EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel
Référence : EP2SGX30DF780C4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165.5 | $1 655,00 |
| 100 | $145 | $14 500,00 |
| 500 | $128 | $64 000,00 |
| 1 000 | $112 | $112 000,00 |
EP2SGX30DF780C4 Présentation
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the customer after manufacture. Within the broader taxonomy, the Stratix II GX belongs to the high-performance FPGA category, sitting between traditional PLDs and ASICs in cost-per-volume while delivering ASIC-class DSP, memory, and transceiver bandwidth. It functions as a system-on-chip engine for parallel DSP, packet processing, and high-speed I/O bridging in communications, imaging, and test systems.
Key features include 1,694 LABs/CLBs and 33,880 logic elements, 20 embedded full-duplex transceivers with multi-gigabit capability, dedicated DSP blocks for high-throughput arithmetic, and 361 user I/Os with multi-standard support. The device targets -40 °C to +85 °C extended commercial operating range (C4 grade) and is fabricated on a 90 nm CMOS process for a balance of density and dynamic power.
Architecturally, the Stratix II GX combines a row-and-column-based adaptive logic module (ALM) fabric with hard PCIe, memory controller IP, and multi-gigabit transceivers (MGTs), eliminating soft logic for the most timing-critical paths. The 90 nm CMOS process provides adequate headroom for the on-die PLL and clock tree while keeping static leakage manageable.
Typical applications include high-end telecommunications line cards, software-defined radio (SDR), ASIC prototyping, broadcast video processing, and high-speed serial backplane bridging. The combination of 20 transceivers and 33.8K logic elements also makes it suitable for medical imaging pre-processors and defense radar front-ends.
When designing with this device, careful attention must be paid to power-rail sequencing (1.2 V core, 2.5 V/3.3 V aux) and multi-layer PCB stack-up to keep transceivers within their SI budgets. The FBGA-780 demands a minimum of 6 PCB layers with controlled-impedance routing for the MGT channels.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for evaluation, sourcing, and BOM hardening.
Alternatives de remplacement direct pour EP2SGX30DF780C4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX30DF780C4 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, RoHS Status, Speed Grade, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX30DF780C4N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP2SGX30DF780C3N
✅ Remplacement direct✓ En stock
$95.5 / unité
Voir la fiche technique →EP2SGX30DF780C3
✅ Remplacement direct✓ En stock
$797.98 / unité
Voir la fiche technique →EP2SGX30DF780C4 Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Cells | 33,880 |
| Number of LABs / CLBs | 1,694 |
| Total Number of I/Os | 361 |
| Maximum Operating Frequency | 717 MHz |
| Number of Transceivers | 20 (embedded multi-gigabit) |
| Core Voltage | 1.2 V |
| Boîtier | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) |
| Type de montage | Surface Mount |
| Process Technology | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) |
| Programmable Terminals | BGA ball grid (780 terminals) |
| Package Code | BGA |
| Package Shape | Square |
| Statut RoHS | Compliant (per manufacturer product page) |
| Lead-Free | Yes |
Guide de configuration des broches du EP2SGX30DF780C4 square
Configuration des broches du EP2SGX30DF780C4 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX30DF780C4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX30DF780C4 convient pour 6 applications: Telecommunications Line Cards, Software Defined Radio (SDR), ASIC Prototyping, Broadcast Video Processing, High-Speed Serial Backplane Bridging, Medical Imaging Pre-Processor.
Telecommunications Line Cards
The EP2SGX30DF780C4 is ideally suited for high-end telecom line cards requiring simultaneous multi-gigabit serial I/O and substantial parallel processing. With 20 embedded transceivers supporting PCI Express Gen1/Gen2, Serial RapidIO, XAUI, and CPRI, plus 33,880 logic elements to handle framer, MAC, and traffic-management functions, the device bridges backplane serial links at up to 6.375 Gbps. The 361 user I/Os provide generous parallel connectivity to external PHYs and lookup memories. Unlike fixed-function ASSPs, the FPGA fabric lets OEMs re-target the same hardware across multiple line-card SKUs, reducing inventory cost. Power dissipation is the main trade-off - the 90 nm process and full transceiver utilization require robust thermal management on the line card PCB.
Recommandé
Software Defined Radio (SDR)
Software-defined radio platforms benefit from the EP2SGX30DF780C4's combination of high logic density and embedded multi-gigabit transceivers. The 33,880 logic elements host multi-channel digital down-conversion (DDC), digital up-conversion (DUC), and FFT processors, while the 20 transceivers interface directly to ADC/DAC sample clocks and IF stages. This eliminates an external bridging ASIC, reducing BOM and latency. The 1.2 V core at 717 MHz provides adequate DSP throughput for sub-6 GHz waveform processing in tactical and commercial SDR designs. The 90 nm CMOS process trades some power efficiency for cost-effective density, which suits chassis-mounted radios with active cooling rather than handheld form factors.
Recommandé
ASIC Prototyping
The EP2SGX30DF780C4 serves as a high-fidelity ASIC prototyping platform thanks to its 33,880 logic elements, dedicated DSP blocks, and embedded transceivers. Design teams partition the target ASIC into multiple Stratix II GX devices using the same FBGA-780 footprint for repeatable bring-up. The 717 MHz core frequency provides timing margin to validate RTL at near-ASIC speeds, while 361 user I/Os enable realistic chip-to-chip signaling. The same Quartus II toolchain that targets production ASICs accelerates verification cycles. Because the part is End-of-Life, prototype teams should secure long-term inventory or migrate to Stratix IV/V GX before committing to a multi-year program.
Recommandé
Broadcast Video Processing
Broadcast video processing engines rely on the EP2SGX30DF780C4 for real-time SD/HD/3G-SDI ingest, de-interlacing, scaling, and overlay composition. The 20 multi-gigabit transceivers accept uncompressed SDI streams at up to 3 Gbps per link, while the 33,880 logic elements drive multi-stream processing pipelines without external memory bottlenecks. The 361 user I/Os interface to DDR2/DDR3 frame buffers and HDMI/DVI output bridges. Compared with fixed ASSP video processors, the FPGA fabric supports proprietary codecs and watermark insertion critical to broadcast IP protection. Designers should plan for thermal management and multi-layer PCB impedance control to maintain SDI eye-mask compliance at production volumes.
Recommandé
High-Speed Serial Backplane Bridging
Backplane bridging applications use the EP2SGX30DF780C4 as a protocol-agnostic serial aggregator across ATCA, microTCA, and proprietary backplanes. The 20 embedded transceivers aggregate multiple lanes of Gigabit Ethernet, Serial RapidIO, or Aurora into a single high-bandwidth pipe, while 33,880 logic elements implement link-layer arbitration and congestion management. The FBGA-780 footprint integrates cleanly into standard ATCA carrier cards with room for PHY magnetics and clock distribution. The device is especially valuable in defense and aerospace backplanes where the same hardware must bridge multiple protocols on the same chassis, eliminating dedicated silicon per protocol.
Recommandé
Medical Imaging Pre-Processor
Medical imaging systems such as CT, MRI, and ultrasound pre-processors rely on the EP2SGX30DF780C4 for high-throughput pixel pipeline and beamforming operations. The 33,880 logic elements execute FIR/IIR filtering, image reconstruction, and noise reduction in real time, while 20 embedded transceivers carry raw ADC data from the detector array at multi-gigabit rates. Compared with DSP-only solutions, the FPGA fabric offers deterministic latency essential for triggering and gating. The 361 user I/Os accommodate multiple high-resolution sensor interfaces in parallel. Given the EOL status of this part, medical OEMs typically lock in long-term inventory contracts or migrate to lower-density Stratix IV/V parts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX30DF780C4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX30DF780C4N | EP2SGX30DF780C3N | EP2SGX30DF780C3 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (29 x 29 mm, 1 mm pitch) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | 1,694 | 1,694 | 1,694 |
| Speed Grade | C4 | C4 | C3 (lower) | C3 (lower) |
| Lead-Free / RoHS | Per datasheet (status not explicitly stated in verified web data) | Yes (lead-free finish) | Yes (lead-free finish) | Per datasheet (status not explicitly stated) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/Os | 361 | 361 | 361 | 361 |
| Transceivers | 20 | 20 | 20 | 20 |
| Lifecycle Status | EOL | EOL | EOL | EOL |
Principaux différenciateurs
- Same die, faster speed grade at identical price point (vs EP2SGX30DF780C3)
- Lead-free / RoHS-compliant ball finish for global manufacturing (vs EP2SGX30DF780C4 (standard lead finish))
- 20 embedded multi-gigabit transceivers eliminate external bridging silicon (vs Discrete PHY-based designs using ASSP bridges)
Notes de conception
The Stratix II GX family requires four independent supply rails: 1.2 V VCCINT (core), 2.5 V VCCAUX (PLL and auxiliary), 3.3 V VCCIO (I/O banks - mixed voltage possible), and a separate analog supply for the multi-gigabit transceivers. Power-rail sequencing must enforce VCCINT before VCCAUX before VCCIO, with monotonic ramp and <100 ms rise time. Failure to sequence correctly risks latch-up or long-term reliability degradation. Estimated: at full transceiver utilization the device can dissipate 8-12 W, requiring a multi-layer PCB with at least 1 oz copper pour on inner planes.
The FBGA-780 package demands a minimum 6-layer PCB stack-up with 1 mm ball pitch escape routing. Use microvia (laser-drilled) or stacked-via technology on the top two layers to break out the inner-row balls. Transceiver lanes must be routed as 100 Ω differential pairs on a controlled-impedance stack-up (typical stack: 8 mil dielectric, 0.5 oz copper). Keep MGT traces shorter than 6 inches and avoid 90-degree bends to preserve 6.375 Gbps eye-mask margins. Place AC-coupling capacitors within 200 mil of the receiver balls.
Three pitfalls to avoid with the EP2SGX30DF780C4. First, do not assume the C4 (speed grade 4) is the fastest - the lowest number is fastest (C3 > C4 > C5 in performance). Confirm speed grade timing closure in Quartus II TimeQuest before tape-out. Second, unused MGT transceivers must still be powered and properly terminated per the handbook; floating balls cause reflections and can inject noise into adjacent active channels. Third, the JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) require external pull-up/pull-down resistors per the configuration scheme - missing pull-ups result in unreliable configuration at power-up.
Informations de conformité
RoHS compliance per manufacturer product page (Stratix II GX family data). Detailed reach/halogen/conflict-mineral declarations for EP2SGX30DF780C4 were not available in the verified web data. The C4N suffix variant is explicitly lead-free per Altera/Intel ordering information.
