EP3C120F780I7N - Cyclone III FPGA, 119K LEs, 780-FBGA | Intel
Référence : EP3C120F780I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $270.72 | $270,72 |
| 10 | $254.5 | $2 545,00 |
| 100 | $232.1 | $23 210,00 |
| 500 | $215.3 | $107 650,00 |
| 1 000 | $198.45 | $198 450,00 |
EP3C120F780I7N Présentation
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP blocks into a single semiconductor die. FPGAs sit hierarchically between ASICs (custom-designed but expensive and non-reprogrammable) and general-purpose microcontrollers (fixed-architecture, software-driven). Within the Intel FPGA portfolio, the Cyclone III family targets cost-sensitive, power-conscious high-volume applications such as industrial control, video processing, and communications infrastructure, while Stratix parts target high-performance signal processing.
Key features include up to 288 embedded 18×18 multipliers for DSP, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, 4 PLLs per device for clock management, and a wide range of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 'I' speed grade and industrial temperature range (-40 °C to +100 °C) make the EP3C120F780I7N well suited for thermally and electrically harsh environments.
Architecturally, the Cyclone III fabric uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and a perimeter I/O ring with up to 8 I/O banks. Configuration is supported via passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes. Designers can use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure.
Typical applications include industrial motor control, video surveillance image processing, software-defined radio (SDR), prototyping ASIC replacement, and high-speed serial protocol bridging. The 531 user I/O and ~4 Mbit on-chip memory enable large state machines, multi-channel buffering, and parallel DSP pipelines.
When designing with this device, ensure the 780-FBGA PCB layout uses 1.0 mm ball pitch with microvia or via-in-pad technology for reliable assembly. The 65 nm process requires careful decoupling (multiple 0.1 µF + bulk 47 µF per rail) to suppress simultaneous switching noise on the I/O banks. Thermal management must consider the ~6 W typical device dissipation at high toggle rates.
This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and PCB layout guidance not aggregated in a single manufacturer document.
Alternatives de remplacement direct pour EP3C120F780I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C120F780I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Configuration Modes, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C120F780I7
✅ Remplacement direct✓ En stock
$610 / unité
Voir la fiche technique →EP3C120F780C7N
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP3C120F780C8N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP3C120F780C8NAE
✅ Remplacement direct✓ En stock
$162.4 / unité
Voir la fiche technique →EP3C120F780C7NAD
✅ Remplacement direct✓ En stock
$44.79 / unité
Voir la fiche technique →EP3C120F780I7N Valeurs maximales et caractéristiques électriques
| Series | Cyclone III |
| Logic Elements (LEs) | 119,088 |
| Logic Array Blocks (LABs) | 7,443 |
| Embedded Memory Bits | 3,981,312 |
| M9K Memory Blocks | 432 |
| Embedded 18x18 Multipliers | 288 |
| Maximum User I/O Pins | 531 |
| PLLs | 4 |
| Process Technology | 65 nm TSMC low-power |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 472 MHz |
| Boîtier | 780-ball FBGA (F780), 1.0 mm pitch, 23 x 23 mm |
| Température de fonctionnement | -40 °C to +100 °C (Industrial) |
| Speed Grade | I7 (industrial, fast) |
| Configuration Modes | AS, AP, FPP, JTAG |
| Statut RoHS | Compliant |
Configuration des broches de EP3C120F780I7N
| Broche A1 | I/O Bank 8 — User I/O / configuration pin (refer to handbook for exact function) |
| Broche A29 | I/O Bank 8 — User I/O / configuration pin |
| Broche AC1 | I/O Bank 4 — User I/O / configuration pin |
| Broche AC29 | I/O Bank 4 — User I/O / configuration pin |
| Broche AE29 | I/O Bank 2 — User I/O / configuration pin |
| Broche F1 | GND — Ground |
| Broche F29 | GND — Ground |
| Broche AA1 | VCCINT — Core supply (1.2 V) |
| Broche AA29 | VCCIO8 — I/O bank 8 reference voltage |
| Broche AB29 | VCCIO7 — I/O bank 7 reference voltage |
| Broche U29 | VCCA_PLL — PLL analog supply |
| Broche U1 | VCCD_PLL — PLL digital supply |
| Broche AD29 | MSEL0 — Configuration mode select |
| Broche AE1 | MSEL1 — Configuration mode select |
| Broche AE2 | MSEL2 — Configuration mode select |
| Broche AE3 | nCE — Chip enable (active low) |
| Broche AD2 | nCONFIG — Configuration control (active low) |
| Broche AD3 | CONF_DONE — Configuration done status |
| Broche AD4 | nSTATUS — Configuration status (active low) |
| Broche AE4 | TCK — JTAG clock |
Applications typiques
EP3C120F780I7N convient pour 7 applications: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, High-Speed Parallel Protocol Bridging, Automotive Driver Assistance (ADAS) Prototyping, Medical Imaging and Diagnostic Equipment.
Industrial Motor Control
The EP3C120F780I7N fits industrial motor control because it combines 288 dedicated 18×18 multipliers (sufficient for field-oriented-control current loops), 531 user I/Os (enough to drive 3-phase IGBT bridges plus encoder interfaces), and 4 PLLs for multi-axis clocking. With industrial temperature rating (-40 °C to +100 °C) and proven long-lifecycle support, it reliably executes trapezoidal and sinusoidal commutation in conveyor, robotics, and CNC applications. Implementation: control two 3-phase PMSM motors simultaneously at 20 kHz PWM with encoder feedback; power consumption stays under 4 W typical at industrial toggle rates. Compared to a microcontroller + DSP architecture, the FPGA offers sub-microsecond current-loop latency and deterministic interrupt response.
Recommandé
Video Surveillance and Image Processing
The EP3C120F780I7N is well matched to video surveillance because its 3.98 Mbits of M9K embedded memory holds multiple raster-scan line buffers, while 288 18×18 multipliers perform real-time 2D convolution, Sobel edge detection, and motion-compensated noise reduction at 1080p60. The 531 I/Os allow parallel ITU-R BT.656 / Parallel LVDS camera input, HDMI output, and DDR2 frame-buffer memory on the same device. Industrial-grade screening supports outdoor deployment in traffic and perimeter surveillance systems. Integration: decode 4 D1 streams simultaneously, perform H.264 preprocessing at 30 fps/channel, and forward to a host SoC. Compared to a pure ASIC pipeline, the FPGA allows late-stage algorithm changes for new analytic features.
Recommandé
Software-Defined Radio (SDR) Baseband
The EP3C120F780I7N suits SDR baseband processing because its 288 hardware multipliers perform 16-bit complex FFTs and channelization filters, while 4 PLLs synthesize sample clocks for multiple ADC/DAC channels. The 65 nm Cyclone III silicon delivers 472 MHz internal performance—sufficient for LTE 20 MHz channelization, DVB-T demodulation, or narrow-band tactical radios. Industrial temperature range allows deployment in outdoor radio units and military vehicles. Implementation: 64-tap polyphase filter bank at 122.88 MHz; total fabric utilization ~60% leaves headroom for forward-error-correction blocks. Compared to DSP processors, the FPGA offers 5-10x higher throughput per watt at comparable clock rates.
Recommandé
ASIC Prototyping and Emulation
The EP3C120F780I7N is frequently used for ASIC prototyping because its 119,088 logic elements can emulate sub-million-gate ASICs with high fidelity, and the 780-ball FBGA exposes sufficient I/O to map ASIC pad-ring signals. Engineers port RTL to Quartus II and run real-world firmware/software against the emulated design before committing to silicon, reducing ASIC respin risk. Quartus Prime supports standard ASIC EDA flows (VCS, ModelSim, Synopsys DC) with HDL co-simulation. Industrial temperature grade is a bonus for prototyping automotive-grade ASICs. Compared to emulation ASICs (e.g., Palladium), the EP3C120F780I7N offers 1-5 MHz emulation speed at 1% of the cost.
Recommandé
High-Speed Parallel Protocol Bridging
The EP3C120F780I7N works well as a parallel-protocol bridge between legacy and modern bus interfaces because its 531 user I/Os support multiple parallel buses (PCI, PCIe soft IP, RapidIO, custom LVDS) simultaneously. With 288 multipliers and 4 PLLs, it can clock-rate-match, encode/decode 8b/10b, and aggregate data without external ASSPs. Industrial temperature grade ensures 24/7 operation in telecom, factory, and transportation chassis. Integration: bridge PCIe Gen1 to 4-channel parallel RapidIO with 200 MHz DDR aggregate throughput; fabric utilization ~50% enables concurrent DMA controllers. Compared to dedicated bridge ASSPs, the FPGA supports late-spec additions without silicon change.
Recommandé
Automotive Driver Assistance (ADAS) Prototyping
The EP3C120F780I7N fits ADAS prototyping because it offers the logic density and DSP resources needed for radar, lidar, and vision sensor fusion while remaining at industrial temperature grade. Its 531 user I/Os accommodate multiple camera serializers (TI FPD-Link, Maxim GMSL) and automotive Ethernet PHYs in parallel; 288 18×18 multipliers execute sensor-fusion DSP pipelines (FFT, CFAR detection, HOG features). The 'I' speed grade and industrial screening meet typical OEM environmental specs. Implementation: 4-camera surround-view preprocessor running at 30 fps with <50 ms end-to-end latency. Compared to a discrete DSP+MCU solution, the FPGA reduces BOM count and accelerates iterative algorithm tuning.
Recommandé
Medical Imaging and Diagnostic Equipment
The EP3C120F780I7N is suitable for medical imaging preprocessing because its embedded memory holds ultrasound line buffers and CT scan slices, and 288 multipliers accelerate beamforming and image-reconstruction kernels. Industrial temperature screening plus long-lifecycle Intel support is critical for medical OEM qualification (IEC 60601-1). Implementation: 64-channel ultrasound beamformer running at 40 MHz with sub-µs latency; 531 I/Os accommodate ADC arrays and LVDS display outputs. Compared to off-the-shelf DSP solutions, the FPGA enables proprietary imaging algorithms that differentiate medical-device products in a regulated market.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C120F780I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C120F780I7 | EP3C120F780C7N | EP3C120F780C8N | EP3C120F780C8NAE |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FBGA (1.0 mm pitch) | 780-ball FBGA (1.0 mm pitch) - same | 780-ball FBGA (1.0 mm pitch) - same | 780-ball FBGA (1.0 mm pitch) - same | 780-ball FBGA (1.0 mm pitch) - same |
| Logic Elements | 119,088 | 119,088 | 119,088 | 119,088 | 119,088 |
| Embedded Memory (bits) | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 |
| 18x18 Multipliers | 288 | 288 | 288 | 288 | 288 |
| Maximum User I/O | 531 | 531 | 531 | 531 | 531 |
| Speed Grade | I7 (industrial-fast) | I7 (industrial-fast) | C7 (commercial-fast) | C8 (commercial-fast) | C8 (commercial, industrial-screened) |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial screened) |
Principaux différenciateurs
- Largest Cyclone III device with 119K logic elements and 531 user I/Os (vs EP3C120F484I7N)
- Industrial temperature range with I7 fast speed grade (vs EP3C120F780C8N)
- Proven long-lifecycle support since 2007 (vs Xilinx Spartan-6 XC6SLX150)
Notes de conception
The 780-ball FBGA at 1.0 mm pitch requires microvia (laser-drilled) PCB technology with via-in-pad plating. Use 0.4 mm outer pad diameter and 0.2 mm via drill; stack-up should be 4-6 layers with 1 oz copper on outer layers. Solder mask-defined (SMD) pads reduce bridging risk versus non-solder mask defined (NSMD). Always follow Intel Cyclone III Hardware Reference Design guidelines for escape routing under the BGA—escape typically requires 2-3 routing layers with the smallest trace-and-space your fab supports.
Estimated: at typical industrial toggle rates (~50% logic activity, 100 MHz), the EP3C120F780I7N dissipates approximately 4-6 W. With θJA around 14 °C/W (still-air, JEDEC test board), junction temperature rise above ambient is roughly 56-84 °C. For sealed enclosures, attach a small heatsink (10 × 10 × 5 mm aluminum) or rely on 4-6 thermal vias beneath the central BGA balls connected to an internal copper pour. Always validate with the PowerPlay Power Analyzer output in Quartus for your specific design utilization.
Common pitfalls with the EP3C120F780I7N: (1) Configuring MSEL pins incorrectly for AS/PS/AP modes—always double-check the configuration mode strap table; (2) Forgetting to enable nCONFIG pull-up to VCCIO of bank 8—causes intermittent configuration failures; (3) Leaving JTAG TCK floating—use 1-10 kΩ pull-down or pull-up per JTAG chain topology; (4) Connecting VCCA_PLL and VCCD_PLL to noisy digital rails—each PLL needs its own filtered analog supply; (5) Exceeding 8 mA per I/O without derating—use soft current-limit settings in Quartus pin planner.
For DDR2 interfaces on the EP3C120F780I7N, enable the dedicated SSTL-18 Class I/II I/O standard and use the ALTMEMPHY megafunction with proper write-deskew calibration. Route DQS differential pairs with 100 Ω differential impedance and match within 25 ps; keep trace length matching for address/command within 50 ps. Reference Intel AN 571: 'Using DDR/DDR2 SDRAM with Cyclone III Devices' for complete timing constraints and pin-out guidelines.
Informations de conformité
RoHS and lead-free compliance per Cyclone III product family declaration. Not AEC-Q100 qualified (industrial grade only). For automotive applications above 0 °C to +85 °C, consider Cyclone III LS automotive variants.
