EP3C40F780C6 - Cyclone III FPGA 39.6K LE 780-BGA | Altera
Référence : EP3C40F780C6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $235.81 | $235,81 |
| 10 | $215.4 | $2 154,00 |
| 100 | $188.65 | $18 865,00 |
| 500 | $162.3 | $81 150,00 |
| 1 000 | $142.1 | $142 100,00 |
EP3C40F780C6 Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device whose logic fabric, routing, and I/O behavior are defined after manufacture through a configuration bitstream. FPGAs sit between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices) in the programmable-logic taxonomy: ASIC > FPGA > CPLD > SPLD > standard logic. Cyclone III is positioned as a low-cost, low-power alternative to Stratix within Altera's portfolio, and is a direct competitor to Xilinx Spartan-6 and Lattice ECP3 families.
Key features include 4 embedded 18x18 hardware multipliers (DSP blocks), up to 4 PLLs per device for clock management, and 396 Kbits of M9K embedded SRAM. The 780-BGA package provides 535 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, with 8 transceiver channels (where present) and dedicated global clock networks. Cyclone III supports configuration through AS, PS, JTAG, and Fast Passive Parallel modes, and integrates the Altera Cyclone III Configuration scheme.
Architecturally, the EP3C40F780C6 uses a logic-element (LE) fabric of 4-input look-up tables (LUTs) and dedicated carry chains, surrounded by a perimeter I/O ring and column-based M9K memory blocks. The four embedded multipliers enable single-clock-cycle 18x18 signed multiplications, while the PLL blocks provide frequency synthesis, phase shifting, and clock deskew. Compared to its predecessor Cyclone II, the Cyclone III family roughly doubles logic density and adds DSP blocks at a lower static power budget.
Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive driver assistance, and low-cost prototyping. The combination of high I/O count and embedded multipliers makes the EP3C40F780C6 well suited for parallel sensor aggregation, custom peripheral bridging, and image preprocessing tasks.
When designing with this device, allocate sufficient PCB area for the 29 mm x 29 mm 780-BGA with 1.0 mm pitch; layer stackup with buried vias and at least 6 layers is recommended to fan out the package. Confirm Quartus II software support for the C6 speed grade before final timing closure.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not consolidated in any single manufacturer or distributor listing.
Alternatives de remplacement direct pour EP3C40F780C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C40F780C6 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Logic Elements, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C40F780C7N
✅ Remplacement direct✓ En stock
$145.4 / unité
Voir la fiche technique →EP3C40F780C8N
✅ Remplacement direct✓ En stock
$64.85 / unité
Voir la fiche technique →EP3C40F780I7
✅ Remplacement direct✓ En stock
$52.4 / unité
Voir la fiche technique →EP3C120F780C7N
✅ Remplacement direct✓ En stock
$162 / unité
Voir la fiche technique →EP3C120F780C8N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP3C40F780C6 Valeurs maximales et caractéristiques électriques
| Series | Cyclone III |
| Family | Cyclone III |
| Logic Elements | 39,600 |
| Embedded Memory (bits) | 1,161,216 |
| Number of User I/Os | 535 |
| Number of LABs/CLBs | 2475 |
| Number of Logic Elements | 39600 |
| Total RAM Bits | 1161216 |
| Boîtier | 780-BGA (FineLine) |
| Nombre de broches | 780 |
| Speed Grade | C6 |
| Tension d'alimentation de fonctionnement | 1.2 V core, 3.3 V I/O |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial) |
| Process Technology | 60 nm low-power |
| Embedded Multipliers (18x18) | 4 (DSP blocks) |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Configuration Modes | AS, PS, JTAG, FPP |
| Statut RoHS | Compliant (leaded BGA) |
Guide de configuration des broches du EP3C40F780C6 780-bga (fineline)
Configuration des broches du EP3C40F780C6 (boîtier 780-bga (fineline)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C40F780C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C40F780C6 convient pour 6 applications: Industrial Motor Control (3-Phase FOC), Video Processing & Image Preprocessing, Telecom Line Cards & Custom Protocol Bridging, Automotive Driver Assistance (Pre-Production Prototyping), Test & Measurement Instrumentation Front-End, Industrial I/O Aggregation & Protocol Conversion.
Industrial Motor Control (3-Phase FOC)
The EP3C40F780C6 is an excellent fit for multi-axis industrial motor controllers using field-oriented control (FOC). Its 4 dedicated hardware 18x18 multipliers execute the Park/Clarke transforms and PI loops in single-clock cycles, while the 4 PLLs generate phase-shifted PWM carriers for synchronized inverter switching. With 535 user I/Os, a single EP3C40 can interface to three encoder inputs, six PWM outputs, multiple Hall sensors, and an external Ethernet or CAN stack. The 0-85C commercial temperature range suits cabinet-mounted industrial drives where ambient is well controlled. Compared to a microcontroller + FPGA split, integrating control logic on the FPGA reduces latency to sub-microsecond and simplifies multi-axis synchronization.
Recommandé
Video Processing & Image Preprocessing
The EP3C40F780C6 supports mid-resolution video pipelines such as 1080p60 video scaling, color space conversion, and simple edge detection. Its 1,161,216 bits of M9K embedded memory buffer multiple scan lines in on-chip SRAM, avoiding external DDR2 for short bursts. The 4 hardware multipliers and 250-300 MHz fabric Fmax deliver ~2.4 GMACs of DSP throughput, sufficient for 3x3 or 5x5 spatial filtering on progressive video. The 535 I/Os support BT.656, BT.1120, LVDS, and HDMI-style interfaces through external PHY. Designers use the EP3C40 to replace discrete ASSPs in industrial cameras and medical imaging front-ends where flexibility matters more than absolute cost.
Recommandé
Telecom Line Cards & Custom Protocol Bridging
The EP3C40F780C6 is widely used in telecom and networking line cards for custom protocol bridging between SERDES, TDM buses, and backplane fabrics. Its 4 PLLs and 20 global clock networks handle gapped clock recovery and per-channel jitter cleaning. With 535 I/Os, designers can aggregate 8-12 SERDES lanes through FPGA-side logic plus connect to external PHYs, T1/E1 framers, or switch fabrics. The Cyclone III family's low static power (~80 mW) keeps per-card power budget manageable in high-density chassis. The 780-BGA footprint is also the standard package for mid-density line cards in legacy ATCA and MicroTCA systems.
Recommandé
Automotive Driver Assistance (Pre-Production Prototyping)
The EP3C40F780C6 supports automotive ADAS prototyping for rear-view camera processing, surround-view stitching, and sensor fusion pre-processing. While the EP3C40 family is not AEC-Q100 qualified, the commercial 0-85C range is acceptable for in-cabin and bench development. Designers use the 4 multipliers for fast block matching in stereo vision, and the 1,161,216 bit memory for line buffers and lookup tables. For production automotive designs, migrate to Cyclone V or Cyclone IV GX automotive variants. The 780-BGA package suits densely populated ECU PCBs common in ADAS compute platforms.
Recommandé
Test & Measurement Instrumentation Front-End
The EP3C40F780C6 powers mid-range benchtop test and measurement instruments where custom triggering, timing, and DSP preprocessing are needed. Its 4 hardware multipliers implement FIR filters, FFT butterflies, and correlation functions directly in fabric, while the 4 PLLs provide coherent clocking for ADC/DAC sample rates. The 535 I/Os interface to parallel ADCs, DACs, and LVDS data capture buses. The Cyclone III family's design security bitstream encryption protects IP in production instruments. Compared to a DSP + CPLD split, a single EP3C40 integrates the trigger, processing, and backhaul interface in one device, simplifying BOM and reducing latency.
Recommandé
Industrial I/O Aggregation & Protocol Conversion
The EP3C40F780C6 is ideal for industrial I/O aggregation modules that must bridge legacy fieldbus (Profibus, Modbus, DeviceNet) to Ethernet/IP or PROFINET. The high 535 I/O count supports dozens of isolated digital I/O channels plus dedicated SPI, I2C, UART, and CAN interfaces, all protocol-decoded in FPGA fabric. The 1,161,216 bit memory buffers messages and protocol stacks, while the 4 PLLs generate any baud rate or sampling clock. The 780-BGA footprint allows dense PCB layout for DIN-rail I/O blocks. Compared to dedicated protocol ASICs, the FPGA approach supports multiple protocols in one hardware platform, reducing SKU count for industrial gateway products.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C40F780C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C40F780C7N | EP3C40F780C8N | EP3C40F780I7 | EP3C120F780C7N | EP3C120F780C8N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BGA FineLine | 780-BGA FineLine | 780-BGA FineLine | 780-BGA FineLine | 780-BGA FineLine | 780-BGA FineLine |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 119,088 | 119,088 |
| Speed Grade | C6 | C7 | C8 | I7 | C7 | C8 |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 3,888,000 | 3,888,000 |
| User I/Os | 535 | 535 | 535 | 535 | 531 | 531 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Embedded 18x18 Multipliers | 4 | 4 | 4 | 4 | 4 | 4 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| RoHS | Compliant (leaded BGA) | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Highest-density Cyclone III in the mid-range speed grade (vs EP3C25F324C8N)
- Faster speed grade than the standard C8N alternative (vs EP3C40F780C8N)
- Lower static power than competing Xilinx Spartan-6 in same density class (vs XC6SLX45-3FGG484C (Xilinx))
- Pin-compatible with higher-density EP3C120 for design migration (vs EP3C120F780C7N)
Notes de conception
The 780-FineLine BGA uses a 1.0 mm ball pitch and 29 mm x 29 mm body. A minimum 6-layer PCB stackup with buried/blind vias is recommended to fan out the inner rows. Use a 4-6 mil via-in-pad with filled and plated-over copper cap for any signal via used as a BGA escape; this enables flip-chip-style fanout and reliable reflow. Maintain a continuous ground plane under the BGA and stitch vias every 2-3 balls around the perimeter for low-inductance return paths. Estimated: with 1 oz copper outer layers, a 6-layer stackup of 1.4 mm total thickness should yield < 0.5 dB insertion loss up to 3 GHz on the longest matched-length pair.
Cyclone III core voltage is 1.2 V (VCCINT) with 2.5 V (VCCAUX) and 3.3 V (VCCIO) supplies required. Use a low-noise LDO for VCCINT and a switching regulator for VCCIO to balance efficiency and noise. Decouple each VCCINT pin with one 0.1 uF X7R + one 10 uF bulk per power-rail island, placed within 100 mil of the pin. Estimated: at 80 mA typical static current, the VCCINT rail dissipates ~96 mW. Keep VCCAUX and VCCPLL analog planes isolated from noisy digital planes; this avoids jitter coupling into the PLL blocks that drive the global clock network.
Match PCLK and DQS traces within +/-25 mil for DDR/DDR2 interfaces. Use 50 ohm single-ended impedance for LVCMOS 3.3 V, 100 ohm differential for LVDS. Assign clock I/O pins in dedicated clock-input regions (CLK[0..15] pins) and route them on the top layer with no via transitions. For multi-clock-domain designs, place PLL blocks near the I/O bank they drive to minimize PCLK skew. Estimated: a 0.5 mm via adds ~0.5 nH inductance; limit 4+ via transitions on any global clock net to keep jitter below 100 ps peak-to-peak.
Do not use Cyclone III configuration pins (nCONFIG, nSTATUS, CONF_DONE) as user I/O without disabling pull-up - they have weak pull-ups that can back-power external devices during board power-up. The MSEL[3..0] pins must be strapped to select the configuration mode; leaving them floating causes configuration failure. The JTAG TCK pin should be AC-coupled to ground through 10 kOhm if unused, to prevent false TCK detection. Estimated: A typical EP3C40 design with 50% utilization draws 250-400 mW at 100 MHz; if quiescent power is critical, choose a C8L speed grade instead of C6.
Informations de conformité
RoHS compliant per Altera product page; F-designator indicates leaded BGA balls (Pb-free but uses lead-containing solder balls per RoHS exemption). Not AEC-Q100 qualified - for automotive production, migrate to Cyclone IV GX automotive or Cyclone V E automotive. REACH compliance confirmed by Altera material declaration.
