EP4CE10E22I7 - 10,320-Cell FPGA, 91 I/O | Altera
Référence : EP4CE10E22I7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.2776 | $19,28 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
EP4CE10E22I7 Présentation
A field-programmable gate array, or FPGA, is a programmable digital-logic semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacture to implement control logic, interfaces, signal processing, and embedded systems. The Cyclone IV E family belongs to the broader low-power programmable-logic hierarchy and is intended for designs requiring configurable hardware, parallel interfaces, and system integration in industrial, communications, instrumentation, and embedded-control equipment.
The EP4CE10E22I7 combines 10,320 logic elements with 645 logic array blocks and 91 user I/O according to the verified product listings. Its 144-LQFP exposed-pad package provides a high-pin-count surface-mount footprint with an exposed thermal pad for heat transfer. The package dimensions and pitch are reported as 22 mm by 22 mm with 0.50 mm pitch in the cited specification data. The device is identified as a 1.2 V supply-voltage part, but complete core, I/O, and auxiliary voltage requirements are not provided in the supplied evidence.
Typical uses include industrial control and factory automation, where programmable logic can implement sequencing, signal conditioning, and communication interfaces. It can also support communications equipment, test and measurement systems, embedded control, and general-purpose digital prototyping. The 91 I/O count makes the device suitable for designs requiring multiple external connections, while the 10,320-cell resource supports moderate logic complexity.
Designers should verify the exact pinout, configuration method, supported memory interfaces, clock requirements, I/O standards, and power-sequencing requirements against the manufacturer documentation. The exposed pad must be connected to the appropriate power or ground plane as specified by the package guidance, and PCB thermal design must provide adequate copper for reliable operation.
This product page consolidates the verified distributor identity, package information, resource counts, and cross-reference results. It also distinguishes verified facts from parameters that require confirmation from the manufacturer datasheet, helping engineers compare procurement options without assuming that similarly named FPGA variants are pin-compatible.
Alternatives de remplacement direct pour EP4CE10E22I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE10E22I7 (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Package Type, Process Technology, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE10E22I7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE10E22C7N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP4CE10E22C8N
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EP4CE6E22C8
✅ Remplacement direct✓ En stock
$13.65 / unité
Voir la fiche technique →EP4CE10F23C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP4CE10E22I7 Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV E |
| Logic Elements | 10,320 cells |
| Logic Array Blocks | 645 LABs |
| User I/O | 91 I/O |
| Reported Maximum Frequency | 472.5 MHz |
| Tension d'alimentation | 1.2 V |
| Boîtier | 144-LQFP exposed pad |
| Package Pin Count | 144 pins |
| Package Type | EQFP-144 |
| Package Dimensions | 22 mm x 22 mm |
| Package Pitch | 0.50 mm |
| Type de montage | Surface mount |
| Manufacturer | Altera Corporation |
| AEC-Q100 Qualification | not_applicable |
Guide de configuration des broches du EP4CE10E22I7 0.50 mm
Configuration des broches du EP4CE10E22I7 (boîtier 0.50 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CE10E22I7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CE10E22I7 convient pour 6 applications: Industrial Control Logic, Communications Equipment, Test and Measurement, Embedded Control Platform, Data Acquisition and Signal Conditioning, Programmable Logic Education and Prototyping.
Industrial Control Logic
The EP4CE10E22I7 fits industrial control and factory-automation designs that require programmable sequencing, digital decision logic, and multiple external connections. Its 10,320 logic elements and 91 user I/O provide resources for machine-state control, sensor interfaces, actuator sequencing, and communication bridges. The 144-LQFP exposed-pad package supports high-pin-count PCB integration, while the exposed pad provides a defined thermal connection point. Before release, confirm the exact I/O voltage standards, industrial temperature requirement, clocking architecture, and power rails in the Cyclone IV E documentation.
Recommandé
Communications Equipment
The EP4CE10E22I7 is suitable for communications equipment requiring configurable parallel data paths, protocol conversion, and hardware timing control. Its 645 logic array blocks and 91 user I/O can support interface framing, buffering, test-point logic, and control functions around external communications devices. The device is especially useful when a fixed-function device is inflexible and design updates are expected. The supplied data does not confirm transceiver standards, maximum I/O rates, or clocking limits, so those specifications must be checked before selecting board-level PHY components.
Recommandé
Test and Measurement
For test and measurement systems, the EP4CE10E22I7 can implement acquisition control, trigger logic, pattern generation, and instrument-bus coordination in a compact programmable-logic device. The 91 I/O count supports connections to sensors, ADC or DAC interfaces, digital instruments, and status indicators, while the 10,320-cell fabric permits moderate parallel datapaths. Designers should define clock domains and I/O standards before placement, and should verify the exact speed grade and timing constraints in the manufacturer documentation because the supplied snippets do not establish a complete timing table.
Recommandé
Embedded Control Platform
The EP4CE10E22I7 can serve as the programmable control core in an embedded system that coordinates sensors, memory, converters, and external actuators. Its FPGA fabric allows control architecture changes without a PCB respin, and its 91 I/O provides a broad interface surface for digital signals. The 144-LQFP exposed-pad package is practical for moderate-complexity boards, but the exposed pad and internal core supply require careful power-plane and thermal design. Configuration storage, clock distribution, reset sequencing, and I/O voltage selection must be reviewed in the design tool and datasheet.
Recommandé
Data Acquisition and Signal Conditioning
The EP4CE10E22I7 is applicable to data-acquisition front ends where parallel ADC data, digital sensors, calibration tables, and control signals must be coordinated. Its configurable logic can perform digital filtering, decimation control, data packing, trigger management, and interface timing. The 10,320 logic elements provide a larger fabric than a basic programmable counter, while 91 user I/O support multiple data and control lines. Signal integrity, input thresholds, clock jitter, and exposed-pad grounding should be evaluated together rather than treated as independent FPGA issues.
Recommandé
Programmable Logic Education and Prototyping
The EP4CE10E22I7 is useful for FPGA education, logic prototyping, and embedded-system development because it combines a substantial Cyclone IV E fabric with a conventional high-pin-count surface-mount package. Students can implement counters, state machines, interfaces, processors, and peripheral controllers while retaining a direct path to a production-oriented board design. The exposed-pad package teaches important thermal and layout practices, but prototypes must follow the exact manufacturer footprint and power requirements. Development tools and configuration method should be selected before fabrication because those details are not fully covered by the supplied search snippets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE10E22I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE10E22I7N | EP4CE10E22C7N | EP4CE10E22C8N | EP4CE6E22C8 |
|---|---|---|---|---|---|
| Package | 144-LQFP exposed pad | 144-LQFP exposed pad | TQFP-144 | TQFP-144 | TQFP-144 |
| Brand | Altera | Altera | Altera | Altera | Altera |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
Principaux différenciateurs
- 10,320-cell resource level (vs EP4CE6E22C8)
- Verified 91-I/O connectivity (vs EP4CE10E22C7N)
- Explicit 1.2 V reported supply (vs EP4CE10E22C8N)
Notes de conception
Use the exact manufacturer package drawing for the 144-LQFP exposed-pad footprint rather than relying on a generic 144-pin library symbol. The verified data identifies a 22 mm by 22 mm package with 0.50 mm pitch, but the pad, mask, and paste geometry must be taken from the official drawing. Confirm exposed-pad connectivity, solder-mask clearance, and assembly tolerances with the fabricator before releasing artwork.
The exposed pad is an important thermal and electrical feature of this package. Provide a continuous copper connection to the pad and the required plane connection, then use thermal vias where the package and board guidance permits. Estimated thermal performance cannot be calculated from the supplied data because the junction-to-ambient resistance, power dissipation, and ambient conditions are not provided; obtain those values from the manufacturer before sizing copper.
Do not treat EP4CE10E22I7, EP4CE10E22I7N, EP4CE10E22C7N, or EP4CE10E22C8N as interchangeable based only on the shared Cyclone IV E name. Check the complete ordering code, speed grade, temperature grade, pin assignment, supported I/O standards, configuration method, and lifecycle status. The supplied search results support candidate relationships, but do not establish universal drop-in equivalence.
Plan clock, configuration, and high-speed user-I/O routing with the exact timing and I/O requirements from the device documentation. Keep sensitive clock and data paths short, provide continuous reference planes where appropriate, and control crosstalk between high-speed nets. The reported 472.5 MHz figure should not be used as a routing target until its associated speed grade, clock path, and device conditions are confirmed.
Informations de conformité
The supplied web results do not provide verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. Compliance must be confirmed for the exact manufacturer ordering code.
