a dedicated voltage regulator with adequate transient response; the device can draw significant inrush current during configuration. Refer to the Arria II GX PowerPlay early power estimator in Quartus II for accurate budgeting.
The 780-FBGA package has a junction-to-ambient thermal resistance around 12-15 C/W depending on PCB stack-up and airflow. At full transceiver utilization with 8 lanes at 6.375 Gbps, total power can exceed 10 W, requiring attention to thermal relief via thermal vias under the BGA, copper pours on inner layers, and possibly a heatsink. Use the Quartus II PowerPlay analyzer to model worst-case junction temperature for your operating profile.
The 780-FBGA ball pitch is 1.0 mm with an array requiring escape routing on multiple layers. Use a 6+ layer PCB with dedicated ground and power planes. Match transceiver differential pairs to 100 ohm impedance with length matching better than 150 mil. Provide a low-jitter reference clock with controlled routing to the dedicated refclk pins, and isolate analog PLL supplies from digital switching noise.
Estimated: Configuration can fail if JTAG or AS configuration mode pins are left floating. Tie MSEL pins to the correct logic levels for the chosen configuration mode. Do not confuse the C4 commercial speed grade with the I4 industrial speed grade - they have the same numbering but differ in temperature range. Verify the part suffix on the top marking before PCB assembly to avoid mismatched parts.
Informations de conformité
RoHS and lead-free per Intel/Altera product page. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified part by default); industrial temperature I-grade variants are commonly used in ruggedized automotive applications but are not AEC-Q100 qualified.
