EP2S180F1508C3N - Stratix II FPGA 179K LE 1508-FBGA | Intel
Référence : EP2S180F1508C3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1500 | $1 500,00 |
| 10 | $1425 | $14 250,00 |
| 100 | $1350 | $135 000,00 |
| 500 | $1275 | $637 500,00 |
| 1 000 | $1200 | $1 200 000,00 |
EP2S180F1508C3N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as memory blocks, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which occupy a tier alongside ASICs and microcontrollers in the digital integrated circuit hierarchy. Stratix II in particular introduced an adaptive logic module (ALM) architecture featuring 8-input fracturable look-up tables, doubling the effective logic capacity versus prior Stratix generations.
Key features include embedded TriMatrix memory (with 9 Mbit total), up to 96 DSP blocks for fixed- and floating-point arithmetic, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and multi-gigabit transceivers (not present on the F1508 package variant). The 1,508-FBGA package supports commercial-grade junction temperature and is the highest-density Stratix II pinout variant, exposing nearly every user I/O for parallel processing interfaces.
The EP2S180F1508C3N belongs to the C3 speed grade, meaning nominal Fmax performance with standard core voltage; I4 and C5 variants trade temperature range or speed for higher-grade silicon. Its 90 nm process node places it in the legacy high-performance FPGA category, predating Stratix III/IV/V but still specified for new designs where legacy IP re-use, low unit cost at high density, and proven Quartus II tool flow are valued over cutting-edge transceivers.
Typical applications include high-throughput DSP pipelines (radar, video processing, software-defined radio), ASIC prototyping of complex SoCs, telecom baseband processing, and industrial control with custom parallel datapaths. The 1,170 user I/Os enable direct parallel bus attachment to DDR/QDR memory without external buffers.
When designing with this device, plan the PCB layout around the 1.2 V core and 3.3 V/2.5 V/1.8 V/1.5 V auxiliary supplies, route all differential pairs with controlled impedance, and use Quartus II software 13.0 or earlier for synthesis since the device predates Intel Quartus Prime. Decoupling must follow Stratix II PDN guidelines (typically 200+ low-ESL capacitors) to suppress simultaneous switching noise across the 1,170 I/Os.
This page consolidates Stratix II family specifications, pricing from authorized distributors, drop-in alternative FPGAs sharing the F1508 footprint, and design notes drawn from the Stratix II Handbook - information synthesized beyond what the manufacturer datasheet alone provides.
Alternatives de remplacement direct pour EP2S180F1508C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S180F1508C3N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Logic Elements, Process Technology, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S180F1508C3
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Voir la fiche technique →EP2S180F1508C4N
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$985 / unité
Voir la fiche technique →EP2S180F1508C5N
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$5050 / unité
Voir la fiche technique →EP2S180F1508I4N
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$445 / unité
Voir la fiche technique →EP2S130F1508C3N
✅ Remplacement direct✓ En stock
$270 / unité
Voir la fiche technique →EP2S130GF1508C3N
✅ Remplacement direct✓ En stock
$5950 / unité
Voir la fiche technique →EP2S180F1508C3N Valeurs maximales et caractéristiques électriques
| Series | Stratix II |
| Family | FPGA - Field Programmable Gate Array |
| Manufacturer | Intel (formerly Altera) |
| Equivalent Logic Elements | 179,400 |
| Logic Array Blocks (LABs) | 8,970 |
| Total RAM Bits | 9,383,040 |
| User I/Os | 1,170 |
| DSP Blocks | 96 |
| Supply Voltage (Core) | 1.15 V to 1.25 V |
| Process Technology | 90 nm CMOS, all-layer copper |
| Package Type | 1508-BBGA, FCBGA |
| Package Dimensions | 40 mm x 40 mm |
| Operating Temperature Grade | Commercial |
| Speed Grade | C3 |
| Type de montage | Surface Mount (BGA) |
| Lead Free / RoHS | Not specified in source data |
Guide de configuration des broches du EP2S180F1508C3N 40 mm x 40 mm
Configuration des broches du EP2S180F1508C3N (boîtier 40 mm x 40 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2S180F1508C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2S180F1508C3N convient pour 6 applications: ASIC Prototyping, High-Throughput DSP Pipeline, Telecom Baseband Processing, Industrial Control and Custom Datapath, Software-Defined Radio Front-End, High-Performance Computing Accelerator.
ASIC Prototyping
The EP2S180F1508C3N with 179,400 LEs and 1,170 user I/Os is sized to emulate complex SoC ASICs in pre-silicon validation, mapping the ASIC RTL into Stratix II ALMs and exercising real-world I/O and memory traffic. The 9 Mbit TriMatrix memory backs on-chip emulation buffers, while 96 DSP blocks enable prototype DSP cores. Quartus II synthesis keeps the same tool flow from prototype to volume production. The 1508-FBGA at 40x40 mm exposes every user I/O to break-out headers for ASIC-style multi-channel bus probes, but the 90 nm process and 1.2 V core mean power reaches 10-15 W at full utilization - plan the PCB thermal envelope accordingly.
Recommandé
High-Throughput DSP Pipeline
With 96 DSP blocks capable of 36x36 multiplies per cycle, the EP2S180F1508C3N is well suited to radar, video codec, and software-defined radio dataplanes where parallel arithmetic dominates. Its 9 Mbit on-chip memory holds rotating FFT windows and coefficient tables, eliminating many external memory transactions. The 1,170 user I/Os stream digitized antenna or video channels into the device, while the Quartus II DSP Builder flow compiles MATLAB/ Simulink models directly into ALM+DSPRegister mappings. Estimated at 200 MHz DSP clock, the device sustains ~19 GMACs; designers should budget for the Stratix II PDN guidance to keep core supply ripple under 30 mV.
Recommandé
Telecom Baseband Processing
The EP2S180F1508C3N's high LE count and 1,170 I/Os map directly to multi-channel baseband cards where each FPGA handles several E1/T1 or CPRI links alongside turbo-decoding and channel-estimation cores. Stratix II's adaptive logic module (ALM) architecture supports variable bit-width datapaths typical of 3G/4G baseband, and dedicated external memory interfaces attach DDR/DDR2/QDRII SRAM chips without glue logic. Industrial-grade variants (EP2S180F1508I4N) extend the operating range to telecom outdoor enclosures; the standard commercial C3 grade is adequate for indoor central-office cards with controlled airflow.
Recommandé
Industrial Control and Custom Datapath
Custom parallel datapaths in factory automation, machine vision, and motion control leverage the EP2S180F1508C3N's mix of DSP blocks (for closed-loop math), 1,170 user I/Os (for sensor/actuator fan-out), and 9 Mbit RAM (for line buffers in image processing). The C3 commercial speed grade and 1.2 V core suit factory-floor temperature ranges when paired with industrial enclosure thermal design. Industrial automation OEMs sometimes drop down to EP2S130F1508C3N for lower cost when DSP utilization is moderate, keeping the same Quartus II IP and PCB footprint to preserve tool investment across product tiers.
Recommandé
Software-Defined Radio Front-End
The EP2S180F1508C3N implements the digital down-conversion, channelization, and demodulation chain of a software-defined radio. Its 96 DSP blocks sustain multi-channel DDC and FIR filtering at IF sample rates, while the 9 Mbit TriMatrix memory stores polyphase filter banks and channel lookup tables. The 1,170 user I/Os accept parallel LVDS data from high-speed ADC banks; on the gigabit-transceiver-bearing variant (EP2S130GF1508C3N), digital data streams in via multi-gigabit serial links instead. Designers must budget for the Stratix II handbook's PDN capacitor count to keep simultaneous switching noise off the ADC sample clock.
Recommandé
High-Performance Computing Accelerator
In FPGA-based HPC accelerators, the EP2S180F1508C3N hosts custom compute kernels that exploit massive parallelism: each ALM pair can implement a 9x9 multiply-accumulate, and the 96 DSP blocks accelerate floating-point math via Quartus II MegaWizard plug-ins. The 1,170 user I/Os feed the host CPU via parallel PCI/PCI-X or HyperTransport bridges; PCIe is not native to Stratix II but is implementable in soft logic. Designers using the C3 speed grade see ~200 MHz Fmax; the C5 variant (~250 MHz Fmax) is preferred when compute density per clock outweighs unit-cost premium, and memory bandwidth from 9 Mbit on-chip RAM reduces host-FPGA transfers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S180F1508C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S180F1508C3 | EP2S180F1508C4N | EP2S180F1508C5N | EP2S180F1508I4N | EP2S130F1508C3N | EP2S130GF1508C3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-FBGA (40x40 mm) | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same | 1508-FBGA - same |
| Logic Elements | 179,400 | 179,400 | 179,400 | 179,400 | 179,400 | 132,540 | 132,540 |
| Total RAM Bits | 9,383,040 | 9,383,040 | 9,383,040 | 9,383,040 | 9,383,040 | 6,747,840 | 6,747,840 |
| User I/Os | 1,170 | 1,170 | 1,170 | 1,170 | 1,170 | 1,170 | 1,170 |
| Speed Grade | C3 (commercial) | C3 | C4 (faster) | C5 (fastest) | I4 (industrial) | C3 | C3 |
| DSP Blocks | 96 | 96 | 96 | 96 | 96 | 72 | 72 |
| Logic Array Blocks | 8,970 | 8,970 | 8,970 | 8,970 | 8,970 | 6,622 | 6,622 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
Principaux différenciateurs
- Maximum logic capacity in 1508-FBGA package (vs EP2S130F1508C3N)
- Highest commercial speed vs faster speed grades (vs EP2S180F1508C5N)
- Full 1,170 user I/O availability (vs EP2S180F1020C3N)
Notes de conception
The EP2S180F1508C3N requires multiple supply rails (VCCINT 1.15-1.25 V, VCCIO 1.5/1.8/2.5/3.3 V, VCC_PLL analog, VCCAUX auxiliary). The Stratix II Device Handbook mandates a specific power-on sequencing order to avoid device latch-up: VCCINT ramps first within 100 ms, followed by VCC_PLL and VCCAUX, then VCCIO. Power estimation via the Quartus II PowerPlay Early Power Estimator indicates 10-15 W typical, 25 W worst case at full utilization with 200 MHz clock; budget PCB cooling accordingly.
The 1508-FBGA package at 40x40 mm requires multilayer PCB (minimum 12 layers recommended for full I/O breakout). Use 1 oz copper for signal layers and 2 oz for power/ground planes. The Stratix II Handbook specifies via-in-pad or dog-bone fan-out, 0.5 mm pitch BGA, 0.4 mm ball diameter. Per the Stratix II PDN design guide, place 200+ decoupling capacitors (0.1 uF, 0.01 uF, 0.001 uF mix) within 100 mil of each power pin cluster to keep simultaneous switching noise below 30 mV on the 1.2 V rail.
Do not attempt to compile EP2S180F1508C3N designs in Intel Quartus Prime 17.1 or later - those versions dropped Stratix II device support. Use Quartus II 13.0sp1 (the final Quartus II release) from the Intel FPGA legacy software archive. Configuration via the legacy USB-Blaster or ByteBlaster II is required; newer Intel FPGA Download Cable II is supported but requires Quartus II driver selection. JTAG chain must include the EPCS or EPCQ configuration device plus any chained devices in correct TDO-TDI order.
Differential pairs (LVDS, DDR memory clocks) require 100 ohm differential impedance with matched trace lengths within 20 mil. Per Stratix II guidelines, use length-matched within-byte lanes for DDR/DDR2 interfaces (target skew under 50 ps). Clock inputs to PLLs must be routed with controlled impedance and isolated from switching signals by a ground guard trace. The 1,170 user I/Os allow flexible bank assignment for mixed-voltage interfaces; group I/O standards by bank voltage to minimize reference voltage (VREF) pins used.
Informations de conformité
Compliance certifications not explicitly listed in the verified web data sources. RoHS/REACH status not retrievable from distributor listings; consult authorized Intel Altera distributor for historical compliance documentation. AEC-Q100 not applicable for FPGAs.