EP2C15AF256C8N - 15K LEs Cyclone II FPGA, 256-FBGA | Intel / Altera
Référence : EP2C15AF256C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.35 | $14,35 |
| 10 | $12.95 | $129,50 |
| 100 | $11.2 | $1 120,00 |
| 500 | $9.85 | $4 925,00 |
| 1 000 | $8.75 | $8 750,00 |
EP2C15AF256C8N Présentation
A Cyclone II FPGA is a SRAM-based programmable logic device that integrates configurable logic arrays (LABs), embedded memory blocks (M4K blocks), embedded 18x18 multipliers, and a programmable I/O ring into a single die. Positioned below the high-end Stratix family and above the original Cyclone series, Cyclone II is designed to deliver ASIC-like logic density at FPGA-like design flexibility, while consuming substantially less power than its Stratix siblings - typically 50-60% lower static power at comparable densities.
Key features include support for LVDS, LVCMOS, SSTL, and HSTL I/O standards through dedicated True-LVDS circuitry; up to 52 embedded 18x18 multipliers enabling DSP-style FIR/FFT pipelines; a maximum of 4 PLLs providing clock synthesis, phase shifting, and frequency multiplication; and 68 M4K RAM blocks that can be configured as RAM, ROM, or FIFO. The 'C8' speed grade corresponds to an 8 ns internal timing corner, and the 'N' suffix denotes a lead-free, RoHS-compliant package.
Architecturally, the EP2C15 uses a sea-of-LABs fabric where each LAB contains 16 logic elements (LEs), each LE comprising a 4-input LUT, a programmable register, and a carry chain. Interconnect is achieved through MultiTrack routing with row/column drivers, and configuration data is stored in SRAM, requiring an external configuration device such as the EPCS4 or EPCS16 serial flash on power-up.
Typical applications include digital video processing and display controllers, motor control and industrial automation, software-defined radio baseband, low-cost prototyping of custom logic, and communications infrastructure such as bridges between legacy parallel buses and modern serial interfaces. The 256-ball FBGA package enables compact PCB layouts and supports high-speed signal integrity for LVDS links.
When designing with this device, plan configuration loading time carefully - the EP2C15 in fast standard mode requires approximately 12 ms to configure from an EPCS16, and JTAG or Active Serial configuration must be selected via MSEL pins. Decoupling must follow Altera's Cyclone II pin connection guidelines, with 0.1 µF and 0.01 µF capacitors near every VCCINT and VCCIO bank.
This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical board-design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP2C15AF256C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C15AF256C8N (même facteur de forme et même empreinte) — différant par Total RAM Bits, Family, Operating Temperature, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C20F256C8N
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →EP2C15AF256C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2C15AF256I8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.26 / unité
Voir la fiche technique →EP2C15AF484C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2C15AF256C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements | 14,448 |
| Total RAM Bits | 239,616 |
| Maximum User I/O | 152 |
| Number of Logic Elements / Cells | 14448 |
| Boîtier | 256-LBGA (FBGA-256) |
| Core Supply Voltage | 1.2 V |
| Température de fonctionnement | 0 C to 85 C |
| Speed Grade | C8 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes (N suffix) |
| Process Node | 90 nm |
| Configuration Memory | SRAM (external EPCS flash required) |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL |
Guide de configuration des broches du EP2C15AF256C8N 256-lbga (fbga-256)
Configuration des broches du EP2C15AF256C8N (boîtier 256-lbga (fbga-256)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2C15AF256C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2C15AF256C8N convient pour 7 applications: Industrial Motor Control, Digital Video Display Controller, Software Defined Radio Baseband, Legacy Bus Bridge, Low-Cost ASIC Prototyping, Communications Infrastructure Glue Logic, Medical Imaging Front-End.
Industrial Motor Control
The EP2C15AF256C8N fits industrial motor control because its 14,448 logic elements, embedded 18x18 multipliers, and 152 user I/O pins handle field-oriented control (FOC) loops and multi-axis PWM generation in a single chip. With a 1.2 V core and dedicated PLL, the FPGA can synthesize precision PWM frequencies above 100 kHz while sampling encoder feedback at sub-microsecond rates.
Recommandé
Digital Video Display Controller
With 239 Kbits of embedded RAM and True-LVDS I/O, the EP2C15AF256C8N acts as a low-cost LVDS display bridge for industrial LCDs, driving up to 152 LVDS pairs while buffering frame data in M4K blocks. The device's 90 nm process keeps static power below 0.5 W typical, making it ideal for fanless panel PCs and HMI displays.
Recommandé
Software Defined Radio Baseband
Cyclone II's 18x18 hardware multipliers deliver DSP-grade multiply-accumulate throughput at sample rates up to 250 MSPS in the EP2C15AF256C8N, enabling digital down-conversion (DDC), FIR filtering, and FFT blocks in SDR baseband chains. The 152 user I/O pins allow direct connection to dual ADCs/DACs and a host processor bus without an external bridge.
Recommandé
Legacy Bus Bridge
The EP2C15AF256C8N bridges parallel legacy buses (PCI, ISA, VME) to modern serial interfaces by mapping timing-critical bus cycles into Verilog state machines. Its 152 I/O and 14,448 LEs are sufficient for 32-bit @ 66 MHz PCI master/target implementations alongside UART, SPI, and I2C peripherals - all in a single FBGA-256 device.
Recommandé
Low-Cost ASIC Prototyping
For ASIC prototyping, the EP2C15AF256C8N provides 14,448 LEs of general-purpose logic at under $15 in unit quantities, enabling multiple prototype iterations before committing to mask costs. Quartus II design software supports the entire Cyclone II family, allowing designers to validate RTL against the same silicon that ships in early production.
Recommandé
Communications Infrastructure Glue Logic
In telecom and datacom equipment, the EP2C15AF256C8N replaces multiple TTL/CMOS glue-logic chips by integrating SERDES-like LVDS signaling, clock-data recovery assist, and frame-buffer FIFOs into one FPGA. The C8 speed grade supports LVDS operation at up to 805 Mbps, sufficient for many backplane applications below 1 Gbps.
Recommandé
Medical Imaging Front-End
The EP2C15AF256C8N performs real-time preprocessing of ultrasound, endoscopy, or patient-monitor front-end data, using embedded RAM as line buffers and 18x18 multipliers for pixel-level gain correction. Its 0 C to 85 C commercial temperature range suits medical cart and bedside equipment that lives in climate-controlled environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C15AF256C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C20F256C8N | EP2C15AF256C7N | EP2C15AF256I8N |
|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same | 256-LBGA (FBGA-256) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 14,448 | 18,752 (+30%) | 14,448 (same) | 14,448 (same) |
| Total RAM Bits | 239,616 | 239,616 (same) | 239,616 (same) | 239,616 (same) |
| Speed Grade | C8 | C8 (same) | C7 (slower) | I8 (industrial) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) |
| Maximum User I/O | 152 | 152 (same) | 152 (same) | 152 (same) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- 30% higher logic capacity available as drop-in upgrade (vs EP2C20F256C8N)
- Industrial temperature range available without redesign (vs EP2C15AF256I8N)
- Speed grade flexibility (vs EP2C15AF256C7N)
Notes de conception
Estimated: Decoupling follows the Cyclone II handbook (CII51006) recommendation of one 0.1 µF and one 0.01 µF ceramic capacitor per VCCINT pin group, plus a 4.7 µF to 22 µF bulk capacitor near the regulator. The 1.2 V core typically draws 100-300 mA depending on logic utilization - derate the regulator to handle inrush during configuration. Use a separate regulator for VCCIO banks if they need different voltages (1.5/1.8/2.5/3.3 V).
The FBGA-256 package uses 1.0 mm ball pitch on a 17 mm x 17 mm body - place all decoupling capacitors on the BOTTOM side of the board directly beneath their respective VCCINT/VCCIO balls via micro-via fanout. Maintain a continuous ground plane under the BGA with stitching vias every 2 mm around the perimeter to control return-path impedance for LVDS signals.
The MSEL[2..0] pins MUST be tied high/low correctly before power-up or the device will not configure - AS mode requires MSEL=000, JTAG uses MSEL=101. Floating MSEL pins are a top cause of 'device does not respond' failure modes. Also, nCONFIG and nSTATUS must be pulled to VCCIO through 10 kohm resistors; leaving them floating causes intermittent configuration failures.
LVDS outputs require 100 ohm differential termination at the receiver. Cyclone II True-LVDS channels support up to 805 Mbps in C8 speed grade - verify that PCB traces are impedance-controlled (100 ohm differential) and that pair-to-pair skew is below 50 ps. For memory interfaces, place the external EPCS configuration flash as close as possible to the FPGA's DCLK/ASDO/nCSO pins.
Informations de conformité
RoHS-compliant per Intel/Altera datasheet CII51006. Lead-free indicated by N suffix. Halogen-free status not explicitly stated in available data.
