EP2SGX90EF35C5NGA - Stratix II GX FPGA 90K LE, 35mm BGA
Référence : EP2SGX90EF35C5NGA ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1720 | $17 200,00 |
| 50 | $1620 | $81 000,00 |
| 100 | $1550 | $155 000,00 |
| 250 | $1490 | $372 500,00 |
EP2SGX90EF35C5NGA Présentation
What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, multipliers, and memory blocks. The 'Stratix' family sits in Intel's high-end FPGA portfolio, optimized for performance, density, and high-speed serial I/O. Within the taxonomy: FPGA -> programmable logic device -> ASIC-class reconfigurable logic -> semiconductor. FPGAs are used when time-to-market, hardware reconfigurability, or parallel processing throughput outweigh the per-unit cost advantages of a fixed-function ASIC.
Key features of the EP2SGX90EF35C5NGA include up to 12 full-duplex transceiver channels supporting protocols such as PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G, 8 PLLs with on-chip termination calibration, and dedicated DSP blocks delivering up to 192 GMACS performance. The 1.2 V core supply with on-chip voltage regulation simplifies power-rail design, while the 1152-pin FineLine BGA (35 mm body) provides a thermally enhanced land pattern with a large exposed die paddle.
Architecturally, the device combines a logic fabric built from adaptive logic modules (ALMs) with hard PCI Express, XAUI, and external memory interface IP, allowing engineers to drop in complete protocol controllers without consuming FPGA fabric. The 90 nm process and 1.2 V core offer a balance of static power and performance for telecom backplane and high-end test equipment applications.
Typical applications include high-end test and measurement instrumentation, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and DSP co-processing cards. The integrated 6.375 Gbps transceivers make the device especially relevant for legacy 10 Gbps Ethernet and RapidIO line-card designs.
When designing with this FPGA, ensure the PCB land pattern matches the 35 mm FineLine BGA recommended by Intel. Thermal management must account for the 1.2 V core current draw at high toggle rates; a minimum 8-layer stack-up with continuous ground and power planes is recommended. The EPC (Enhanced Configuration Device) classification in the part number indicates this device works with the legacy Altera EPC configuration memory family, so the companion configuration PROM must be ordered from the same product tree.
This page synthesizes distributor inventory, Stratix II GX family context, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers evaluate drop-in variants and long-term supply risk.
Alternatives de remplacement direct pour EP2SGX90EF35C5NGA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX90EF35C5NGA (même facteur de forme et même empreinte) — différant par Logic Elements, Package, RoHS Status, Process Technology, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX90EF35C5NES
✅ Remplacement direct✓ En stock
$1285 / unité
Voir la fiche technique →EP2SGX90EF35C4NGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2SGX90EF35C3NGA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2SGX90EF35C5NES
✅ Remplacement direct✓ En stock
$1285 / unité
Voir la fiche technique →EP2SGX90EF35C4NES
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EP2SGX90EF35C3NES
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →EP2SGX90EF35C5NGA Valeurs maximales et caractéristiques électriques
| Series | Stratix II GX |
| Family Name | Enhanced Configuration (EPC) Device |
| Logic Elements | 90960 (approx.) |
| Embedded Memory | 4.5 Mbits |
| Transceiver Channels | 12 (up to 6.375 Gbps) |
| DSP Blocks | 192 (12x 18x18 multipliers) |
| PLLs | 8 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Speed Grade | C5 |
| Boîtier | 1152-pin FineLine BGA (35 mm) |
| Température de fonctionnement | Commercial (0C to +85C) - inferred from 'C' speed designation |
| Statut RoHS | Non-Compliant (per GlobalSpec listing) |
| Configuration | EPC (Enhanced Configuration Device) family |
Guide de configuration des broches du EP2SGX90EF35C5NGA 1152-pin fineline bga (35 mm)
Configuration des broches du EP2SGX90EF35C5NGA (boîtier 1152-pin fineline bga (35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX90EF35C5NGA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX90EF35C5NGA convient pour 6 applications: Telecom Backplane Aggregation, High-End Test and Measurement Instrumentation, Broadcast Video Processing, ASIC Prototyping, DSP Co-Processing Cards, Legacy Industrial Control and HMI.
Telecom Backplane Aggregation
The EP2SGX90EF35C5NGA's 12 multi-gigabit transceiver channels up to 6.375 Gbps directly support XAUI, Serial RapidIO, and CEI-6G aggregation on telecom line cards. The 90K logic elements handle packet inspection and traffic management fabric, while 4.5 Mbits of embedded RAM buffers cells at line rate. With 192 18x18 multipliers available as DSP blocks, the device performs wire-speed QoS classification and encryption. In a typical deployment, the FPGA sits between a network processor and the backplane SERDES, replacing multiple discrete PHY ICs with a single integrated solution and reducing PCB area by 30-40%.
Recommandé
High-End Test and Measurement Instrumentation
The EP2SGX90EF35C5NGA fits the high-throughput signal processing needs of oscilloscope, BERT, and protocol-analyzer platforms. The 192 DSP blocks deliver 192 GMACS for FFT-based spectrum analysis and real-time FIR filtering, while the 12 transceivers accept 6.375 Gbps data streams from high-speed ADCs and DACs without external clock-data-recovery circuitry. Engineers often pair the device with 1 Gsample/s ADC front-ends, using the FPGA to perform real-time triggering and pattern recognition. The 35 mm FineLine BGA's thermally enhanced land pattern supports continuous operation in benchtop instruments with moderate airflow.
Recommandé
Broadcast Video Processing
Broadcast video routers and format converters require the EP2SGX90EF35C5NGA's combination of high logic density and multi-gigabit serial I/O for SDI-over-IP and 3G-SDI multiplexing. The 12 transceivers accept SMPTE 424M (3G-SDI) inputs, while the 90K logic elements perform color-space conversion, scaling, and frame-rate adaptation. The 4.5 Mbit embedded RAM acts as a line buffer, eliminating the need for external DDR in some single-stream designs. A typical 16x16 router using one EP2SGX90EF35C5NGA can replace three to four legacy SDI crosspoint ICs.
Recommandé
ASIC Prototyping
The EP2SGX90EF35C5NGA serves as a target for ASIC RTL prototyping in the 90K-equivalent-gate range, allowing verification engineers to validate designs at near-ASIC clock rates before tape-out. The 90 nm process and 1.2 V core deliver predictable timing correlation to production ASIC libraries, while the 8 PLLs and 12 transceivers allow designers to prototype SerDes-heavy ASICs with the same silicon used in production. Quartus II's TimeQuest SDC support and the Stratix II GX's rich debug infrastructure (SignalTap II, Logic Analyzer interface) make it a strong choice for hardware/software co-verification.
Recommandé
DSP Co-Processing Cards
The EP2SGX90EF35C5NGA's 192 dedicated 18x18 multipliers deliver 192 GMACS of DSP throughput, making it well-suited for radar, sonar, and software-defined-radio co-processing cards. The 12 transceivers accept digitized RF data at up to 6.375 Gbps from high-speed ADCs, while the 90K logic elements implement the surrounding control and DMA fabric. In a typical radar pre-processor, the device performs pulse compression and Doppler filtering directly on the ADC output, reducing host CPU load by 80-90% and enabling real-time situational awareness.
Recommandé
Legacy Industrial Control and HMI
Industrial automation platforms integrate the EP2SGX90EF35C5NGA as a high-speed I/O concentrator that aggregates PROFINET, EtherCAT, and CC-Link frames on a single board. The 12 transceivers provide dedicated channels for time-sensitive industrial Ethernet protocols, while the 90K logic elements handle the protocol stacks and motion-control loops. The commercial 0-85C temperature range suits factory-floor enclosure environments with filtered airflow, and the EPC configuration family allows hot-swap firmware updates via standard JTAG.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX90EF35C5NGA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX90EF35C5N | EP2SGX90EF35C4NGA | EP2SGX90EF35C5NES |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 1152-pin FineLine BGA (35 mm) | 1152-pin FineLine BGA (35 mm) - same | 1152-pin FineLine BGA (35 mm) - same | 1152-pin FineLine BGA (35 mm) - same |
| Logic Elements | 90960 | 90960 | 90960 | 90960 |
| Speed Grade | C5 (fastest) | C5 | C4 (~10-15% slower Fmax) | C5 |
| Ordering Suffix | NGA (N = lead-free option, GA = JTAG designator) | N (no GA designator) | NGA | NES (extended lead-free) |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 (6.375 Gbps) | 12 (6.375 Gbps) | 12 (6.375 Gbps) |
| Embedded Memory | 4.5 Mbits | 4.5 Mbits | 4.5 Mbits | 4.5 Mbits |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- Active commercial production tail through the C5 speed grade (vs EP2SGX90EF35C4NGA)
- Identical silicon, broader ordering code coverage (vs EP2SGX90EF35C5N)
- Lowest-power option within the same F35 footprint (vs EP2SGX90EF35C5NES)
Notes de conception
The 1152-pin FineLine BGA (F35) at 1.0 mm ball pitch requires a minimum 8-layer PCB stack-up with 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. Use of a microvia or HDI process is recommended for the BGA break-out; through-via fanout alone is rarely possible at 1.0 mm pitch without signal-integrity loss. Reference the Altera AN 548 pin connection guidelines for the F35 package and validate escape routing with field-solver simulation before tape-out.
Estimated: at full logic utilization (80%) and 100% toggle rate on I/O, the EP2SGX90EF35C5NGA draws approximately 15-20 W from the 1.2 V core rail. With a 35 mm BGA junction-to-ambient thermal resistance (theta_JA) of approximately 8-10 C/W for a 4-layer JEDEC test board, a heatsink is required for continuous operation above 70C ambient. Use a thermal interface material rated for 5-7 C/W or better, and place a thermocouple near the center of the BGA for in-situ monitoring.
Do not apply power to the 1.2 V core rail before the 2.5 V and 3.3 V auxiliary supplies are stable. The Stratix II GX has specific power-sequencing requirements documented in the device handbook; out-of-order ramp can cause long-term reliability degradation or latch-up. Use a power management IC with programmable sequencing or a discrete FET-based sequencer for prototype builds.
Informations de conformité
RoHS Non-Compliant per GlobalSpec datasheet listing. Lead-free construction (N suffix). AEC-Q100 not applicable for FPGAs; this is a commercial-temperature device. REACH and conflict-minerals declarations not in the provided data.
