EP2SGX30DF780C4 vs EP2SGX30DF780C5 Comparaison
Comparaison détaillée côte à côte de EP2SGX30DF780C4 par Intel et EP2SGX30DF780C5 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX30DF780C4 | EP2SGX30DF780C5 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Fin de vie | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $112,00 | $384,62 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,880 | — |
| Number of LABs / CLBs | 1,694 | — |
| Total Number of I/Os | 361 | — |
| Maximum Operating Frequency | 717 MHz | — |
| Number of Transceivers | 20 (embedded multi-gigabit) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Boîtier | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) | 780-ball FBGA (FC-FBGA), 29 x 29 mm, 1 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) | — |
| Programmable Terminals | BGA ball grid (780 terminals) | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | Compliant (per manufacturer product page) | [DATA_NEEDED: RoHS compliance status from verified data] |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 33,880 |
| LABs/CLBs | — | 1694 |
| Total RAM Bits | — | 1,369,728 bits |
| Number of Logic Cells | — | 33,880 cells |
| Maximum User I/Os | — | 361 |
| Transceiver Channels | — | 4 (up to 3.125 Gbps each) |
| Internal Frequency (max) | — | 609.76 MHz |
| Température de fonctionnement | — | -40C to +85C (commercial) |
| Speed Grade | — | -5 |