EP3SL340H1152C4L - 340K LE Stratix III L FPGA, 1152-BGA | Altera
Référence : EP3SL340H1152C4L ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4850 | $4 850,00 |
| 10 | $4520 | $45 200,00 |
| 100 | $4150 | $415 000,00 |
| 500 | $3800 | $1 900 000,00 |
| 1 000 | $3500 | $3 500 000,00 |
EP3SL340H1152C4L Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated silicon features such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under Programmable Logic -> Logic ICs -> Integrated Circuits. Stratix III L parts specifically target applications requiring high logic capacity at reduced static power compared to the standard Stratix III family.
Key features of the EP3SL340H1152C4L include 337,500 logic elements, 18,822,144 bits of embedded memory (approximately 2,352 Kbit block RAM equivalent), 744 maximum user I/O pins, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports core voltages of 1.1 V and I/O voltages programmable per bank. It is rated for commercial temperature operation (0 to 85 C) and ships in the L-suffix speed grade (lower-power speed bin).
Architecturally, the Stratix III L family uses Altera's adaptive logic module (ALM) and 9-Kbit M512/M-RAM blocks. It integrates dedicated hardware multipliers, PLLs, and high-speed transceivers in some variants, with a flexible I/O structure that supports differential signaling up to 1.6 Gbps. The 1152-BGA package exposes the full feature set of the die, including numerous high-speed serial interfaces and external memory controller pins.
Typical applications include high-end ASIC prototyping, software-defined radio (SDR) baseband processing, high-performance computing (HPC) acceleration, military/aerospace signal processing, broadcast video infrastructure, and telecom line cards. The combination of large logic capacity and abundant memory bandwidth makes it suitable for memory-intensive designs such as deep packet inspection and real-time video transcoding.
When designing with the EP3SL340H1152C4L, careful attention must be paid to power delivery (multiple VCC and VCCINT rails), high-speed signal integrity for LVDS pairs, and thermal management given the 1152-ball BGA package density. Quartus II (or Intel Quartus Prime) is required for synthesis, place-and-route, and timing closure. Designers should consult the Stratix III Device Handbook for full pinout, electrical characteristics, and reference design guidance.
This page synthesizes distributor pricing, Stratix III family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet alone, giving engineers a one-stop reference for both new designs and legacy system maintenance.
Alternatives de remplacement direct pour EP3SL340H1152C4L — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL340H1152C4L (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Core Voltage, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL340H1152C4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$11000 / unité
Voir la fiche technique →EP3SL340H1152C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1895 / unité
Voir la fiche technique →EP3SL340H1152C3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2550 / unité
Voir la fiche technique →EP3SL340H1152C2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3400 / unité
Voir la fiche technique →EP3SL340H1152C2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15800 / unité
Voir la fiche technique →EP3SL340F1760I4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1590 / unité
Voir la fiche technique →EP3SL340H1152C4L Valeurs maximales et caractéristiques électriques
| Series | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory Bits | 18,822,144 |
| Maximum User I/O | 744 |
| Embedded 18x18 Multipliers | 384 (per family datasheet) |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Température de fonctionnement | 0 C to +85 C (commercial) |
| Speed Grade | C4L (L-suffix low power) |
| Boîtier | 1152-BBGA, FCBGA (HBGA) |
| Type de montage | Surface Mount (BGA) |
| Configuration Memory | SRAM-based, volatile (needs external config device) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL (per family) |
Guide de configuration des broches du EP3SL340H1152C4L 1152-bbga, fcbga (hbga)
Configuration des broches du EP3SL340H1152C4L (boîtier 1152-bbga, fcbga (hbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL340H1152C4L.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL340H1152C4L convient pour 6 applications: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband, High-Performance Computing (HPC) Acceleration, Broadcast Video Infrastructure, Telecom Line Card Processing, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP3SL340H1152C4L's 337,500 logic elements and 18,822,144 embedded memory bits deliver the capacity required to prototype large ASIC RTL designs before tape-out. With the full Stratix III L family features - including hard memory controllers, PLLs, and 384 18x18 multipliers - engineers can map ASIC netlists 1:1 onto this FPGA and validate timing at near-real-world frequencies up to ~450 MHz. The 1152-BGA package exposes sufficient I/O (744 pins) to break out ASIC balls for verification.
Recommandé
Software-Defined Radio (SDR) Baseband
High-bandwidth SDR baseband processing - LTE, 5G NR PHY layers, and military tactical radios - requires both large logic count and substantial on-chip memory for sample buffering. The EP3SL340H1152C4L's 18.8 Mbit embedded memory enables deep sample-buffer FIFOs without off-chip RAM access bottlenecks. Combined with 384 DSP multipliers, this FPGA can implement 64+ parallel channel estimators in a single device, replacing banks of DSP chips. Quartus II DSP Builder accelerates floating-point to fixed-point mapping.
Recommandé
High-Performance Computing (HPC) Acceleration
The EP3SL340H1152C4L serves as a coprocessor for HPC clusters, accelerating workloads like genomics alignment, financial Monte Carlo simulation, and cryptographic hashing. With 337,500 LEs and 384 18x18 multipliers, a single Stratix III L delivers ~150 GMACs of fixed-point throughput at 400 MHz, fitting between host CPU and PCIe endpoint. OpenCL support via Altera SDK for OpenCL allows C/C++ kernel offload without RTL design, shortening time-to-deployment.
Recommandé
Broadcast Video Infrastructure
Studio-grade video routers, format converters, and contribution encoders require real-time processing of uncompressed 3G-SDI and 4K/UHD streams. The EP3SL340H1152C4L's 744 user I/O pins can support dozens of LVDS pairs for parallel SDI interfaces, while its block RAM stores multiple frames of chroma data for deinterlacing and scaling. Its low-power Stratix III L variant suits 1RU rack-mount chassis where thermal headroom is constrained.
Recommandé
Telecom Line Card Processing
Multi-100G telecom line cards use the EP3SL340H1152C4L for deep packet inspection, traffic classification, and protocol offload. The FPGA's high logic density implements deep TCAM-equivalent lookup tables using block RAM and LUT-based comparators, while LVDS I/O banks handle multiple 10G Ethernet SFI interfaces. Telecom OEMs chose this part because its low-power L variant reduces cooling costs across high-density central-office chassis.
Recommandé
Military and Aerospace Signal Processing
Defense and aerospace systems - radar, electronic warfare, and satellite baseband - use the EP3SL340H1152C4L for real-time DSP under commercial temperature grades with MIL-STD-810 shock/vibration screening. While this specific part is commercial-grade (0 to 85 C), the same die is available in industrial and military grades as EP3SL340H1152I4N and similar variants. High logic capacity enables single-chip replacement of multi-board DSP farms, reducing SWaP-C in platform designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL340H1152C4L — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL340H1152C4 | EP3SL340H1152C3N | EP3SL340H1152C3 | EP3SL340H1152C2N | EP3SL340H1152C2 |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits | 18,822,144 bits |
| Speed Grade | C4L (low power) | C4 (standard power) | C3 (slower), lead-free | C3 (slower) | C2 (slowest), lead-free | C2 (slowest) |
| Temperature Grade | Commercial (0 to 85 C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest logic capacity in Stratix III L family (vs EP3SL200H780C4N)
- L-suffix low-power variant for thermal-constrained chassis (vs EP3SL340H1152C4 (standard power))
- 1152-BGA package with maximum I/O count of 744 (vs EP3SL340F1760I4N (1760-BGA))
Notes de conception
The EP3SL340H1152C4L requires multiple voltage rails including VCCINT (1.1 V core), VCCIO (per-bank I/O voltage 1.2 V to 3.0 V), VCCAUX (2.5 V auxiliary), VCCPD (3.3 V pre-driver), VCCBAT (battery backup for configuration RAM encryption keys), and VCC_PLL (PLL analog supply). Per Stratix III Device Handbook Chapter 5, each rail must be brought up in a sequenced order (VCCINT before VCCAUX) to prevent latch-up damage. Decoupling requires 100 nF + 10 uF per bank plus bulk capacitors at the regulator outputs. Estimated: at 80 percent utilization, the Stratix III L die dissipates 5 to 8 W; designers should budget 12 W for thermal design to handle worst-case corner scenarios.
The 1152-ball FCBGA package has a 1.0 mm ball pitch requiring high-density PCB fabrication (8-layer minimum, microvia HDI stackup recommended for breakout routing). Power planes should be on dedicated layers with stitched ground returns beneath signal traces; signal breakout should use dog-bone fan-out for outer balls and via-in-pad for inner balls to maintain impedance control on LVDS pairs. Per Stratix III Hardware Design Guidelines, length-match all LVDS pairs within 10 ps for data and within 50 ps for clock-to-data.
Three common pitfalls when designing with the EP3SL340H1152C4L: (1) Failing to instantiate an external configuration memory (EPCS/EPCQ serial flash) - the Stratix III is SRAM-based and loses its configuration on power-down; (2) Driving the JTAG TCK pin with a non-3.3 V signal - this can damage the JTAG I/O cell; (3) Neglecting to assert nCONFIG during power-up sequencing - leave the pin pulled high but do not drive it until VCCINT is stable. Reference: AN 521: Stratix III Design Guidelines and Hardware Design Considerations.
The 1152-FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 6 C/W with a properly designed 12-layer PCB and bottom-side thermal balls soldered to the thermal pad array. Without thermal pad soldering, theta_JA rises above 15 C/W and the device will throttle at high utilization. Estimated: at 8 W total dissipation, junction temperature rises 48 C above ambient with proper thermal design, fitting comfortably within the 85 C commercial limit.
Per Stratix III Pin Connection Guidelines, unused LVDS input pairs must be biased to VCCIO through a 10 kohm resistor network (P-side tied to VCCIO, N-side to GND) to prevent floating-input oscillation. Unused GPIO can be left tri-stated but should be configured as outputs driving low in the Quartus II pin planner to minimize internal pull-up current. Configuration pins (MSEL, nCE, nCEO) require specific pull-up/pull-down values per the device handbook to select the correct configuration scheme (FPP, AS, PS, or JTAG).
Informations de conformité
Compliance status not explicitly stated in the verified web data. The N-suffix variants (e.g., EP3SL340H1152C3N) are lead-free per Altera naming convention, but RoHS/REACH statements should be confirmed from the manufacturer certificate of compliance (CoC) before placing production orders.
