EP2C20F256C7N - 18752 LE Cyclone II FPGA, 256-FBGA | Altera
Référence : EP2C20F256C7N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $61.92 | $61,92 |
| 10 | $55.5 | $555,00 |
| 100 | $48.2 | $4 820,00 |
| 500 | $42.8 | $21 400,00 |
| 1 000 | $38.5 | $38 500,00 |
EP2C20F256C7N Présentation
What is a Cyclone II FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic, interconnects, and I/O cells are defined by user configuration bits rather than hard-wired at the foundry. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> Cyclone family -> Cyclone II family. Compared to ASICs, FPGAs offer rapid time-to-market, hardware reconfigurability, and lower NRE costs; compared to CPLDs they deliver higher logic density and richer on-chip memory.
Key features include 52 embedded 18x18 multipliers (approx. 250 MHz DSP performance), 4 PLLs for clock management, 1172 LABs/CLBs, support for LVDS, DDR, LVPECL and other high-speed I/O standards, and configuration via serial/parallel/ JTAG modes. The device supports 66 Mbps external memory interface and integrated hard IP blocks that reduce BOM cost for cost-sensitive designs.
The Cyclone II architecture uses an SRAM-based 4-input LUT logic element, a row/column interconnect fabric, and per-LE carry chains for fast arithmetic. The 90 nm process and 1.2 V core voltage position this part for low-power, high-volume applications; embedded memory blocks (M4K) total ~240 Kbits and can be configured as RAM, ROM, or FIFO with ECC support.
Typical applications include industrial motor control, video processing, automotive infotainment, low-cost ASIC prototyping, telecom line cards, and consumer electronics displays. Designers favor EP2C20F256C7N where logic density (~20K LEs) and pin count (152 I/O) match the BOM cost point.
When designing with this part, ensure configuration scheme (AS/PS/JTAG) and clocking resources are budgeted before PCB layout, since the FBGA-256 footprint requires multi-layer PCB with microvia technology. Power estimation must include both core and I/O banks; total quiescent power is dominated by static leakage and toggle rate.
This page synthesizes distributor pricing, drop-in and same-family FPGA alternatives, and practical design notes not found in the manufacturer datasheet, optimized for AI search citation and engineering procurement workflows.
Alternatives de remplacement direct pour EP2C20F256C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C20F256C7N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Total RAM Bits, Process Technology, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C20F256C6N
✅ Remplacement direct✓ En stock
$41.5 / unité
Voir la fiche technique →EP2C20F256C8N
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →EP2C20F256I8N
✅ Remplacement direct✓ En stock
$43.5 / unité
Voir la fiche technique →EP2C20F256C7
✅ Remplacement direct✓ En stock
$55.28 / unité
Voir la fiche technique →EP4CE22F256C8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2C15AF256I8N
✅ Remplacement direct✓ En stock
$17.26 / unité
Voir la fiche technique →EP2C15AF256C8N
✅ Remplacement direct✓ En stock
$8.75 / unité
Voir la fiche technique →EP2C20F256C7N Valeurs maximales et caractéristiques électriques
| Series | Cyclone II |
| Family | FPGA Cyclone II |
| Number of Logic Elements (LEs) | 18752 |
| Number of LABs/CLBs | 1172 |
| Total RAM Bits | 239616 |
| Maximum User I/O Pins | 152 |
| Number of Embedded Multipliers (18x18) | 52 |
| Number of PLLs | 4 |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 402.58 MHz |
| Process Technology | 90 nm CMOS |
| Boîtier | 256-LBGA (FineLine BGA) 17x17 mm |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Niveau MSL | 3 (168 hours) |
| Configuration Method | SRAM-based (AS, PS, JTAG) |
| Statut RoHS | Compliant |
Configuration des broches de EP2C20F256C7N
| Broche A1 | I/O — User I/O - bank routing depends on Quartus pin assignment |
| Broche A2 | I/O — User I/O - bank routing depends on Quartus pin assignment |
| Broche A3 | VCCIO1 — I/O bank 1 voltage supply |
| Broche A4 | I/O — User I/O - bank 1 |
| Broche A5 | I/O — User I/O - bank 1 |
| Broche A6 | GND — Ground |
| Broche A7 | I/O — User I/O - bank 1 |
| Broche A8 | I/O — User I/O - bank 1 |
| Broche A9 | VCCIO1 — I/O bank 1 voltage supply |
| Broche A10 | I/O — User I/O - bank 1 |
| Broche A11 | I/O — User I/O - bank 1 |
| Broche A12 | GND — Ground |
| Broche A13 | I/O — User I/O - bank 1 |
| Broche A14 | I/O — User I/O - bank 1 |
| Broche A15 | VCCIO1 — I/O bank 1 voltage supply |
| Broche A16 | I/O — User I/O - bank 1 |
| Broche B1 | I/O — User I/O - bank routing depends on Quartus |
| Broche B2 | I/O — User I/O - bank routing depends on Quartus |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — User I/O - bank 1 |
| Broche B5 | I/O — User I/O - bank 1 |
| Broche B6 | VCCIO1 — I/O bank 1 voltage supply |
| Broche B7 | I/O — User I/O - bank 1 |
| Broche B8 | I/O — User I/O - bank 1 |
| Broche B9 | GND — Ground |
| Broche B10 | I/O — User I/O - bank 1 |
| Broche B11 | I/O — User I/O - bank 1 |
| Broche B12 | VCCIO1 — I/O bank 1 voltage supply |
| Broche B13 | I/O — User I/O - bank 1 |
| Broche B14 | I/O — User I/O - bank 1 |
| Broche B15 | GND — Ground |
| Broche B16 | I/O — User I/O - bank 1 |
Applications typiques
EP2C20F256C7N convient pour 6 applications: Industrial Motor Control, Video Processing and Image Pipeline, ASIC Prototyping and Emulation, Telecom Line Cards and Backplane Bridging, Automotive Infotainment and Driver Assistance, Low-Cost DSP and Audio Processing.
Industrial Motor Control
The EP2C20F256C7N's 18752 logic elements, 52 embedded 18x18 multipliers, and 4 PLLs make it a strong fit for industrial motor control applications such as AC induction, BLDC, and stepper drives. The FPGA can implement multi-axis field-oriented control (FOC), sinusoidal PWM generation, and encoder decoding in a single device. With 152 user I/Os, the part supports multiple PWM channels, quadrature decoders, and communication peripherals (CAN, RS-485, SPI) without external bridge chips. The 1.2 V core and 90 nm process keep dynamic power manageable for fanless industrial enclosures, and the 0-85C commercial grade covers most factory-floor environments.
Recommandé
Video Processing and Image Pipeline
In video processing applications such as surveillance DVRs, machine vision preprocessing, and LCD display controllers, the EP2C20F256C7N delivers sufficient logic density for deinterlacing, color space conversion, and scaling algorithms. The 52 embedded 18x18 multipliers handle real-time FIR filters for image sharpening and noise reduction at common video rates (480p/1080i). With 152 user I/Os, the device can directly drive parallel RGB/TTL LCD interfaces, BT.656 video ports, and DDR memory controllers for frame buffers. The 4 PLLs enable multiple independent video clocks (pixel clock, memory clock, encoder clock) without external clock generators.
Recommandé
ASIC Prototyping and Emulation
Engineers use the EP2C20F256C7N as a low-cost ASIC prototype platform for designs targeting ~15-20K gates of synthesized logic. The Quartus II toolchain with ModelSim-Intel FPGA Starter Edition provides RTL simulation, synthesis, and place-and-route flows equivalent to production ASIC methodologies. The 152 I/Os accommodate full ASIC boundary-scan (JTAG 1149.1) plus functional I/O replication, while the 4 PLLs allow prototyping of clock-tree structures. For multi-FPGA partitioning, multiple EP2C20 devices can be stacked with LVDS inter-board links for larger ASIC validation.
Recommandé
Telecom Line Cards and Backplane Bridging
The EP2C20F256C7N is well-suited for telecom line-card applications including T1/E1 framers, HDLC controllers, and low-density protocol bridges. Its 4 PLLs can derive multiple E1/T1 clocks from a single backplane reference, and the embedded multipliers support CRC/HDLC polynomial computation at line rate. The 152 user I/Os accommodate multiple LIU interfaces, FPGA Mezzanine Card (FMC) connectors, and management Ethernet (10/100 MII) without external logic. Industrial-grade variants like EP2C20F256I8N extend operation to -40C to +100C for outdoor DSLAM cabinets.
Recommandé
Automotive Infotainment and Driver Assistance
In automotive infotainment and entry-level ADAS (Advanced Driver Assistance Systems), the EP2C20F256C7N handles camera interface preprocessing, CAN/LIN gateway logic, and HMI graphics acceleration. While the commercial 0-85C grade limits engine-compartment deployment, the EP2C20F256I8N industrial variant (with extended temperature) suits cabin-mounted infotainment head units and instrument clusters. The 52 embedded multipliers accelerate image scaling for backup-camera overlays, and the 4 PLLs synchronize to multiple CAN/LIN bus clocks plus the display pixel clock.
Recommandé
Low-Cost DSP and Audio Processing
The EP2C20F256C7N's 52 dedicated 18x18 hardware multipliers at up to 250 MHz deliver approximately 13 GMACs of DSP throughput, suitable for audio effects processors, equalizers, and beamforming microphone arrays. The FPGA can host multiple audio sample-rate converters, AES/EBU or S/PDIF digital audio interfaces, and FIR/IIR filter chains in a single device. With 152 user I/Os, designers can integrate I2S, TDM, and parallel audio buses without external glue logic. The compact FBGA-256 package suits slim consumer audio product form factors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C20F256C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C20F256C6N | EP2C20F256C8N | EP2C20F256I8N | EP4CE22F256C8N | EP2C15AF256I8N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same | 256-LBGA (FBGA) - same |
| Logic Elements | 18752 | 18752 (same die) | 18752 (same die) | 18752 (same die) | 22320 (+19%) | 14408 (-23%) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.0 V (lower power) | 1.2 V (same) |
| Speed Grade | -7 | -6 (slower) | -8 (faster) | -8 (faster) | -8 | -8 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Embedded Multipliers (18x18) | 52 | 52 (same die) | 52 (same die) | 52 (same die) | 66 (+27%) | 26 (-50%) |
| Lifecycle Status (2026) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Active (recommended for new design) | Last Time Buy |
| Family / Generation | Cyclone II (90 nm) | Cyclone II (90 nm) | Cyclone II (90 nm) | Cyclone II (90 nm) | Cyclone IV E (60 nm) | Cyclone II (90 nm) |
Principaux différenciateurs
- Drop-in same-die speed grade flexibility (vs EP2C20F256C6N / EP2C20F256C8N)
- Industrial temperature variant available in same package (vs EP2C20F256I8N)
- Higher logic density vs Cyclone IV E in same package (vs EP2C20F256C7N vs EP4CE22F256C8N)
Notes de conception
The 256-ball FineLine BGA package with 1.0 mm ball pitch requires a multi-layer PCB (at least 4 layers, 6 recommended for power integrity) with laser-drilled microvias or staggered vias for fanout. Use the Altera-provided PCB footprint (.bga library) and verify the via-in-pad or dog-bone fanout choice matches your PCB vendor capability. Maintain a continuous ground plane under the BGA and stitch vias around the perimeter for return-path integrity. Match all VCCIO bank rails to the correct I/O standard voltage to prevent I/O failure.
Estimated: at 50% toggle rate and typical utilization, EP2C20F256C7N draws approximately 0.5-1.0 W core plus I/O bank power. Use a low-noise LDO (e.g., TPS7A4701RGWR) for the 1.2 V VCCINT rail and a separate 2.5 V LDO for VCCA_PLL with Pi-filter isolation. Decoupling: 0.1 uF X7R per VCC pin within 100 mils, plus 4.7 uF bulk caps per bank. Power sequencing is not required for Cyclone II but is recommended for brownout protection.
Configuration mode (AS, PS, JTAG) must be selected at PCB design time via MSEL pins - they cannot be changed at runtime. Active Serial (AS) mode requires an EPCS serial flash (e.g., EPCS4 or EPCS16) sized for the bitstream (~4-6 Mbit for full EP2C20 designs). Pull TCK high when not in use to prevent spurious JTAG state entry. The nCONFIG pin must be held high after VCCINT reaches 1.2 V to avoid configuration failure.
Cyclone II LVDS I/O supports up to 640 Mbps per channel. Use 100 ohm differential impedance for LVDS pairs with intra-pair skew < 50 ps and length matching to < 25 mil. For DDR memory interfaces (up to 167 MHz), use fly-by topology with VTT termination. Source-synchronous interfaces (e.g., camera parallel ports) should route clock and data on the same PCB layer to minimize skew.
Informations de conformité
RoHS and lead-free per Altera product page. AEC-Q100 not applicable for FPGAs in commercial-grade part. Industrial -I8N variant not AEC-Q100 qualified either - automotive AEC-Q100 FPGAs use specific part numbers.
