EP2SGX90FF150834N - Stratix II GX FPGA, 1508-BGA | Intel / Altera
Référence : EP2SGX90FF150834N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $850 | $850,00 |
| 10 | $765 | $7 650,00 |
| 100 | $680 | $68 000,00 |
| 500 | $620 | $310 000,00 |
| 1 000 | $580 | $580 000,00 |
EP2SGX90FF150834N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceiver slices that the designer can reconfigure after manufacture. FPGAs sit at the top of the programmable-logic hierarchy: configurable logic -> programmable interconnect -> programmable SoC -> FPGA. Compared with fixed-function ASICs, FPGAs deliver lower NRE cost and faster time-to-market at the expense of higher unit cost and power per gate, making them ideal for prototyping, low-volume production, and applications that benefit from hardware reconfiguration (e.g., evolving communication standards).
Key features include embedded high-speed transceivers (Stratix II GX family), abundant on-chip RAM, dedicated DSP blocks for high-throughput arithmetic, and support for external memory interfaces such as DDR/DDR2/QDR. The device is implemented in a 90 nm process node and is built on the Stratix II GX architecture that combines a logic fabric with multi-gigabit transceivers for serial connectivity. The FF1508 package provides ample I/O for high-bandwidth designs that route many LVDS pairs or parallel memory interfaces.
Typical applications include high-speed serial connectivity in communications infrastructure, baseband signal processing in wireless base stations, video and imaging pipelines, ASIC prototyping, and industrial test and measurement equipment that requires parallel DSP performance. The integrated transceivers are particularly valuable when the design must support protocols such as PCIe, Serial RapidIO, or Gigabit Ethernet. When designing, plan the PCB BGA breakout carefully: a 1508-ball FCBGA typically requires 4-6 routing layers with microvias, controlled-impedance routing for the transceiver channels, and substantial ground stitching under the package to maintain signal integrity.
Alternatives de remplacement direct pour EP2SGX90FF150834N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX90FF150834N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Mounting Type, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX90FF1508C3N
✅ Remplacement direct✓ En stock
$1295 / unité
Voir la fiche technique →EP2SGX90F1508C3
✅ Remplacement direct✓ En stock
$1350 / unité
Voir la fiche technique →EP2SGX90F1508C5N
✅ Remplacement direct✓ En stock
$195.5 / unité
Voir la fiche technique →EP2SGX90FF1508
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2SGX90FF150834
✅ Remplacement direct✓ En stock
$895 / unité
Voir la fiche technique →EP2SGX90FF150834N Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements | 90,960 |
| Embedded Memory Bits | 4,520,448 |
| Boîtier | 1508-BBGA (FCBGA), 40x40 mm class |
| Process Node | 90 nm |
| Speed Grade | 8 |
| Temperature / Operating Range | Commercial (N suffix: lead-free) |
| Lead-Free (Pb-free) | Yes (N suffix) |
| High-Speed Transceivers | Yes (Stratix II GX multi-gigabit transceivers) |
| Configuration Mode | Enhanced Configuration (EPC) supported |
| JTAG Boundary-Scan | Supported |
| Statut RoHS | Compliant (Pb-free finish) |
| Manufacturer | Intel (formerly Altera Corporation) |
Guide de configuration des broches du EP2SGX90FF150834N 1508-bbga (fcbga), 40x40 mm class
Configuration des broches du EP2SGX90FF150834N (boîtier 1508-bbga (fcbga), 40x40 mm class). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX90FF150834N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX90FF150834N convient pour 6 applications: Wireless Base Station Baseband Processing, High-Speed Serial Protocol Bridge, ASIC Prototyping Platform, Industrial Test and Measurement Equipment, Video and Imaging Broadcast Infrastructure, Military and Aerospace Avionics Bus Interfaces.
Wireless Base Station Baseband Processing
The EP2SGX90FF150834N fits wireless base-station baseband designs because it combines 90,960 logic elements with multi-gigabit transceivers and abundant 4,520,448-bit embedded memory on a single 1508-BGA die. Its hard DSP blocks accelerate the FFT/iFFT, channel estimation, and FEC pipelines that dominate LTE and 3G baseband workloads, while the transceivers drive CPRI or OBSAI links to remote radio heads without external SERDES. Designers typically place the FPGA between the ADC/DAC front-end and the backhaul Ethernet switch, exploiting its 90 nm fabric's high logic-per-watt to consolidate what would otherwise require an ASIC plus a discrete transceiver chip. Verified web data confirms the part supports PCI Express, Serial RapidIO, and Gigabit Ethernet protocols required by modern base-station architectures.
Recommandé
High-Speed Serial Protocol Bridge
The EP2SGX90FF150834N is a strong match for serial protocol bridging because its Stratix II GX transceivers support multiple line rates and the embedded IP cores for PCIe, Serial RapidIO, XAUI, and Gigabit Ethernet are mature in Quartus II. The 1508-BGA package exposes the full transceiver channel count and LVDS pairs needed to land multiple protocols in parallel, while the 4.5 Mb of embedded memory absorbs packet buffering during rate matching. Compared with a discrete SERDES plus FPGA approach, the integrated transceiver cuts board area and BOM cost. The device's 90 nm process delivers the timing margin required for tight protocol jitter budgets, and the FF1508 BGA's signal-integrity-friendly power/ground plane ratios simplify PCB stack-up design.
Recommandé
ASIC Prototyping Platform
The EP2SGX90FF150834N is widely used as an ASIC prototyping substrate because 90,960 logic elements plus 4.5 Mb of block RAM can map the gate count and memory footprint of mid-range ASIC designs without partitioning. Designers instantiate processor cores, peripheral controllers, and custom logic into one device, then validate firmware and software before taping out the ASIC. The Stratix II GX family is particularly attractive because Quartus II supports incremental compile and team-based design flows that shorten prototype bring-up. The 1508-BGA's high I/O count provides the physical pins needed to break out to daughter boards for peripheral expansion. Once the prototype is validated, teams can re-target to Stratix V or current Intel Agilex devices for higher speed without changing the RTL.
Recommandé
Industrial Test and Measurement Equipment
The EP2SGX90FF150834N serves industrial test and measurement designs because it can simultaneously drive high-speed ADCs/DACs, process the resulting data streams in hard DSP blocks, and stream the results to a host over PCIe or Gigabit Ethernet - all on one chip. The 4.5 Mb of embedded RAM is sufficient for FFT bins, capture buffers, and histogram accumulators used in spectrum analyzers and logic analyzers. Its 90 nm fabric runs deterministic, low-jitter DSP pipelines that meet the timing margins demanded by precision instruments. The FF1508 BGA's high I/O density allows direct attachment to multiple parallel ADCs without external multiplexers. Verified web data confirms this Str
Recommandé
Video and Imaging Broadcast Infrastructure
The EP2SGX90FF150834N supports video and imaging broadcast infrastructure because its 4.5 Mb of embedded memory and hard DSP blocks can sustain the pixel rates of uncompressed HD-SDI, 3G-SDI, and emerging 4K formats while the multi-gigabit transceivers drive the SDI cable drivers and backhaul Ethernet simultaneously. Designers use the 90,960 logic elements to implement color-space conversion, scaling, frame-rate conversion, and overlay composition on a single chip, replacing multiple ASSPs. The 1508-BGA's high I/O count enables direct connection to multi-channel video I/O without intermediate bridge devices. As of the LTB window, broadcast OEMs should plan a long-term migration to current Intel Cyclone/Agilex families for new designs while keeping this part for installed-base repairs.
Recommandé
Military and Aerospace Avionics Bus Interfaces
The EP2SGX90FF150834N is used in avionics and military communications because the Stratix II GX transceivers support legacy and modern avionics buses (MIL-STD-1553 bridging via external transceivers, ARINC 429, Fibre Channel) while the 90,960 logic elements provide the protocol stack and error-correction logic. The 1508-BGA package's thermal and mechanical robustness suits ruggedized enclosures, and the commercial N-temperature Pb-free finish allows use in controlled-environment airborne and ground-mobile platforms. Note: this commercial grade is not the preferred choice for full military temperature extremes - designers should verify against the program's environmental requirements. For radiation-hardened applications, dedicated MIL-PRF or rad-hard FPGAs are required.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX90FF150834N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX90FF1508C3N | EP2SGX90F1508C3 | EP2SGX90F1508C5N | EP2SGX90FF1508 | EP2SGX90FF150834 |
|---|---|---|---|---|---|---|
| Package | 1508-BBGA (FCBGA) | 1508-BBGA (FCBGA) - same | 1508-BBGA (FCBGA) - same | 1508-BBGA (FCBGA) - same | 1508-BBGA (FCBGA) - same | 1508-BBGA (FCBGA) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Embedded Memory Bits | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 |
| Speed Grade | Speed grade 8 (commercial N) | Speed grade 3 (commercial N) | Speed grade 3 (commercial) | Speed grade 5 (commercial N) | Vendor-assigned | Speed grade 8 |
| Lead-Free Finish | Yes (N suffix) | Yes (N suffix) | No (legacy) | Yes (N suffix) | Per ordering code | Per ordering code |
| Multi-Gigabit Transceivers | Yes (Stratix II GX) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Principaux différenciateurs
- Highest pin count in the Stratix II GX family at 1508 balls (vs EP2SGX90EF1152)
- Lead-free finish (N suffix) suitable for Pb-free assembly (vs EP2SGX90F1508C3)
- Speed grade 8 variant for cost-sensitive non-timing-critical applications (vs EP2SGX90FF1508C3N)
Notes de conception
The 1508-ball FCBGA (FF1508) requires a 4-6 layer PCB stack-up with microvia (laser-drilled) technology to escape the inner ball rows. Plan a 1.0 mm pitch BGA breakout with via-in-pad or dog-bone fan-out, and place continuous ground and power planes directly under the package to provide low-impedance return paths for the high-speed transceivers. Estimated: a typical 1508-BGA at 1.0 mm pitch requires roughly 6000-9000 microvias for full breakout on a 6-layer stack-up.
Stratix II GX transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with length matching to within the protocol specification (e.g., PCIe requires +/- 5 mil). Use series AC-coupling capacitors close to the transmit pins, and isolate the transceiver power supplies (VCCH, VCCP, VCCR) with ferrite beads and decoupling capacitors per the Stratix II GX pin connection guidelines. Reference the Quartus II transceiver toolkit for channel simulation.
Estimated: the Stratix II GX at 90 nm can dissipate 6-12 W depending on logic utilization and transceiver activity. The FF1508 BGA exposes a thermal pad to the internal die; solder this pad to the PCB with thermal vias (12-25 vias, 0.3 mm drill) to a dedicated thermal plane. For full-speed operation in commercial ambient air, expect to need 200-400 LFM airflow or a heatsink. Always re-check against your actual design utilization using the Quartus II PowerPlay early power estimator.
Do not assume any two EP2SGX90FF1508* order codes are interchangeable without re-running timing analysis: speed grade (C3 vs C4 vs C5 vs C8) changes Fmax by ~15% per step, and a C8 design may not close timing where a C5 did. Also confirm that the order code's N (lead-free) suffix matches your assembly process; legacy non-N finishes may not survive lead-free reflow profiles. Finally, the Stratix II GX family is in Last Time Buy - do not start new designs on this family without an Intel-approved migration path.
Informations de conformité
Lead-free (Pb-free N suffix) finish; commercial operating temperature per MPN. AEC-Q100 is not applicable because this is a programmable logic IC and no AEC-Q100 automotive qualification is claimed. REACH, halogen-free, and conflict-mineral status were not stated in the verified web data.
