EP3C25F256I7N - Cyclone III FPGA 24,624 LEs | 256-FBGA | Intel
Référence : EP3C25F256I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3 400,00 |
| 500 | $30.6 | $15 300,00 |
| 1 000 | $27.2 | $27 200,00 |
EP3C25F256I7N Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines the integration density of an ASIC with the design flexibility of in-system reconfiguration. FPGAs sit hierarchically under programmable logic, alongside CPLDs, and are widely used as the central logic platform in digital systems where high I/O count, parallel DSP performance, or rapid prototyping are required. The Cyclone III family was specifically engineered to deliver ASIC-class functionality at ASIC-like cost, targeting volume production in cost-sensitive applications.
Key features of the EP3C25F256I7N include support for up to four general-purpose PLLs for clock management, 66 dedicated 18x18 multipliers for DSP acceleration, support for DDR/DDR2/QDRII/QDRII+ external memory interfaces, and hot-socketing capability that allows board-level in-system programming. The 256-FBGA package supports high-density board layouts while remaining surface-mountable with standard reflow profiles. The device is offered in the industrial temperature grade (-40C to +125C) and is lead-free / RoHS compliant per the F suffix and 7N ordering code convention.
Architecturally, the EP3C25F256I7N uses a look-up-table (LUT)-based logic fabric combined with block RAM (M4K/M9K) tiles, multiplier blocks, and global/regional clock networks. The 65 nm process and 1.2 V core voltage deliver static and dynamic power consumption suitable for thermally-constrained embedded systems, while maintaining ample logic density for medium-complexity designs such as motor control, video bridging, industrial protocol conversion, and software-defined radio front-ends.
Typical applications include industrial motor drives and PLCs, video surveillance and image processing, automotive infotainment and driver-assistance subsystems, telecommunication line cards, low-cost software-defined radio, and portable medical instrumentation. The 256-FBGA footprint makes the EP3C25F256I7N particularly well suited to mid-density logic replacement designs where migrating from an older Cyclone II or Spartan-3 generation device is required.
When designing with this part, verify the Quartus II design software support level for the EP3C25F256I7N speed grade 7 (faster commercial, industrial temperature). Pay close attention to the 1.2 V core / 2.5 V/3.3 V auxiliary supply sequencing requirement and the multi-voltage I/O bank configuration when mixing LVTTL, LVCMOS, and SSTL signalling. Decoupling follows the Quartus II Cyclone III handbook reference design: 0.1 uF and 0.01 uF ceramic capacitors within 100 mils of every VCC pin.
This page synthesizes distributor stock, drop-in same-package alternatives from the Cyclone III family, and Quartus II design considerations not found in the standalone datasheet.
Alternatives de remplacement direct pour EP3C25F256I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C25F256I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, RoHS Status, Configuration Modes.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C25F256I7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C25F256A7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C25F256C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C25F256C8N
✅ Remplacement direct✓ En stock
$38.95 / unité
Voir la fiche technique →EP3C25F256I8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3C25F256I7N Valeurs maximales et caractéristiques électriques
| Device Type | FPGA |
| Family | Cyclone III |
| Logic Elements | 24,624 |
| Embedded Memory | 608,256 bits |
| Embedded Multipliers | 66 (18x18) |
| Maximum User I/O | 156 |
| Core Supply Voltage | 1.2 V |
| Boîtier | 256-FBGA (FineLine BGA) |
| Température de fonctionnement | -40C to +125C |
| Speed Grade | 7 |
| Process Technology | 65 nm low-power |
| PLLs | 4 general-purpose PLLs |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (lead-free) |
| Hot Socketing | Supported |
| Configuration | SRAM-based, in-system programmable |
Guide de configuration des broches du EP3C25F256I7N 256-fbga (fineline bga)
Configuration des broches du EP3C25F256I7N (boîtier 256-fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C25F256I7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C25F256I7N convient pour 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front-End, Telecommunication Line Cards, Portable Medical Instrumentation, Automotive Infotainment and Driver Assistance.
Industrial Motor Control
The EP3C25F256I7N fits industrial motor control because its 66 embedded 18x18 multipliers and 24,624 logic elements can implement field-oriented control (FOC) and space-vector PWM for multi-axis drives in a single device. The 1.2 V core and 65 nm process keep dynamic power low in cabinet-mounted controllers, while the -40C to +125C industrial rating supports harsh factory floors. In a typical topology, the FPGA receives encoder feedback and current-sense ADC data, computes the Park/Clarke transforms, and drives gate signals to the inverter IGBTs. Unlike a fixed-function MCU, the FPGA allows deterministic sub-microsecond control loops and parallel handling of multiple axes, but it requires external ADC and gate-driver front-ends and careful clock-domain management.
Recommandé
Video Surveillance and Image Processing
The EP3C25F256I7N suits video surveillance and image processing because its 608,256 bits of embedded RAM and 66 multipliers support real-time pixel pipelines, scaling, and edge detection at HD resolutions. The 156 user I/O pins allow direct interfacing to CMOS image sensors and DDR2 frame buffers, while the four PLLs generate the multiple clock domains needed for pixel, line, and memory clocks. In a typical design, the FPGA captures sensor data, performs Bayer demosaic and gamma correction in hardware, and streams compressed frames to a host processor. The trade-off versus an ASIC or SoC is higher static power and unit cost, but the FPGA offers field-upgradable image pipelines and faster time-to-market for evolving surveillance algorithms.
Recommandé
Software-Defined Radio Front-End
The EP3C25F256I7N is used in low-cost software-defined radio front-ends because its 66 embedded 18x18 multipliers deliver the DSP throughput needed for digital down-conversion, FIR filtering, and decimation, while the 24,624 logic elements implement control and interface logic. The 1.2 V core keeps power manageable in portable SDR platforms, and the 156 user I/O pins can connect to high-speed ADCs and DACs. In a typical topology, the FPGA mixes the digitized IF to baseband, applies channelization filters, and forwards I/Q samples to a host over USB or Ethernet. The trade-off versus a dedicated DSP is design complexity, but the FPGA provides parallel channel processing and reconfigurable modulation schemes not possible with fixed-function silicon.
Recommandé
Telecommunication Line Cards
The EP3C25F256I7N fits telecommunication line cards because its 156 user I/O and support for DDR/DDR2/QDRII memory interfaces enable packet buffering, framing, and protocol conversion at line rate. The 24,624 logic elements can implement multiple HDLC or Ethernet MAC channels in parallel, while the four PLLs recover and generate the line-card clock domains. In a typical design, the FPGA terminates the backplane interface, performs queue management, and forwards traffic to the switch fabric. The trade-off versus a dedicated network processor is higher development effort, but the FPGA offers protocol flexibility and field upgrades that fixed ASSPs cannot match, making it attractive for multi-service access platforms.
Recommandé
Portable Medical Instrumentation
The EP3C25F256I7N is well suited to portable medical instrumentation because its 1.2 V core and 65 nm low-power process extend battery life, while the 24,624 logic elements and 66 multipliers handle real-time signal processing for ECG, ultrasound, or patient-monitoring front-ends. The 156 user I/O pins interface to ADCs, displays, and wireless modules, and the industrial temperature range supports clinical environments. In a typical design, the FPGA filters and decimates biosensor data, detects arrhythmia events, and drives a local display. The trade-off versus a medical-grade ASIC is higher power and cost, but the FPGA enables rapid algorithm iteration and regulatory re-certification through firmware updates rather than silicon respins.
Recommandé
Automotive Infotainment and Driver Assistance
The EP3C25F256I7N supports automotive infotainment and driver-assistance subsystems because its 24,624 logic elements and 66 multipliers can implement video scaling, graphics overlay, and sensor fusion for camera-based ADAS. The 156 user I/O pins connect to LVDS cameras and display panels, and the 256-FBGA package withstands automotive thermal cycling. In a typical design, the FPGA aggregates multiple camera streams, performs distortion correction, and overlays lane-departure warnings onto the display output. The trade-off versus an automotive SoC is higher board area and power, but the FPGA provides deterministic latency and parallel processing that general-purpose SoCs struggle to guarantee, which is critical for safety-related vision pipelines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C25F256I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C25F256I7 | EP3C25F256A7N | EP3C25F256C7N | EP3C25F256C8N | EP3C25F256I8N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Maximum User I/O | 156 | 156 | 156 | 156 | 156 | 156 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C (automotive) | 0C to +85C | 0C to +85C | -40C to +125C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 | 8 |
| Lead-Free / RoHS | Yes (N suffix) | No | Yes | Yes | Yes | Yes |
| Automotive Qualification | No | No | Yes (AEC-Q100) | No | No | No |
Principaux différenciateurs
- Lead-free RoHS-compliant construction (vs EP3C25F256I7)
- Industrial temperature range (vs EP3C25F256C7N)
- Speed grade 7 timing performance (vs EP3C25F256I8N)
- Non-automotive cost advantage (vs EP3C25F256A7N)
Notes de conception
The EP3C25F256I7N requires a 1.2 V core supply plus 2.5 V and/or 3.3 V I/O bank supplies. Follow the Cyclone III power-up sequencing requirement: core (1.2 V) should ramp before or simultaneously with I/O supplies to avoid excessive current draw. Use a dedicated low-noise regulator for the 1.2 V rail and place 0.1 uF and 0.01 uF ceramic decoupling capacitors within 100 mils of every VCC pin, per the Quartus II Cyclone III handbook reference design.
The 256-FBGA package requires a carefully designed land pattern with via-in-pad or dog-bone fanout. Use at least a 6-layer PCB with dedicated power and ground planes to control impedance on the DDR/DDR2 memory interface traces. Keep high-speed differential pairs length-matched within 5 mils and route them over an uninterrupted ground plane. Thermal relief is not required for this low-power device, but adequate copper pour under the package helps distribute heat.
A common pitfall is using an unsupported Quartus II version for the EP3C25F256I7N. Cyclone III devices are supported in Quartus II versions up to 13.1; newer Quartus Prime releases dropped Cyclone III support. Verify your toolchain before starting a design. Also confirm the configuration scheme (active serial, passive serial, or JTAG) and that the configuration flash device is compatible with the 1.2 V core and 2.5 V/3.3 V configuration I/O.
Informations de conformité
The 'N' suffix in EP3C25F256I7N indicates lead-free, RoHS-compliant construction. AEC-Q100 qualification is not applicable to this industrial-grade part; choose EP3C25F256A7N for automotive qualification.
