EP3C5F256A7N - Cyclone III FPGA, 5136 LE, 256-FBGA | Intel / Altera
Référence : EP3C5F256A7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.8 | $3 180,00 |
| 500 | $27.95 | $13 975,00 |
| 1 000 | $24.4 | $24 400,00 |
EP3C5F256A7N Présentation
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that lets engineers implement arbitrary digital logic — from simple glue logic to complete processor cores — through a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices -> programmable logic ICs -> digital ICs -> semiconductors. Unlike ASICs, FPGAs are post-fabrication reprogrammable, enabling rapid prototyping, in-field upgrades, and design error recovery. Cyclone III FPGAs specifically target the low-power, low-density end of the FPGA market.
Key features of the EP3C5F256A7N include 321 logic array blocks (LABs), up to 23 embedded 18 × 18 multipliers suitable for DSP operations, embedded M9K memory blocks totaling 423,936 RAM bits, and dedicated global clock networks. The device also includes a hard memory controller, support for external DDR/DDR2 memories, and multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL) on most user pins. Configuration can be performed via JTAG, Active Serial (AS), or Passive Serial (PS) modes using commodity flash memory.
Architecturally, Cyclone III devices use a four-input look-up table (LUT) based logic fabric combined with dedicated routing, variable-sized embedded memory, and hard multipliers. The 65 nm low-power process allows static and dynamic power consumption to be considerably lower than prior Cyclone generations, making the family suitable for thermally constrained enclosures. The device supports hot-socketing and I/O pre-emphasis features that simplify board bring-up.
Typical applications include automotive driver-assistance interfaces, industrial machine control, low-cost video processing pipelines, motor drive peripherals, and protocol bridging (I2C/SPI/UART/Ethernet) on factory automation buses. The 256-ball FBGA package exposes enough I/O and memory bandwidth to host a soft Nios II processor plus several custom peripherals in a single device.
When designing with this FPGA, allocate at least one configuration mode (typically AS with a serial flash) and provide proper decoupling per the device family datasheet. Thermal dissipation remains modest thanks to the 65 nm low-power process, but designers should still observe the recommended PCB footprint, ball-to-trace via pattern, and keep critical clock traces matched. Verify JTAG chain ordering if multiple devices share the bus.
This page synthesizes distributor stock, parametric alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP3C5F256A7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C5F256A7N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, RoHS Status, Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C10F256I7N
✅ Remplacement direct✓ En stock
$34.94 / unité
Voir la fiche technique →EP3C10F256C8N
✅ Remplacement direct✓ En stock
$15.4 / unité
Voir la fiche technique →EP3C16F256I7N
✅ Remplacement direct✓ En stock
$38.5 / unité
Voir la fiche technique →EP3C25F256I7N
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →EP3C10F256C6N
✅ Remplacement direct✓ En stock
$14.1 / unité
Voir la fiche technique →EP3C5F256A7N Valeurs maximales et caractéristiques électriques
| Series | Cyclone III |
| Family | Cyclone III |
| Logic Elements | 5,136 |
| Logic Array Blocks (LABs) | 321 |
| Total RAM Bits | 423,936 |
| Embedded Multipliers (18x18) | 23 |
| User I/O Count | 182 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| Boîtier | 256-FBGA (17 x 17 mm) |
| Température de fonctionnement | -40 °C to +125 °C (automotive grade) |
| Automotive Qualification | AEC-Q100 |
| Configuration Modes | AS, PS, JTAG |
| Statut RoHS | Compliant (LEAD FREE) |
Guide de configuration des broches du EP3C5F256A7N 256-fbga (17 x 17 mm)
Configuration des broches du EP3C5F256A7N (boîtier 256-fbga (17 x 17 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C5F256A7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C5F256A7N convient pour 6 applications: Automotive Driver-Assistance ECU, Industrial Machine Control, Low-Cost Video Processing, Motor Drive Peripheral Controller, Protocol Bridge and Industrial Networking, Portable Test and Measurement Equipment.
Automotive Driver-Assistance ECU
The EP3C5F256A7N is well matched to compact automotive ADAS ECUs that need AEC-Q100 qualification and modest logic capacity. The 5,136 LEs host sensor-fusion glue logic, CAN/LIN bridge functions, and a soft Nios II controller for diagnostics, while 182 user I/O accept multiple camera and radar interfaces. AEC-Q100 qualification across -40 C to +125 C and the 65 nm low-power process keep junction temperatures manageable in sealed enclosures. Compared with discrete microcontrollers, the FPGA's parallel I/O structure reduces latency for time-critical sensor preprocessing.
Recommandé
Industrial Machine Control
In factory automation, the EP3C5F256A7N serves as a programmable logic controller (PLC) co-processor that handles fast I/O scanning, quadrature encoder counting, and EtherCAT or PROFINET protocol bridging. The 23 embedded 18x18 multipliers accelerate field-oriented control (FOC) math for multi-axis servo drives, and the 423,936 RAM bits buffer trajectory tables and look-up tables. Industrial -40 C to +125 C operation permits placement near motors and high-EMI switching devices without thermal derating. Compared to a fixed-function MCU, the FPGA's parallel architecture reduces interrupt latency in deterministic motion loops.
Recommandé
Low-Cost Video Processing
The EP3C5F256A7N handles entry-level video bridging tasks such as BT.656 to LVDS conversion, frame-rate conversion, and on-screen display overlay in surveillance and infotainment systems. The 23 hardware multipliers implement 3x3 or 5x5 filter kernels in real time at standard-definition rates, and 423,936 RAM bits double as line buffers. With 182 user I/O exposed through the FBGA-256 package, designers can simultaneously accept parallel video inputs and drive parallel TFT panels. Power consumption stays modest thanks to the 65 nm low-power process, enabling fanless enclosures.
Recommandé
Motor Drive Peripheral Controller
The EP3C5F256A7N integrates field-oriented control (FOC) math, PWM generation, and protection logic for variable-frequency drives up to a few kilowatts. The 23 embedded 18x18 multipliers compute Park/Clarke transforms and PI loops in microseconds, while 182 I/O manage multiple shunt current sensors, encoders, and gate-driver interfaces. Industrial -40 C to +125 C operation permits co-location with power-stage heatsinks. The 1.2 V core at 65 nm keeps quiescent draw low, important for battery-backed standby operation. Compared to a DSP+MCU pair, the FPGA unifies control and housekeeping on one die.
Recommandé
Protocol Bridge and Industrial Networking
The EP3C5F256A7N provides a flexible platform for industrial protocol conversion between CAN, LIN, RS-485, RS-232, I2C, SPI, and Ethernet in legacy-to-modern factory retrofit projects. The 182 user I/O easily host several independent serial channels, and the 423,936 RAM bits provide buffering for packet reassembly. The FBGA-256 footprint simplifies board layout when the bridge sits between multiple bus connectors on the same PCB. Industrial temperature grade and AEC-Q100 qualification permit use in both factory-floor and vehicle-mounted equipment.
Recommandé
Portable Test and Measurement Equipment
The EP3C5F256A7N powers portable logic analyzers, protocol exercisers, and handheld oscilloscope front-ends where low power and small PCB area are critical. The 65 nm process keeps battery draw low, while 5,136 LEs are sufficient to implement deep FIFO memories, trigger logic, and DSP filtering on a single device. The automotive -40 C to +125 C temperature grade allows the same hardware to be used in field-deployed monitoring equipment that experiences wide thermal swings. The FBGA-256 package supports dense I/O connections to high-bandwidth ADCs and DACs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C5F256A7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C10F256I7N | EP3C10F256C8N | EP3C16F256I7N | EP3C25F256I7N | EP3C10F256C6N |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 256-FBGA (17 x 17 mm) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 5,136 | 10,320 | 10,320 | 15,408 | 24,624 | 10,320 |
| Embedded RAM (bits) | 423,936 | 423,936 | 423,936 | 516,096 | 608,256 | 423,936 |
| Embedded Multipliers (18x18) | 23 | 23 | 23 | 56 | 66 | 23 |
| User I/O Count | 182 | 182 | 182 | 182 | 182 | 182 |
| Operating Temperature | -40 C to +125 C (automotive) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| Automotive Qualification | AEC-Q100 | No (industrial) | No (commercial) | No (industrial) | No (industrial) | No (commercial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Smallest AEC-Q100 Cyclone III density step (vs EP3C10F256I7N)
- Automotive temperature range with same FBGA-256 footprint (vs EP3C10F256C8N)
- Cost-optimized logic capacity (vs EP3C25F256I7N)
Notes de conception
The EP3C5F256A7N operates from a 1.2 V core supply; provide a low-noise LDO or DC-DC regulator capable of supplying up to 1 A transient current during configuration. Decouple the core with 100 nF ceramic capacitors placed within 5 mm of each VCCINT ball and add bulk 47 uF tantalum or polymer capacitors on the supply rail. Estimated: at 100% LE utilization the part can draw up to ~800 mA peak from VCCINT during global clock toggling - check the Cyclone III power estimator before finalizing the power tree.
The 256-ball FBGA (1.0 mm pitch) requires microvia or laser-drilled via-in-pad PCB technology for reliable assembly. Use 4-layer or 6-layer stack-up with continuous reference planes under the BGA to control characteristic impedance of LVDS and SSTL interfaces. Estimated: keep all signal trace lengths below 25 mm for DDR interfaces to remain within the device's setup/hold window; route matched clock pairs within 0.13 mm length tolerance. Include a JTAG header on every board for board-level testability.
Do not confuse the EP3C5F256A7N (5K LEs, automotive) with the EP3C5F256I7N (5K LEs, industrial); the A vs I grade prefix determines AEC-Q100 qualification. Configuration mode pins MSEL[3..0] must be set per the Cyclone III device datasheet for the chosen boot source (AS = 010, PS = 00, JTAG = 101). Pull nCONFIG high with a 10 kohm resistor and add a 1 nF cap to GND for clean power-on configuration. Confirm the bitstream size fits in the chosen serial flash before finalizing BOM.
Although the 65 nm low-power process keeps junction temperatures moderate, the FBGA-256 package still requires thermal vias under the central ball array for heat extraction. Estimated: under continuous toggling at 85% utilization, junction-to-ambient thermal resistance theta_JA on a 4-layer JEDEC test board is approximately 15 C/W - at +85 C ambient this implies ~15 C temperature rise. For sealed automotive enclosures, derive a custom thermal model and consider copper coin or heatsink attachment.
Informations de conformité
RoHS-compliant lead-free FBGA-256 package; AEC-Q100 qualified per automotive 'A7' grade designation. REACH SVHC declaration available in manufacturer's material composition datasheet. Halogen-free status not explicitly confirmed in distributor listings.
